Patents by Inventor Keiji Wakita

Keiji Wakita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220298296
    Abstract: Provided is a waterborne epoxy curing agent comprising a reaction product of a) at least one amine having at least one moiety in the formula of -QNH—, wherein Q is a divalent hydrocarbon group, and wherein the amine has at least one tertiary amino group and at least one primary amino group per molecule; and b) at least one polyether polyol modified epoxide having one or more epoxide groups. Also provided is preparation methods thereof.
    Type: Application
    Filed: March 10, 2022
    Publication date: September 22, 2022
    Applicant: EVONIK OPERATIONS GMBH
    Inventor: Keiji Wakita
  • Patent number: 9947858
    Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: April 17, 2018
    Assignees: DOW CORNING CORPORATION, DOW CORNING TORAY CO., LTD.
    Inventors: Toyohiko Fujisawa, Hiroshi Fukui, Haruhiko Furukawa, Peter Cheshire Hupfield, Hong Sub Kim, Eiji Kitaura, Kent R. Larson, Wataru Nishiumi, Takuya Ogawa, Masayuki Onishi, Kouichi Ozaki, Keiji Wakita
  • Patent number: 9879126
    Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition and a compound having a highly dielectric functional group.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: January 30, 2018
    Assignees: DOW CORNING CORPORATION, DOW CORNING TORAY CO., LTD.
    Inventors: Haruhiko Furukawa, Peter Cheshire Hupfield, Hong Sub Kim, Eiji Kitaura, Kent R. Larson, Wataru Nishiumi, Takuya Ogawa, Kouichi Ozaki, Son Thanh Phan, Keiji Wakita
  • Publication number: 20150380636
    Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.
    Type: Application
    Filed: December 26, 2013
    Publication date: December 31, 2015
    Inventors: Toyohiko Fujisawa, Hiroshi Fukui, Haruhiko Furukawa, Peter Cheshire Hupfield, Hong Sub Kim, Eiji Kitaura, Kent R. Larson, Wataru Nishiumi, Takuya Ogawa, Masayuki Onishi, Kouichi Ozaki, Keiji Wakita
  • Publication number: 20150344671
    Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition and a compound having a highly dielectric functional group.
    Type: Application
    Filed: December 26, 2013
    Publication date: December 3, 2015
    Inventors: Haruhiko Furukawa, Peter Cheshire Hupfield, Hong Sub Kim, Eiji Kitaura, Kent R. Larson, Wataru Nishiumi, Takuya Ogawa, Kouichi Ozaki, Son Thanh Phan, Keiji Wakita
  • Publication number: 20140238471
    Abstract: A multi-component type curable silicone rubber composition includes: (A) 100 parts by weight of an organopoly-siloxane capped at molecular terminals with an alkoxy group or silanol group, (B) 0.5 to 20.0 parts by weight of an organic compound having at least two alkoxysilyl groups within single molecule and including a non-silicon-oxygen bond between the silyl groups, (C) 0.05 to 2.0 parts by weight of water, and (D) a catalytic amount of a curing catalyst. The multi-component type curable silicone rubber composition is composed of multiple separately stored compositions.
    Type: Application
    Filed: December 26, 2012
    Publication date: August 28, 2014
    Inventors: Keiji Wakita, Osamu Takuman, Manabu Sutoh
  • Patent number: 8624064
    Abstract: The present invention relates to a compound represented by the following general formula (I): wherein R1 and R2 independently represent a monovalent hydrocarbon group; R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; X represents a divalent hydrocarbon group; and R4, R5 and R6 independently represent a monovalent organic group or a group represented by the following general formula (II): in which R7 and R8 independently represent a monovalent hydrocarbon group; and R9 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, with the proviso that R5 and R6 may combine together to form a divalent hydrocarbon group. The aforementioned compounds are useful as a polymerization inhibitor and the like.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: January 7, 2014
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Takeaki Saiki, Keiji Wakita, Yasushi Sugiura, Yoshinori Taniguchi
  • Patent number: 8580994
    Abstract: This invention involves a process for the preparation of haloalkylalkoxysilanes and haloalkylhalosilancs. The process comprises reacting an alkoxyhydridosilane or a halohydridosilanc silane with an alkenylhalide compound in the presence of a catalytic amount of an iridium containing catalyst. When a halohydridosilane is the silane reactant. The resulting haloalkylhalosilane may be alkoxylated by reaction with a C1-C6, alcohol. In another aspect of the invention, the reacting is conducted under a reduced oxygen atmosphere to improve the catalyst activity and the yield of the resulting haloalkylhalosilane or haloalkylalkox vsi lane.
