Patents by Inventor Keiji Koyama

Keiji Koyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9738014
    Abstract: The compact resin molding machine is capable of efficiently performing a sequence of molding actions from feeding a work and resin to accommodating the molded work. The resin molding machine comprises: a work conveying mechanism including a robot, which has a robot hand for holding the work and which is capable of rotating and linearly moving; a work feeding section for feeding the work; a resin feeding section for feeding the resin; a press section including a molding die set, in which the work is resin-molded; a work accommodating section for accommodating the molded work; and a control section controlling the entire resin molding machine. The work feeding section, the resin feeding section, the press section and the work accommodating section are located to enclose a moving area of the robot of the work conveying mechanism.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: August 22, 2017
    Assignee: APIC YAMADA CORPORATION
    Inventors: Tetsuya Maeyama, Hidemichi Kobayashi, Shusaku Tagami, Yoshikazu Muramatsu, Takayuki Yamazaki, Keiji Koyama, Hideaki Nakazawa, Hiroshi Harayama, Kenji Nishizawa, Makoto Kawaguchi, Masahiko Fujisawa, Hidetoshi Oya
  • Patent number: 9425527
    Abstract: Provided is a different-pitch flat cable connection structure for connecting a first flat-cable part that includes a plurality of first conductors arranged in a stripe pattern with a first pitch to a second flat-cable part that includes a plurality of second conductors arranged in a stripe pattern with a second pitch smaller than the first pitch, and establishing electrical continuity between the first conductors and the second conductors. The different-pitch flat cable connection structure includes a connection sheet laminated on one surface side of ends of the first conductors and ends of the second conductors in which at least the one surface side of the ends is exposed.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: August 23, 2016
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Katsunari Mikage, Keiji Koyama
  • Publication number: 20150325937
    Abstract: Provided is a different-pitch flat cable connection structure for connecting a first flat-cable part that includes a plurality of first conductors arranged in a stripe pattern with a first pitch to a second flat-cable part that includes a plurality of second conductors arranged in a stripe pattern with a second pitch smaller than the first pitch, and establishing electrical continuity between the first conductors and the second conductors. The different-pitch flat cable connection structure includes a connection sheet laminated on one surface side of ends of the first conductors and ends of the second conductors in which at least the one surface side of the ends is exposed.
    Type: Application
    Filed: June 23, 2014
    Publication date: November 12, 2015
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Katsunari MIKAGE, Keiji KOYAMA
  • Publication number: 20120135096
    Abstract: The compact resin molding machine is capable of efficiently performing a sequence of molding actions from feeding a work and resin to accommodating the molded work. The resin molding machine comprises: a work conveying mechanism including a robot, which has a robot hand for holding the work and which is capable of rotating and linearly moving; a work feeding section for feeding the work; a resin feeding section for feeding the resin; a press section including a molding die set, in which the work is resin-molded; a work accommodating section for accommodating the molded work; and a control section controlling the entire resin molding machine. The work feeding section, the resin feeding section, the press section and the work accommodating section are located to enclose a moving area of the robot of the work conveying mechanism.
    Type: Application
    Filed: November 23, 2011
    Publication date: May 31, 2012
    Inventors: Tetsuya MAEYAMA, Hidemichi KOBAYASHI, Shusaku TAGAMI, Yoshikazu MURAMATSU, Takayuki YAMAZAKI, Keiji KOYAMA, Hideaki NAKAZAWA, Hiroshi HARAYAMA, Kenji NISHIZAWA, Makoto KAWAGUCHI, Masahiko FUJISAWA, Hidetoshi OYA
  • Patent number: 8061527
    Abstract: A grain classifying device for accurately classifying the grains of uniform length, and an adhesive containing grains classified by the device and capable of connecting electrodes under a low pressure and being applicable to electrodes arranged in fine pitches. The grain classifying device (1) includes a dispersing means (2) for dispersing a plurality of grains (P). A grain orienting means (3) orients each of the dispersed grains in a transfer direction (X) of the grains (P) while spacing the grains apart from one another in the transfer direction (X) of the grains. A grain length measuring means (4) measures the length of each of the grains (P) oriented in the transfer direction (X). A grain separation means (5) separates the grains (P) having a predetermined length based on data related to the lengths of the measured grains (P).
