Patents by Inventor Keiji Nakamoto
Keiji Nakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 5728321Abstract: This invention relates to a conducting organic polymer formed by doping an organic polymer with a protonic acid having a dissociation constant value pKa of less than 4.8, wherein the organic polymer has, as the main repeating unit, a compound represented by the general formula: ##STR1## wherein, m and n, respectively, show the molar fraction of the quinonediimine structural unit and phenylenediamine structural unit in the repeating unit, and 0<m<1, 0<n<1, and m+n=1; and the organic polymer is soluble in an organic solvent in the undoped state, and has an intrinsic viscosity ?.eta.! of more than 0.4 dl/g measured in N-methyl-2-pyrrolidone at 30.degree. C. This invention also relates to a film formed of the conducting organic polymer and a conducting organic polymer composition.Type: GrantFiled: June 6, 1995Date of Patent: March 17, 1998Assignee: Nitto Denko CorporationInventors: Masao Abe, Akira Ohtani, Hiroyuki Higuchi, Minoru Ezoe, Shinya Akizuki, Keiji Nakamoto, Keiko Mochizuki, Yasuhiro Umemoto, Michio Umeda
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Patent number: 5476565Abstract: A dicing-die bonding film comprising an ultraviolet-transmitting substrate having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer and an adhesive layer in this order, the pressure-sensitive adhesive layer having been partly ultraviolet-cured to have cured parts and uncured parts. The film has a well-balanced combination of a holding power for supporting a semiconductor wafer during dicing and release properties for enabling cut chips to be easily released together with the adhesive layer so that even large-sized chips as larger than 10 mm.times.10 mm can easily be picked up.Type: GrantFiled: January 12, 1994Date of Patent: December 19, 1995Assignee: Nitto Denko CorporationInventors: Yuzo Akada, Koji Akazawa, Keiji Nakamoto
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Patent number: 5304418Abstract: A dicing-die bonding film comprising an ultraviolet-transmitting substrate having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer and an adhesive layer in this order, the pressure-sensitive adhesive layer having been partly ultraviolet-cured to have cured parts and uncured parts. The film has a well-balanced combination of a holding power for supporting a semiconductor wafer during dicing and release properties for enabling cut chips to be easily released together with the adhesive layer so that even large-sized chips as larger than 10 mm.times.10 mm can easily be picked up.Type: GrantFiled: December 30, 1992Date of Patent: April 19, 1994Assignee: Nitto Denko CorporationInventors: Yuzo Akada, Koji Akazawa, Keiji Nakamoto
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Patent number: 5264552Abstract: This invention relates to an organic polymer having, as the main repeating unit, the compound represented by the general formula: ##STR1## (wherein, m and n respectively show the molar fraction of quinonediimine structure unit and phenylenediamine structure unit in the repeating unit, and 0<m<1, 0<n<1, and m+n=1.), and soluble in an organic solvent in an undoped state, and having the intrinsic viscocity [.eta.] of more than 0.4 dl/g measured in N-methyl-2-pyrrolidone at 30.degree. C., and a conducting organic polymer formed by doping a protonic acid to such a polymer.Type: GrantFiled: September 27, 1989Date of Patent: November 23, 1993Assignee: Nitto Denko CorporationInventors: Masao Abe, Akira Ohtani, Hiroyuki Higuchi, Minoru Ezoe, Shinya Akizuki, Keiji Nakamoto, Keiko Mochizuki, Yasuhiro Umemoto, Michio Umeda