    Type: Grant
    Filed: January 13, 2009
    Date of Patent: November 12, 2013
    Assignee: Dow Corning Corporation
    Inventors: Paul Charles Dinh, Keiji Wakita
  • Patent number: 8148565
    Abstract: A method of manufacturing an organic silicon compound that contains a methacryloxy group or an acryloxy group is characterized by the fact that manufacturing or conducting purification by distillation is carried out in the presence of a phenothiazine derivative having a molecular weight equal to or higher than 240. A stable composition comprises the organic silicon compound that contains a methacryloxy group or an acryloxy group and the phenothiazine derivative having a molecular weight equal to or higher than 240. The phenothiazine derivative is used in an amount sufficient to stabilize the organic silicon compound.
    Type: Grant
    Filed: August 9, 2006
    Date of Patent: April 3, 2012
    Assignee: Dow Corning Toray Company, Ltd.
    Inventor: Keiji Wakita
  • Patent number: 7932412
    Abstract: To provide an aminoaryl-containing organosilicon compound with high efficiency, after protecting amino groups of a haloaniline compound with a specific compound, to form a Grignard reagent and to deprotect the aforementioned groups by reacting the Grignard reagent with a silicon compound.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: April 26, 2011
    Assignee: Dow Corning Toray Co., Ltd.
    Inventors: Keiji Wakita, Yasushi Sugiura
  • Patent number: 7923572
    Abstract: A method for producing ketimine structure-containing alkoxysilane comprising reacting amino-functional alkoxysilane with a monocarbonyl compound by heating and azeotropically distilling off the produced water together with the monocarbonyl compound to yield ketimine structure-containing alkoxysilane, characterized by introducing additional monocarbonyl compound at the time of the azeotropic distillation of the produced water together with the monocarbonyl compound.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: April 12, 2011
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Yoshinori Taniguchi, Makoto Iwai, Keiji Wakita
  • Patent number: 7915439
    Abstract: A method for making a silylalkoxymethyl halide at good yield represented by the formula: R1R2R3Si—R4—O—CH2X wherein R1, R2, and R3 are an alkyl, cycloalkyl, aryl group, or a halogen atom, R4 is a divalent hydrocarbyl group having 1 to 10 carbon atoms, and X is a halogen atom, by reacting: (a) a silyl alcohol compound with the formula R1R2R3Si—R4—OH wherein R1, R2, R3 and R4 are defined as above, with (b) formaldehyde or a polymer thereof, and (c) a halosilane.
    Type: Grant
    Filed: September 28, 2005
    Date of Patent: March 29, 2011
    Assignee: Dow Corning Toray Company, Ltd.
    Inventor: Keiji Wakita
  • Publication number: 20110040114
    Abstract: To provide an aminoaryl-containing organosilicon compound with high efficiency, after protecting amino groups of a haloaniline compound with a specific compound, to form a Grignard reagent and to deprotect the aforementioned groups by reacting the Grignard reagent with a silicon compound.
    Type: Application
    Filed: October 27, 2010
    Publication date: February 17, 2011
    Inventors: Keiji WAKITA, Yasushi SUGIURA
  • Publication number: 20100317885
    Abstract: This invention involves a process for the preparation of haloalkylalkoxysilanes and haloalkylhalosilancs. The process comprises reacting an alkoxyhydridosilane or a halohydridosilanc silane with an alkenylhalide compound in the presence of a catalytic amount of an iridium containing catalyst. When a halohydridosilane is the silane reactant. the resulting haloalkylhalosilane may be alkoxylated by reaction with a C1-C6, alcohol, In another aspect of the invention, the reacting is conducted under a reduced oxygen atmosphere to improve the catalyst activity and the yield of the resulting haloalkylhalosilane or haloalkylalkox vsi lane.
