Patents by Inventor Keishi WATANABE
Keishi WATANABE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180005732Abstract: A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.Type: ApplicationFiled: September 13, 2017Publication date: January 4, 2018Applicant: ROHM CO., LTD.Inventors: Takuma SHIMOICHI, Yasuhiro KONDO, Keishi WATANABE, Takamichi TORII, Katsuya MATSUURA
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Publication number: 20170309404Abstract: A chip capacitor includes a substrate having a main surface, a first conductive film including a first connecting region and a first capacitor forming region and formed on the main surface of the substrate, a dielectric film covering the first capacitor forming region of the first conductive film, a second conductive film including a second connecting region facing to the first capacitor forming region of the first conductive film across the dielectric film, and a second capacitor forming region facing to the first capacitor forming region of the first conductive film across the dielectric film, a first external electrode electrically connected to the first connecting region of the first conductive film, and a second external electrode electrically connected to the second connecting region of the second conductive film.Type: ApplicationFiled: April 20, 2017Publication date: October 26, 2017Applicant: ROHM CO., LTD.Inventors: Keishi WATANABE, Yasuhiro KONDO
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Patent number: 9773588Abstract: A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.Type: GrantFiled: May 15, 2015Date of Patent: September 26, 2017Assignee: ROHM CO., LTD.Inventors: Takuma Shimoichi, Yasuhiro Kondo, Keishi Watanabe, Takamichi Torii, Katsuya Matsuura
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Publication number: 20170250029Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.Type: ApplicationFiled: May 16, 2017Publication date: August 31, 2017Applicant: ROHM CO., LTD.Inventors: Hiroki YAMAMOTO, Keishi WATANABE, Hiroshi TAMAGAWA
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Patent number: 9685273Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.Type: GrantFiled: February 23, 2016Date of Patent: June 20, 2017Assignee: ROHM CO., LTD.Inventors: Hiroki Yamamoto, Keishi Watanabe, Hiroshi Tamagawa
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Publication number: 20170015569Abstract: A membrane casing that watertightly houses a membrane element for filtering raw water includes a tubular casing main body, a lid body, and a pressing mechanism. The casing main body houses a membrane element. The lid body fits an opening end of the casing main body and is movable in the axial direction of the casing main body while maintaining the attitude and while securing watertightness with the casing main body. The pressing mechanism and presses the lid body to press and hold the membrane element housed in the casing main body. The membrane casing has a simple configuration capable of watertightly securing using a predetermined pressing force by accommodating variations in size of the membrane element, even if the membrane casing cannot be formed into a cylindrical shape.Type: ApplicationFiled: March 10, 2015Publication date: January 19, 2017Applicant: KUBOTA CORPORATIONInventors: Keishi WATANABE, Shintaro NISHIMOTO, Tetsuya UENAKA
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Publication number: 20160211077Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.Type: ApplicationFiled: February 23, 2016Publication date: July 21, 2016Applicant: ROHM CO., LTD.Inventors: Hiroki YAMAMOTO, Keishi WATANABE, Hiroshi TAMAGAWA
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Patent number: 9288908Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.Type: GrantFiled: October 25, 2013Date of Patent: March 15, 2016Assignee: ROHM CO., LTD.Inventors: Hiroki Yamamoto, Keishi Watanabe, Hiroshi Tamagawa
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Publication number: 20160050760Abstract: The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.Type: ApplicationFiled: March 27, 2014Publication date: February 18, 2016Applicant: ROHM CO., LTD.Inventors: Hiroshi TAMAGAWA, Koichi NIINO, Eiji NUKAGA, Keishi WATANABE
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Publication number: 20150332842Abstract: A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.Type: ApplicationFiled: May 15, 2015Publication date: November 19, 2015Applicant: ROHM CO., LTD.Inventors: Takuma SHIMOICHI, Yasuhiro KONDO, Keishi WATANABE, Takamichi TORII, Katsuya MATSUURA
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Publication number: 20150305159Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.Type: ApplicationFiled: October 25, 2013Publication date: October 22, 2015Applicant: ROHM CO., LTD.Inventors: Hiroki YAMAMOTO, Keishi WATANABE, Hiroshi TAMAGAWA
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Patent number: D764019Type: GrantFiled: February 20, 2015Date of Patent: August 16, 2016Assignee: KUBOTA CORPORATIONInventors: Keishi Watanabe, Shintaro Nishimoto, Tetsuya Uenaka