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Patent number: 4615829Abstract: An electroconductive organic polymer exhibiting outstanding electroconductivity is described, containing an electron acceptor as a dopant, and having electroconductivity of not less than 10.sup.-6 S/cm, substantially comprising a linear polymer having as a main repeating unit thereof a quinonediimine structure represented by formula (III) ##STR1## wherein R represents a hydrogen atom or an alkyl group. This polymer can be obtained by oxidative polymerization of an aniline compound or a water-soluble salt thereof with an oxidizing agent in a reaction medium containing a protonic acid.Type: GrantFiled: November 13, 1984Date of Patent: October 7, 1986Assignee: Nitto Electric Industrial Co., Ltd.Inventors: Shohei Tamura, Sadamitsu Sasaki, Masao Abe, Hitoshi Nakazawa, Hisashi Ichinose, Keiji Nakamoto, Satoshi Yumoto
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Patent number: 4556623Abstract: An electroconductive porous film is described comprising a porous film substrate having deposited thereon an electroconductive organic polymer containing an electron acceptor as a doptant, substantially comprising a linear polymer having as a main repeating unit thereof a quinonediimine structure represented by formula (III). ##STR1## wherein R.sub.1 and R.sub.2, which are the same or different, each represents a hydrogen atom or an alkyl group.Type: GrantFiled: December 31, 1984Date of Patent: December 3, 1985Assignee: Nitto Electric Industrial Co., Ltd.Inventors: Shohei Tamura, Sadamitsu Sasaki, Takeshi Sasaki, Hisashi Ichinose, Keiji Nakamoto, Masao Abe, Hitoshi Nakazawa
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Patent number: 4092452Abstract: A plastic laminated metallic foil is prepared by laminating a first layer of a polymer selected from the group consisting of ethylene-unsaturated carboxylic acid copolymers, ethylene-unsaturated carboxylic acid ester copolymers, ethylene-unsaturated carboxylic acid-unsaturated carboxylic acid-ester ternary copolymers, ionomers containing these copolymers as the base, and graft copolymers of polyethylene and unsaturated carboxylic acids on at least one surface of a metallic foil, and further laminating a second layer of a polymer selected from the group consisting of polyethylene, ethylene-vinyl acetate copolymers, ethylene-unsaturated carboxylic acid ester copolymers, and graft copolymers of polyethylene and unsaturated carboxylic acid esters onto the first polymer layer of the metallic foil.Type: GrantFiled: March 3, 1975Date of Patent: May 30, 1978Assignee: Nitto Electric Industrial Co., Ltd.Inventors: Yutaka Hori, Zenzo Honda, Kenji Suzuki, Keiji Nakamoto, Yoshiharu Yamamoto
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Patent number: 4049904Abstract: A plastic laminated metallic foil is prepared by laminating a first layer of a polymer selected from the group consisting of ethylene-unsaturated carboxylic acid copolymers, ethylene-unsaturated carboxylic acid ester copolymers, ethylene-unsaturated carboxylic acid-unsaturated carboxylic acid-ester ternary copolymers, ionomers containing these copolymers as the base, and graft copolymers of polyethylene and unsaturated carboxylic acids on at least one surface of a metallic foil, and further laminating a second layer of a polymer selected from the group consisting of polyethylene, ethylene-vinyl acetate copolymers, ethylene-unsaturated carboxylic acid ester copolymers, and graft copolymers of polyethylene and unsaturated carboxylic acid esters onto the first polymer layer of the metallic foil.Type: GrantFiled: October 24, 1972Date of Patent: September 20, 1977Assignee: Nitto Electric Industrial Co., Ltd.Inventors: Yutaka Hori, Zenzo Honda, Kenji Suzuki, Keiji Nakamoto, Yoshiharu Yamamoto
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Patent number: 3950605Abstract: A metal foil-plastic laminate comprising an upper layer of a member selected from the group consisting of a polyethylene-vinyl acetate and ethylene-vinyl acetate copolymer containing no more than 8 wt. % of vinyl acetate and a lower layer of an ethylene-vinyl acetate copolymer containing 10-45 wt. % of vinyl acetate, thermally pressed on at least one surface of a metal foil, said lower layer being in contact with the metal foil and method for preparing the same.Type: GrantFiled: August 13, 1973Date of Patent: April 13, 1976Assignee: Nitto Electric Industrial Co., Ltd.Inventors: Yutaka Hori, Zenzo Honda, Kenji Suzuki, Keiji Nakamoto, Yoshiharu Yamamoto