    Type: Application
    Filed: January 13, 2009
    Publication date: December 16, 2010
    Inventors: Paul Charles Dinh, Keiji Wakita
  • Patent number: 7847116
    Abstract: To provide an aminoaryl containing organosilicon compound with high efficiency, after protecting amino groups of a haloaniline compound with a specific compound, to form a Grignard reagent and to deprotect the aforementioned groups by reacting the Grignard reagent with a silicon compound.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: December 7, 2010
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Keiji Wakita, Yasushi Sugiura
  • Publication number: 20100280188
    Abstract: The present invention relates to a compound represented by the following general formula (I): wherein R1 and R2 independently represent a monovalent hydrocarbon group; R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; X represents a divalent hydrocarbon group; and R4, R5 and R6 independently represent a monovalent organic group or a group represented by the following general formula (II): in which R7 and R8 independently represent a monovalent hydrocarbon group; and R9 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, with the proviso that R5 and R6 may combine together to form a divalent hydrocarbon group. The aforementioned compounds are useful as a polymerization inhibitor and the like.
    Type: Application
    Filed: December 16, 2008
    Publication date: November 4, 2010
    Inventors: Takeaki Saiki, Keiji Wakita, Yasushi Sugiura, Yoshinori Taniguchi
  • Publication number: 20100130764
    Abstract: A method for producing ketimine structure-containing alkoxysilane comprising reacting amino-functional alkoxysilane with a monocarbonyl compound by heating and azeotropically distilling off the produced water together with the monocarbonyl compound to yield ketimine structure-containing alkoxysilane, characterized by introducing additional monocarbonyl compound at the time of the azeotropic distillation of the produced water together with the monocarbonyl compound.
    Type: Application
    Filed: September 21, 2006
    Publication date: May 27, 2010
    Inventors: Yoshinori Taniguchi, Makoto Iwai, Keiji Wakita
  • Publication number: 20090306370
    Abstract: A method of manufacturing an organic silicon compound that contains a methacryloxy group or an acryloxy group, the method being characterized by the fact that manufacturing or conducting purification by distillation is carried out in the presence of a phenothiazine derivative having a molecular weight equal to or higher than 240. And a stable composition comprising an organic silicon compound that contains a methacryloxy group or an acryloxy group and a phenothiazine derivative having a molecular weight equal to or higher than 240 and used in an amount sufficient to stabilize the aforementioned organic silicon compound.
    Type: Application
    Filed: August 9, 2006
    Publication date: December 10, 2009
    Inventor: Keiji Wakita
  • Publication number: 20090203932
    Abstract: A method for making a silylalkoxymethyl halide at good yield represented by the formula: R1R2R3Si—R4—O—CH2X wherein R1, R2, and R3 are an alkyl, cycloalkyl, aryl group, or a halogen atom, R4 is a divalent hydrocarbyl group having 1 to 10 carbon atoms, and X is a halogen atom, by reacting: (a) a silyl alcohol compound with the formula R1R2R3Si—R4—OH wherein R1, R2, R3 and R4 are defined as above, with (b) formaldehyde or a polymer thereof, and (c) a halosilane.
    Type: Application
    Filed: September 28, 2005
    Publication date: August 13, 2009
    Applicant: DOW CORNING TORAY CO., LTD.
    Inventor: Keiji Wakita
  • Patent number: 7446137
    Abstract: A curable organic resin composition comprising (A) 100 parts by weight of a curable organic resin and (B) 0.01 to 100 parts by weight of a thiocyanato-containing organohydrocarbonoxysilane or an isothiocyanato-containing organohydrocarbonoxysilane represented by the general formula: X—R1—Si(OR2)nR33-n, wherein X is NCS— or SCN—, R1 is an alkylene or alkyleneoxyalkylene group, R2 and R3 are monovalent hydrocarbon groups, and the subscript n is 1, 2, or 3. The curable organic resin composition possesses superior moldability and, when cured, exhibits superior adhesive properties on substrates such as metals.
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: November 4, 2008
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Makoto Iwai, Keiji Wakita, Akihiko Shirahata