Patents by Inventor Keiko SHIRAFUJI

Keiko SHIRAFUJI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, and method of manufacturing the same
    Patent number: 10916520
    Abstract: A semiconductor device includes a substrate, a semiconductor element, a ground pad, an insulating coating member, a conductive bonding member, and a conductive cap. The inner peripheral end of a bottom of the conductive cap is disposed at a side close to the inner periphery of the insulating coating member relative to the outer peripheral end of the insulating coating member. The bottom has a shape in which the distance between the main surface and itself decreases continuously from its outer peripheral end toward its inner peripheral end.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: February 9, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kiyoshi Ishida, Makoto Kimura, Katsumi Miyawaki, Yukinobu Tarui, Keiko Shirafuji
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20180158794
    Abstract: A semiconductor device includes a substrate, a semiconductor element, a ground pad, an insulating coating member, a conductive bonding member, and a conductive cap. The inner peripheral end of a bottom of the conductive cap is disposed at a side close to the inner periphery of the insulating coating member relative to the outer peripheral end of the insulating coating member. The bottom has a shape in which the distance between the main surface and itself decreases continuously from its outer peripheral end toward its inner peripheral end.
    Type: Application
    Filed: June 1, 2016
    Publication date: June 7, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kiyoshi ISHIDA, Makoto KIMURA, Katsumi MIYAWAKI, Yukinobu TARUI, Keiko SHIRAFUJI