Patents by Inventor Keisuke Ikeda

Keisuke Ikeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200158272
    Abstract: A pipe joint includes a joint body formed with a through hole therein along an axial direction, and having male threads and an extending shaft portion formed on one end side thereof; and a nut member formed with an insertion hole through which a tube member is inserted, and having female threads formed therein that screw-engage with the male threads. Annular projections are formed on an outer circumferential surface of the extending shaft portion, and the tube member, which is expanded in diameter, is gripped between the annular projections and an inner circumferential surface of the nut member.
    Type: Application
    Filed: January 22, 2020
    Publication date: May 21, 2020
    Applicant: SMC Corporation
    Inventors: Yuzuru OKITA, Keisuke IKEDA
  • Publication number: 20200126688
    Abstract: An assembled wire has a substantially rectangular cross section, and is formed by assembling a plurality of strands. Each strand has a conductor portion and a strand insulating layer covering the conductor portion. At least a part of the assembled plurality of strands in the longitudinal direction is covered with an outer insulating layer. The strand is formed as follows. First, the strand insulating layer is coated on the outer periphery of the conductor portion. At this time, a large number of voids are formed in a resin constituting the strand insulating layer. From this state, the strand is formed, for example, by collapsing the strand insulating layer by heating and pressurizing. At this time, it is possible to uniformly collapse the strand insulating layer by crushing the internal voids. Therefore, the voids in the strand are crushed and flattened in the thickness direction of the strand insulating layer over the entire periphery.
    Type: Application
    Filed: December 19, 2019
    Publication date: April 23, 2020
    Inventors: Keisuke Ikeda, Keiichi Tomizawa, Daisuke Muto, Hideo Fukuda
  • Publication number: 20190390918
    Abstract: A disclosed loop heat pipe includes an evaporator configured to absorb heat from outside by a wall to evaporate a working fluid from a liquid phase gas phase; a condenser configured to condense a gas phase working fluid introduced from the evaporator into a liquid phase; an elastic wick configured to contact an inner wall of the evaporator by an elastic force from the elastic wick; and a wick deformation member configured to deform the elastic wick increase a contact pressure of the elastic wick against the inner wall of the evaporator.
    Type: Application
    Filed: June 18, 2019
    Publication date: December 26, 2019
    Inventors: Tomoyasu Hirasawa, Kiyotada Katoh, Takeshi Endoh, Takashi Tanaka, Toshihiko Baba, Keisuke Ikeda, Hiroki Yamasaki
  • Patent number: 10498184
    Abstract: An insulated wire, having: an insulating layer on the outer periphery of a conductor having a rectangular cross-section; an adhesive layer on the outer periphery of the insulating layer; and an insulating paper on the outer periphery of the adhesive layer, wherein the adhesive layer has a thickness of 2 to 50 ?m, and wherein a resin constituting the adhesive layer does not have a melting point and has a tensile modulus at 250° C. of 0.9×107 to 1.2×108 Pa; a coil, comprised of this insulated wire; and an electrical or electronic equipment.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: December 3, 2019
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Keisuke Ikeda, Hideo Fukuda, Takeshi Saito
  • Patent number: 10280827
    Abstract: An engine is configured so that a muffler is affixed to the exhaust opening of the cylinder, and the air-cooled cylinder is cooled by a cooling fan. The engine is provided with a muffler cover for covering the muffler, and exhaust gas is discharged inside the muffler cover along the wall surface of the muffler. A second cooling air is combined with the exhaust gas flow from the upstream side thereof to be parallel thereto, and a first cooling air having been caused to flow under the muffler is caused to perpendicularly impinge against the exhaust gas flow on the downstream side thereof. Thus, the cooling airs are combined inside the muffler cover with the exhaust gas flow, and as a result the temperature of the exhaust gas is sufficiently reduced at the time when the exhaust gas is discharged from the opening of the muffler cover to the outside.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: May 7, 2019
    Assignee: Koki Holdings Co., Ltd.
    Inventors: Naoto Ichihashi, Keisuke Ikeda, Kazuhiro Ootsuka
  • Patent number: 10210966
    Abstract: An insulated wire, containing: a rectangular conductor; and a thermoplastic resin layer on the rectangular conductor, wherein an adhesion strength between the thermoplastic resin layer and the rectangular conductor for a pair of sides of the rectangular conductor opposed to and an adhesion strength between the thermoplastic resin layer and the rectangular conductor for the other pair of sides of the rectangular conductor opposed to are different from each other.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: February 19, 2019
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Satoko Yamoto, Hideo Fukuda, Makoto Oya, Keisuke Ikeda
  • Publication number: 20180375396
    Abstract: An insulated wire, having: an insulating layer on the outer periphery of a conductor having a rectangular cross-section; an adhesive layer on the outer periphery of the insulating layer; and an insulating paper on the outer periphery of the adhesive layer, wherein the adhesive layer has a thickness of 2 to 50 ?m, and wherein a resin constituting the adhesive layer does not have a melting point and has a tensile modulus at 250° C. of 0.9×107 to 1.2×108 Pa; a coil, comprised of this insulated wire; and an electrical or electronic equipment.