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: November 22, 2011
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Keiji Koyama, Tetsuya Kuwabara, Masaru Haga, Hideki Kashihara
  • Patent number: 8047381
    Abstract: A grain classifying device for accurately classifying the grains of uniform length, and an adhesive containing grains classified by the device and capable of connecting electrodes under a low pressure and being applicable to electrodes arranged in fine pitches. The grain classifying device (1) includes a dispersing means (2) for dispersing a plurality of grains (P). A grain orienting means (3) orients each of the dispersed grains in a transfer direction (X) of the grains (P) while spacing the grains apart from one another in the transfer direction (X) of the grains. A grain length measuring means (4) measures the length of each of the grains (P) oriented in the transfer direction (X). A grain separation means (5) separates the grains (P) having a predetermined length based on data related to the lengths of the measured grains (P).
    Type: Grant
    Filed: June 17, 2010
    Date of Patent: November 1, 2011
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Keiji Koyama, Tetsuya Kuwabara, Masaru Haga, Hideki Kashihara
  • Patent number: 8038762
    Abstract: A process for production of a chain metal powder, which comprises the steps of reducing metal ions contained in an aqueous solution, while applying a magnetic filed to the solution, in the presence of both a reducing agent capable of generating a gas during the reduction of metal ions and a foamable water soluble compound, through the generation of a gas, a bubble layer on the surface of the aqueous solution to form a chain metal powder, separating the bubble layer formed on the surface of the aqueous solution from the solution, and collecting the chain metal powder contained in the bubble layer.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: October 18, 2011
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tetsuya Kuwabara, Hideaki Toshioka, Hideki Kashihara, Keiji Koyama, Takashi Sakai
  • Patent number: 7973239
    Abstract: A multicore ultrafine coaxial wire is formed by consolidating a plurality of ultrafine coaxial wires in a flat array. Each of the ultrafine coaxial wires has a center conductor, whose tip portion is exposed, an insulating layer, an outer conductor, and a covering. The harness has a grounding member that connects in common the outer conductors of the multicore ultrafine coaxial wire and an insulator frame that fixes the center conductors. End portions of an underside film and end portions of a topside film both of the insulator frame are provided with an alignment hole to align the center conductors with circuits on a substrate.
    Type: Grant
    Filed: February 8, 2008
    Date of Patent: July 5, 2011
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Keiji Koyama, Hiroyuki Senba, Takayoshi Koinuma, Motoo Kobayashi
  • Patent number: 7850760
    Abstract: A chain metal powder, which is free from branches and has a small distribution of the chain length, can be produced by a process of reducing metal ions contained in an aqueous solution, while applying a magnetic field to the solution containing ferromagnetic ions, in the presence of a polymer compound comprising repeating units of the formula (1): and repeating unit of the formula (2): or repeating unit of the formula (4); or a process which comprises the steps of reducing metal ions contained in an aqueous solution, while applying a magnetic filed to the solution, in the presence of both a reducing agent capable of generating a gas during the reduction of metal ions and a foamable water soluble compound, through the generation of a gas, a bubble layer on the surface of the aqueous solution to form a chain metal powder, separating the bubble layer formed on the surface of the aqueous solution from the solution, and collecting the chain metal powder contained in the bubble layer.
    Type: Grant
    Filed: April 27, 2005
    Date of Patent: December 14, 2010
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tetsuya Kuwabara, Hideaki Toshioka, Hideki Kashihara, Keiji Koyama, Takashi Sakai
  • Publication number: 20100252781
    Abstract: A grain classifying device for accurately classifying the grains of uniform length, and an adhesive containing grains classified by the device and capable of connecting electrodes under a low pressure and being applicable to electrodes arranged in fine pitches. The grain classifying device (1) includes a dispersing means (2) for dispersing a plurality of grains (P). A grain orienting means (3) orients each of the dispersed grains in a transfer direction (X) of the grains (P) while spacing the grains apart from one another in the transfer direction (X) of the grains. A grain length measuring means (4) measures the length of each of the grains (P) oriented in the transfer direction (X). A grain separation means (5) separates the grains (P) having a predetermined length based on data related to the lengths of the measured grains (P).
