Abstract: First and second switching regions include first and second gate electrodes respectively. Channel currents of the first and second switching regions are controlled according to electric charge amounts supplied by control signals input to the first and second gate electrodes respectively. The second switching region is connected in parallel with the first switching region. A control section outputs a first control signal for turning-on the first switching region to the first gate electrode and a second control signal for turning-on the second switching region to the second gate electrode. The control section stops outputting the second control signal after a first predetermined period elapses from a start of outputting the first and second control signals, and outputs the second control signal after a second predetermined period elapses from a stop of outputting the second control signal.

Abstract: A semiconductor module includes a diode bridge circuit, a sensor configured to measure a current value of the diode bridge circuit, a current limiting circuit having an IGBT connected to the diode bridge circuit, and a protection circuit configured to switch ON and OFF the IGBT in accordance with the current value of the diode bridge circuit measured by the sensor.

Abstract: According to the present invention, a semiconductor apparatus includes a semiconductor device, a case surrounding the semiconductor device, a spring terminal including a first connection portion extending to a top surface of the case, and a second connection portion provided on the top surface of the case and a control substrate provided on the second connection portion, wherein the first connection portion is connected to the semiconductor device, the second connection portion includes a first end connected to an end of the first connection portion, and a second end opposite to the first end, the second connection portion being a flat plate and having an elastic force using the first end as a supporting point, the second end contacts the control substrate with an elastic force, and the second connection portion has a constriction structure having a notch formed in a side surface along a longitudinal direction.

Abstract: According to the present invention, a semiconductor apparatus includes a semiconductor device, a case surrounding the semiconductor device, a spring terminal including a first connection portion extending to a top surface of the case, and a second connection portion provided on the top surface of the case and a control substrate provided on the second connection portion, wherein the first connection portion is connected to the semiconductor device, the second connection portion includes a first end connected to an end of the first connection portion, and a second end opposite to the first end, the second connection portion being a flat plate and having an elastic force using the first end as a supporting point, the second end contacts the control substrate with an elastic force, and the second connection portion has a constriction structure having a notch formed in a side surface along a longitudinal direction.