Patents by Inventor Keishi Takeyama

Keishi Takeyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stack structure and method of manufacturing the same
    Patent number: 8133338
    Abstract: A stack structure is formed by stacking and bonding a plurality of substrates. The stack structure includes bonding films each of which is interposed in a bonding region between, adjacent glass substrates, and bonded to oxygen atoms in the glass of the substrate by anodic bonding.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: March 13, 2012
    Assignee: Casio Computer Co., Ltd.
    Inventors: Tsutomu Terazaki, Osamu Nakamura, Keishi Takeyama, Masatoshi Nomura
  • Junction substrate and method of bonding substrates together
    Patent number: 7867346
    Abstract: A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of the first substrate.
    Type: Grant
    Filed: February 22, 2007
    Date of Patent: January 11, 2011
    Assignee: Casio Computer Co., Ltd.
    Inventors: Osamu Nakamura, Keishi Takeyama, Tsutomu Terazaki
  • Thermal treatment apparatus and power generation module
    Patent number: 7531255
    Abstract: A thermal treatment apparatus provided on a substrate includes a heat generating section the section includes a heat generating layer, a diffusion preventing layer which contacts one surface of the heat generating layer to prevent heat diffusion due to heat generation of the heat generating layer, and a cohering layer disposed between the substrate and the diffusion preventing layer.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: May 12, 2009
    Assignee: Casio Computer Co., Ltd.
    Inventors: Masatoshi Nomura, Osamu Nakamura, Tsutomu Terazaki, Keishi Takeyama
  • Chemical reaction apparatus and power supply system
    Patent number: 7531016
    Abstract: A chemical reaction apparatus includes a solid body which has an outer surface, and in which at least one flow path which allows a chemical medium to flow is formed. This body has a heating element which heats the chemical medium in the flow path to accelerate a chemical reaction of the chemical medium, and a heat radiation preventing film which covers at least a portion of the outer surface of the body, and prevents radiation of heat generated by the heating element from a portion of the outer surface.
    Type: Grant
    Filed: March 19, 2003
    Date of Patent: May 12, 2009
    Assignee: Casio Computer Co., Ltd.
    Inventors: Tadao Yamamoto, Osamu Nakamura, Keishi Takeyama, Tsutomu Terazaki
  • Reformer, method for manufacturing the reformer, and power generation system
    Patent number: 7410515
    Abstract: A reformer is provided which includes a micro reactor having a flow path for a fluid. A container accommodates the micro reactor and keeps an atmosphere on a periphery of the micro reactor at a pressure of not more than 1 Pa.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: August 12, 2008
    Assignee: Casio Computer Co., Ltd.
    Inventors: Keishi Takeyama, Osamu Nakamura
  • STACK STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20080145970
    Abstract: A stack structure is formed by stacking and bonding a plurality of substrates. The stack structure includes bonding films each of which is interposed in a bonding region between, adjacent glass substrates, and bonded to oxygen atoms in the glass of the substrate by anodic bonding.
    Type: Application
    Filed: February 14, 2008
    Publication date: June 19, 2008
    Applicant: Casio Computer Co., Ltd.
    Inventors: Tsutomu TERAZAKI, Osamu NAKAMURA, Keishi TAKEYAMA, Masatoshi NOMURA
  • JUNCTION SUBSTRATE AND METHOD OF BONDING SUBSTRATES TOGETHER
    Publication number: 20070181249
    Abstract: A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of the first substrate.
    Type: Application
    Filed: February 22, 2007
    Publication date: August 9, 2007
    Applicant: Casio Computer Co., Ltd.
    Inventors: Osamu NAKAMURA, Keishi Takeyama, Tsutomu Terazaki
  • Junction substrate and method of bonding substrates together
    Patent number: 7205625
    Abstract: A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of the first substrate.
    Type: Grant
    Filed: August 11, 2004
    Date of Patent: April 17, 2007
    Assignee: Casio Computer Co., Ltd.