    Type: Application
    Filed: June 17, 2010
    Publication date: October 7, 2010
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Keiji KOYAMA, Tetsuya Kuwabara, Masaru Haga, Hideki Kashihara
  • Publication number: 20100208410
    Abstract: Provided is a multi-layered ceramic capacitor including an internal electrode, the surface of which is smoothened and in which electrode breakage can be reliably prevented. Also provided are a conductive paste and a nickel powder or an alloy powder containing nickel as a main component, which are used in the multi-layered ceramic capacitor, and a method for manufacturing the powder. The nickel powder or the alloy powder containing nickel as a main component of the present invention has a spherical shape, a mean particle diameter D50 in the range of 10 to 300 nm, and a ratio (Dmax/D50) of a maximum particle diameter Dmax to the mean particle diameter D50 of 3 or less.
    Type: Application
    Filed: July 9, 2008
    Publication date: August 19, 2010
    Inventors: Issei Okada, Keiji Koyama
  • Publication number: 20100175507
    Abstract: A process for production of a chain metal powder, which comprises the steps of reducing metal ions contained in an aqueous solution, while applying a magnetic filed to the solution, in the presence of both a reducing agent capable of generating a gas during the reduction of metal ions and a foamable water soluble compound, through the generation of a gas, a bubble layer on the surface of the aqueous solution to form a chain metal powder, separating the bubble layer formed on the surface of the aqueous solution from the solution, and collecting the chain metal powder contained in the bubble layer.
    Type: Application
    Filed: January 13, 2010
    Publication date: July 15, 2010
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Tetsuya KUWABARA, Hideaki Toshioka, Hideki Kashihara, Keiji Koyama, Takashi Sakai
  • Publication number: 20090175019
    Abstract: [Problem] To enable mounting a part on the rear surface at the back of a connection part on a PCB to be connected with a FPC. [Means for Solving the Problem] Connection parts are provided such that a conductor wiring of a first circuit board and a conductor wiring of a second circuit board are connected with an anisotropic conductive adhesive which is made of an insulative resin including needle-shaped or linear chain-shaped metal powders oriented in a thickness direction, i.e., adhesion direction, and a part is mounted on at least either one of the first and the second circuit boards, the part being mounted on the rear surface at the back opposed to the surface where the connection part is formed.
    Type: Application
    Filed: February 8, 2008
    Publication date: July 9, 2009
    Inventors: Keiji Koyama, Masamichi Yamamoto, Katsunari Mikage, Jin-Joo Park
  • Publication number: 20090101408
    Abstract: The invention offers an ultrafine-coaxial-wire harness that enables connectorless connection to a substrate in a narrow space while maintaining the reliability and speediness of the operation. A multicore ultrafine coaxial wire 10 is formed by consolidating a plurality of ultrafine coaxial wires 11 in a flat array. Each of the ultrafine coaxial wires 11 has a center conductor 12, whose tip portion is exposed, an insulating layer 13, an outer conductor 14, and a covering 15. The harness has (a) a grounding member 20 that connects in common the outer conductors 14 of the multicore ultrafine coaxial wire 10 and (b) an insulator frame 30 that fixes the center conductors 12. End portions 31y of an underside film 31 and end portions 32y of a topside film 32 both of the insulator frame 30 are provided with an alignment hole 36 to align the center conductors 12 with circuits on a substrate.
    Type: Application
    Filed: February 8, 2008
    Publication date: April 23, 2009
    Inventors: Keiji Koyama, Hiroyuki Senba, Takayoshi Koinuma, Motoo Kobayashi
  • Publication number: 20090032444
    Abstract: A grain classifying device for accurately classifying the grains of uniform length, and an adhesive containing grains classified by the device and capable of connecting electrodes under a low pressure and being applicable to electrodes arranged in fine pitches. The grain classifying device (1) includes a dispersing means (2) for dispersing a plurality of grains (P). A grain orienting means (3) orients each of the dispersed grains in a transfer direction (X) of the grains (P) while spacing the grains apart from one another in the transfer direction (X) of the grains. A grain length measuring means (4) measures the length of each of the grains (P) oriented in the transfer direction (X). A grain separation means (5) separates the grains (P) having a predetermined length based on data related to the lengths of the measured grains (P).
