Patents by Inventor Keiichirou Kametani

Keiichirou Kametani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8764882
    Abstract: A fluid treatment method reduces a concentration of a first component included in a fluid-to-be-treated. A fluid treatment apparatus reduces a concentration of a first component included in a fluid-to-be-treated. A concentration of a second component differing from the first component is reduced in the fluid-to-be-treated in order to obtain a first fluid. The first fluid passes through at least part of an adsorption unit in order to obtain a second fluid. The adsorption unit is capable of adsorbing both the first component and the second component and has at least an ability to adsorb the first component that is temperature dependent. A third fluid pass through a portion of the adsorption unit through which the first fluid has passed. The third fluid has a concentration of the second component that is lower than in the fluid-to-be-treated and a temperature that is higher than the fluid-to-be-treated.
    Type: Grant
    Filed: May 11, 2010
    Date of Patent: July 1, 2014
    Assignee: Daikin Industries, Ltd.
    Inventors: Keiichirou Kametani, Morimasa Watanabe, Osamu Tanaka
  • Publication number: 20120300359
    Abstract: A current passing device passes current through bodies. The current passing device includes a first current receiving element having an electrical resistance, a second current receiving element having a contact resistance greater than the electrical resistance of the first current receiving element in a state in which the second current receiving element has been brought into direct contact with the first current receiving element without pressing the second current receiving element, a pressing mechanism arranged to press the first current receiving element and the second current receiving element closer together, and an electrically conductive intervening member disposed between the first current receiving element and the second current receiving element. The intervening member has a degree of deformation greater than degrees of deformation of both the first and second current receiving elements in a case where the intervening member has been pressed due to the pressing mechanism.
    Type: Application
    Filed: February 25, 2011
    Publication date: November 29, 2012
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Kiminari Yamashita, Yukihiro Utaka, Aiko Saitou, Yoshinobu Nagano, Keiichirou Kametani
  • Publication number: 20120068119
    Abstract: A fluid treatment method reduces a concentration of a first component included in a fluid-to-be-treated. A fluid treatment apparatus reduces a concentration of a first component included in a fluid-to-be-treated. A concentration of a second component differing from the first component is reduced in the fluid-to-be-treated in order to obtain a first fluid. The first fluid passes through at least part of an adsorption unit in order to obtain a second fluid. The adsorption unit is capable of adsorbing both the first component and the second component and has at least an ability to adsorb the first component that is temperature dependent. A third fluid pass through a portion of the adsorption unit through which the first fluid has passed. The third fluid has a concentration of the second component that is lower than in the fluid-to-be-treated and a temperature that is higher than the fluid-to-be-treated.
    Type: Application
    Filed: May 11, 2010
    Publication date: March 22, 2012
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Keiichirou Kametani, Morimasa Watanabe, Osamu Tanaka
  • Publication number: 20110230331
    Abstract: An adsorbing molded body is configured to be subjected to ohmic heating or electromagnetic wave heating. The adsorbing molded body includes an electrically conductive powder adsorbent, an insulating powder adsorbent, and an inorganic binder that binds the powder adsorbents together. An adsorption recovery treatment apparatus includes the adsorbing molded body and a heating unit to heat the adsorbing molded body, preferably ohmically or using electromagnetic waves. An adsorbate desorbing method includes desorbing an adsorbate, which the adsorbing molded body has adsorbed, from the adsorbing molded body by heating the adsorbing molded body, preferably ohmically or using electromagnetic waves.
    Type: Application
    Filed: October 19, 2009
    Publication date: September 22, 2011
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Kiminari Yamashita, Yukihiro Utaka, Aiko Saitou, Yoshinobu Nagano, Keiichirou Kametani