Patents by Inventor Keiichiro Nakanishi

Keiichiro Nakanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5403783
    Abstract: An electronic device includes an integrated circuit device, the integrated circuit device comprises a first substrate including an integrated electronic semiconductor circuit and a second substrate including a cooling accelerator for accelerating a heat energy exchange between the integrated electronic semiconductor circuit and a cooling fluid, and the second substrate is joined fixedly with the first substrate through a covalent bond formed between the first substrate and the second substrate.
    Type: Grant
    Filed: December 16, 1993
    Date of Patent: April 4, 1995
    Assignee: Hitachi, Ltd.
    Inventors: Keiichiro Nakanishi, Tsuneyo Chiba, Hiroyuki Itoh, Tatsuya Saitoh, Takeshi Kato