    Type: Application
    Filed: September 22, 2006
    Publication date: February 5, 2009
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Keiji Koyama, Tetsuya Kuwabara, Masaru Haga, Hideki Kashihara
  • Patent number: 7470306
    Abstract: An object of the present invention is to provide a new method for producing a fine metal powder, in which high purity fine metal powders which are more minute than ever before, are uniform in particle diameter, and contain no impurities can be produced at lower cost, in larger amounts, and in safety, characterized by subjecting a solution containing tetravalent titanium ions and having a pH of not more than 7 to cathode electrolytic treatment to reduce parts of the tetravalent titanium ions to trivalent titanium ions, to prepare a reducing agent solution containing both the trivalent titanium ions and the tetravalent titanium ions, and adding a water-soluble compound of at least one type of metal element forming the fine metal powder to the reducing agent solution, followed by mixing, to reduce and deposit ions of the metal element by the reducing action at the time of oxidation of the trivalent titanium ions to the tetravalent titanium ions, to produce the fine metal powder.
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: December 30, 2008
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Shinji Inazawa, Masatoshi Majima, Keiji Koyama, Yoshie Tani
  • Patent number: 7390442
    Abstract: An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 ?m-20 ?m when a contact probe is mounted.
    Type: Grant
    Filed: March 3, 2003
    Date of Patent: June 24, 2008
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Hideki Kashihara, Masamichi Yamamoto, Jun Yorita, Hideaki Toshioka, Misako Osoegawa, Keiji Koyama, Masatoshi Majima, Yoshie Tani
  • Patent number: 7285152
    Abstract: A method of manufacturing the chain-structure metal powder comprises precipitating a metal powder by a reaction performed in an aqueous solution in which nickel ions, complex ions, and titanium ions containing trivalent titanium ions (Ti3+) and tetravalent titanium ions (Ti4+) are present.
    Type: Grant
    Filed: February 23, 2004
    Date of Patent: October 23, 2007
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kohei Shimoda, Masatoshi Majima, Keiji Koyama, Issei Okada, Tetsuya Kuwabara
  • Publication number: 20070224440
    Abstract: A chain metal powder, which is free from branches and has a small distribution of the chain length, can be produced by a process of reducing metal ions contained in an aqueous solution, while applying a magnetic field to the solution containing ferromagnetic ions, in the presence of a polymer compound comprising repeating units of the formula (1): and repeating unit of the formula (2): or repeating unit of the formula (4); or a process which comprises the steps of reducing metal ions contained in an aqueous solution, while applying a magnetic filed to the solution, in the presence of both a reducing agent capable of generating a gas during the reduction of metal ions and a foamable water soluble compound, through the generation of a gas, a bubble layer on the surface of the aqueous solution to form a chain metal powder, separating the bubble layer formed on the surface of the aqueous solution from the solution, and collecting the chain metal powder contained in the bubble layer.
    Type: Application
    Filed: April 27, 2005
    Publication date: September 27, 2007
    Inventors: Tetsuya Kuwabara, Hideaki Toshioka, Hideki Kashihara, Keiji Koyama, Takashi Sakai
  • Publication number: 20050217425
    Abstract: An object of the present invention is to provide a new method for producing a fine metal powder, in which high purity fine metal powders which are more minute than ever before, are uniform in particle diameter, and contain no impurities can be produced at lower cost, in larger amounts, and in safety, characterized by subjecting a solution containing tetravalent titanium ions and having a pH of not more than 7 to cathode electrolytic treatment to reduce parts of the tetravalent titanium ions to trivalent titanium ions, to prepare a reducing agent solution containing both the trivalent titanium ions and the tetravalent titanium ions, and adding a water-soluble compound of at least one type of metal element forming the fine metal powder to the reducing agent solution, followed by mixing, to reduce and deposit ions of the metal element by the reducing action at the time of oxidation of the trivalent titanium ions to the tetravalent titanium ions, to produce the fine metal powder.
    Type: Application
    Filed: June 11, 2003
    Publication date: October 6, 2005
    Inventors: Shinji Inazawa, Masatoshi Majima, Keiji Koyama, Yoshie Tani