Abstract: A substrate processing method includes step S51, step S52, and step S6. In step S51, a substrate immersed in a rinsing liquid is lifted from the rinsing liquid and the substrate is immersed in a rinsing liquid stored in a tank in a chamber while an organic solvent having a surface tension smaller than that of the rinsing liquid adheres to the substrate. In step S52, the substrate is lifted from the rinsing liquid. In step S6, a vapor of an organic solvent having a surface tension smaller than that of the rinsing liquid is supplied into the chamber in which the lifted substrate exists.

Abstract: A processing unit includes third discharge nozzles. Each of the third discharge nozzles discharges a processing liquid toward a lower tapered surface of a groove of a V-shaped cross-sectional configuration formed in a side wall of an inner bath. This forms relatively low-speed liquid flows within the inner bath. The processing unit further includes plate-like members. The plate-like members block upward ones of the liquid flows discharged from the third discharge nozzles and impinging upon the lower tapered surfaces of the inner bath. This achieves the efficient replacement of the processing liquid without disturbing upward flows of the processing liquid within the inner bath. Thus, the processing liquid stored in the processing bath is efficiently replaced with another processing liquid without disturbing the upward flows of the processing liquid within the processing bath.

Abstract: Phosphoric acid, sulfuric acid, and water are supplied to a flow path for a processing liquid from a first tank to a substrate held by a substrate holding unit. As a result, a mixed liquid containing the phosphoric acid, the sulfuric acid, and the water is generated. A liquid containing the sulfuric acid and a liquid containing the water are mixed together in the flow path, and the temperature of the mixed liquid containing the phosphoric acid, the sulfuric acid, and the water rises. A mixed liquid containing a phosphoric acid aqueous solution whose temperature is close to its boiling point is supplied to the substrate held by the substrate holding unit.

Abstract: A substrate treating apparatus for performing a predetermined treatment of substrates includes a treating tank for storing a treating solution, a holder for holding a plurality of substrates arranged in one direction inside the treating tank, and a bubble generating device for generating bubbles in the treating solution stored in the treating tank. The bubble generating device includes a plurality of cylindrical bodies extending in the one direction and arranged in a direction perpendicular to the one direction. Each of the cylindrical bodies is at least partly formed of a porous member extending in the one direction.

Abstract: A substrate treating apparatus for performing a predetermined treatment of substrates includes a treating tank for storing a treating solution, a holder for holding a plurality of substrates arranged in one direction inside the treating tank, and a bubble generating device for generating bubbles in the treating solution stored in the treating tank. The bubble generating device includes a plurality of cylindrical bodies extending in the one direction and arranged in a direction perpendicular to the one direction. Each of the cylindrical bodies is at least partly formed of a porous member extending in the one direction.