Patents by Inventor Keisho FUNATSU

Keisho FUNATSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lithographic printing plate precursor and method of producing lithographic printing plate
    Patent number: 11458757
    Abstract: A lithographic printing plate precursor includes an image recording layer on a support, in which the lithographic printing plate precursor has projections which are discontinuously formed on a surface of an outermost layer on a side where the image recording layer is provided, and a melting point of each projection is in a range of 70° C. to 150° C. A method of producing a lithographic printing plate includes a step of image-wise exposing the lithographic printing plate precursor to form an exposed portion and an unexposed portion, and a step of supplying at least one of printing ink or dampening water to remove the unexposed portion.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: October 4, 2022
    Assignee: FUJIFILM Corporation
    Inventors: Kotaro Kudo, Yoshiki Morita, Keisho Funatsu, Taira Murakami
  • Conductive film, conductive film having three-dimensional shape, method of producing the same, method of producing stretched film, and touch sensor film
    Patent number: 10915212
    Abstract: A conductive film has a support and a conductive portion which is disposed on the support and contains a conductive component and a binder, the binder contains a resin, a gel fraction of the resin is 70% or more, and a moisture content of the resin is 3% or less.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: February 9, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Shinichi Nakahira, Akihiro Ishii, Keisho Funatsu
  • LITHOGRAPHIC PRINTING PLATE PRECURSOR AND METHOD OF PRODUCING LITHOGRAPHIC PRINTING PLATE
    Publication number: 20200189306
    Abstract: Provided are a lithographic printing plate precursor including an image recording layer on a support, in which the lithographic printing plate precursor has projections which are discontinuously formed on a surface of an outermost layer on a side where the image recording layer is provided, and a melting point of each projection is in a range of 70° C. to 150° C.; and a method of producing a lithographic printing plate obtained by using the lithographic printing plate precursor. It is preferable that the method of producing a lithographic printing plate includes a step of image-wise exposing the lithographic printing plate precursor to form an exposed portion and an unexposed portion, and a step of supplying at least one of printing ink or dampening water to remove the unexposed portion.
    Type: Application
    Filed: February 26, 2020
    Publication date: June 18, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Kotaro KUDO, Yoshiki MORITA, Keisho FUNATSU, Taira MURAKAMI
  • CONDUCTIVE FILM, CONDUCTIVE FILM HAVING THREE-DIMENSIONAL SHAPE, METHOD OF PRODUCING THE SAME, METHOD OF PRODUCING STRETCHED FILM, AND TOUCH SENSOR FILM
    Publication number: 20190332225
    Abstract: A conductive film has a support and a conductive portion which is disposed on the support and contains a conductive component and a binder, the binder contains a resin, a gel fraction of the resin is 70% or more, and a moisture content of the resin is 3% or less.
    Type: Application
    Filed: July 8, 2019
    Publication date: October 31, 2019
    Applicant: FUJIFILM Corporation
    Inventors: Shinichi NAKAHIRA, Akihiro ISHII, Keisho FUNATSU
  • CONDUCTIVE SHEET FOR TOUCH SENSOR, LAMINATE FOR TOUCH SENSOR, TOUCH SENSOR, AND TOUCH PANEL
    Publication number: 20190056824
    Abstract: A conductive sheet for a touch sensor includes a base material, a conductive portion that is disposed on the base material and is made of a fine metal wire, and a transparent insulation layer that is disposed on the conductive portion, in which the transparent insulation layer includes a crosslinking structure, and an indentation hardness of the transparent insulation layer is 200 MPa or less.
    Type: Application
    Filed: October 22, 2018
    Publication date: February 21, 2019
    Applicant: FUJIFILM Corporation
    Inventors: Akira ICHIKI, Keisho FUNATSU