    Inventors: Osamu Nakamura, Keishi Takeyama, Tsutomu Terazaki
  • Chemical reaction apparatus and power supply system
    Patent number: 7169367
    Abstract: A chemical reaction apparatus includes at least one reaction region formed on a solid body and having a continuously formed reaction flow path to which a fluid material is supplied, and a temperature adjusting layer which is provided on the body to correspond to a region including the reaction flow path and portions between adjacent portions of the reaction flow path. The temperature adjusting layer supplies a predetermined heat quantity to the reaction flow path.
    Type: Grant
    Filed: April 2, 2003
    Date of Patent: January 30, 2007
    Assignee: Casio Computer Co., Ltd.
    Inventors: Keishi Takeyama, Yoshihiro Kawamura, Osamu Nakamura
  • Stack structure and method of manufacturing the same
    Publication number: 20050212111
    Abstract: A stack structure is formed by stacking and bonding a plurality of substrates. The stack structure includes. Bonding films each of which is interposed in a bonding region between, adjacent glass substrates, and bonded to oxygen atoms in the glass of the substrate by anodic bonding.
    Type: Application
    Filed: March 14, 2005
    Publication date: September 29, 2005
    Applicant: Casio Computer Co., Ltd.
    Inventors: Tsutomu Terazaki, Osamu Nakamura, Keishi Takeyama, Masatoshi Nomura
  • Thermal treatment apparatus and power generation module
    Publication number: 20050069737
    Abstract: A thermal treatment apparatus provided on a substrate includes a heat generating section the section includes a heat generating layer, a diffusion preventing layer which contacts one surface of the heat generating layer to prevent heat diffusion due to heat generation of the heat generating layer, and a cohering layer disposed between the substrate and the diffusion preventing layer.
    Type: Application
    Filed: September 27, 2004
    Publication date: March 31, 2005
    Applicant: CASIO COMPUTER CO., LTD.
    Inventors: Masatoshi Nomura, Osamu Nakamura, Tsutomu Terazaki, Keishi Takeyama
  • Junction substrate and method of bonding substrates together
    Publication number: 20050046007
    Abstract: A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of the first substrate.
    Type: Application
    Filed: August 11, 2004
    Publication date: March 3, 2005
    Applicant: Casio Computer Co., Ltd.
    Inventors: Osamu Nakamura, Keishi Takeyama, Tsutomu Terazaki
  • Chemical reaction apparatus and power supply system
    Publication number: 20040148858
    Abstract: A chemical reaction apparatus includes a solid body which has an outer surface, and in which at least one flow path which allows a chemical medium to flow is formed. This body has a heating element which heats the chemical medium in the flow path to accelerate a chemical reaction of the chemical medium, and a heat radiation preventing film which covers at least a portion of the outer surface of the body, and prevents radiation of heat generated by the heating element from a portion of the outer surface.
    Type: Application
    Filed: November 12, 2003
    Publication date: August 5, 2004
    Inventors: Tadao Yamamoto, Osamu Nakamura, Keishi Takeyama, Tsutomu Terazaki
  • Reformer, method for manufacturing the reformer, and power generation system
    Publication number: 20040043263
    Abstract: A reformer includes a micro reactor in which a flow path is formed for a fluid to flow inside. A container accommodates the micro reactor and keeps an atmosphere on a periphery of the micro reactor at pressure lower than external pressure.
    Type: Application
    Filed: August 25, 2003
    Publication date: March 4, 2004
    Applicant: Casio Computer Co., Ltd.
    Inventors: Keishi Takeyama, Osamu Nakamura
  • Chemical reaction apparatus and power supply system
    Publication number: 20030190508
    Abstract: A chemical reaction apparatus includes at least one reaction region formed on a solid body and having a continuously formed reaction flow path to which a fluid material is supplied, and a temperature adjusting layer which is provided on the body to correspond to a region including the reaction flow path and portions between adjacent portions of the reaction flow path. The temperature adjusting layer supplies a predetermined heat quantity to the reaction flow path.
    Type: Application
    Filed: April 2, 2003
    Publication date: October 9, 2003
    Applicant: Casio Computer Co., Ltd.
    Inventors: Keishi Takeyama, Yoshihiro Kawamura, Osamu Nakamura