    Type: Application
    Filed: August 30, 2018
    Publication date: December 27, 2018
    Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Keisuke IKEDA, Hideo FUKUDA, Takeshi SAITO
  • Publication number: 20180268962
    Abstract: An assembled wire, having: an assembled conductor composed of a plurality of conductor strands each having a rectangular cross-section, stacked and arranged each other across an interlayer insulating layer; an insulating outer layer that coats the assembled conductor including the interlayer insulating layer; and an adhesion layer composed of a thermoplastic resin having a thickness of 3 ?m or more and 10 ?m or less between the assembled conductor and the insulating outer layer.
    Type: Application
    Filed: May 17, 2018
    Publication date: September 20, 2018
    Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Keisuke IKEDA, Hideo FUKUDA
  • Patent number: 10037833
    Abstract: An insulated wire, having at least one layer as an insulation layer, on an outer periphery of a conductor, wherein at least one layer as the insulation layer is composed of a mixed resin of a crystalline resin (A) and a resin (B) having a glass transition temperature higher, by 30° C. or more, than a glass transition temperature of the crystalline resin (A), in which the glass transition temperature is measured by a thermomechanical analysis, and a mixing mass ratio of the mixed resin (a mass of the crystalline resin (A):a mass of the resin (B)) is 90:10 to 51:49; a coil; an electric or electronic equipment; and a method of producing the insulated wire.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: July 31, 2018
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Keisuke Ikeda, Hideo Fukuda
  • Patent number: 9892819
    Abstract: An insulated wire, having a thermosetting resin covering (A), directly or by interposing an insulating layer (C), on a conductor having a rectangular cross-section, and a thermoplastic resin covering (B) on a periphery of the thermosetting resin covering (A), wherein the thermoplastic resin covering (B) has at least two layers of the thermoplastic resin layers, and the thermoplastic resin layers adjacent to each other are formed of thermoplastic resins different from each other, at least one layer of the thermoplastic resin layers is formed of polyether ether ketone or modified polyether ether ketone, and a total thickness of the thermoplastic resin layers is 60 to 120 ?m, and a thickness of a thinnest thermoplastic resin layer is 5 to 20 ?m; and a coil formed by winding processing the insulated wire and an electrical equipment having the coil.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: February 13, 2018
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Keisuke Ikeda, Makoto Oya, Hideo Fukuda
  • Publication number: 20180016964
    Abstract: An engine is configured so that a muffler is affixed to the exhaust opening of the cylinder, and the air-cooled cylinder is cooled by a cooling fan. The engine is provided with a muffler cover for covering the muffler, and exhaust gas is discharged inside the muffler cover along the wall surface of the muffler. A second cooling air is combined with the exhaust gas flow from the upstream side thereof to be parallel thereto, and a first cooling air having been caused to flow under the muffler is caused to perpendicularly impinge against the exhaust gas flow on the downstream side thereof. Thus, the cooling airs are combined inside the muffler cover with the exhaust gas flow, and as a result the temperature of the exhaust gas is sufficiently reduced at the time when the exhaust gas is discharged from the opening of the muffler cover to the outside.
    Type: Application
    Filed: February 26, 2016
    Publication date: January 18, 2018
    Applicant: HITACHI KOKI CO., LTD.
    Inventors: Naoto ICHIHASHI, Keisuke IKEDA, Kazuhiro OOTSUKA
  • Patent number: 9864334
    Abstract: A recording-material cooling device includes a first cooling member, a second cooling member, an approach-and-separation member, and a positioning member. The first cooling member is disposed at a first face side of a recording material to absorb heat of the recording material. The second cooling member is disposed at a second face side of the recording material to absorb heat of the recording material. The approach-and-separation member brings the first cooling member and the second cooling member close to and away from each other. The positioning member positions the first cooling member and the second cooling member relatively brought close to each other by the approach-and-separation member.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: January 9, 2018
    Assignee: Ricoh Company, Ltd.
    Inventors: Keisuke Ikeda, Tomoyasu Hirasawa, Kenichi Takehara, Hiromitsu Fujiya, Keisuke Yuasa, Yasuaki Toda, Susumu Tateyama, Hiroaki Miyagawa, Kenji Ishii, Takeshi Watanabe
  • Publication number: 20170358382
    Abstract: An insulated wire, containing: a rectangular conductor; and a thermoplastic resin layer on the rectangular conductor, wherein an adhesion strength between the thermoplastic resin layer and the rectangular conductor for a pair of sides of the rectangular conductor opposed to and an adhesion strength between the thermoplastic resin layer and the rectangular conductor for the other pair of sides of the rectangular conductor opposed to are different from each other.
    Type: Application
    Filed: June 23, 2017
    Publication date: December 14, 2017
    Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Satoko YAMOTO, Hideo FUKUDA, Makoto OYA, Keisuke IKEDA
  • Patent number: 9728301
    Abstract: An insulated wire having a conductor, and a multilayer insulating layer composed of two or more layers coating the conductor, wherein the innermost insulating layer of the multilayer insulating layer is an insulating layer formed of a crystalline thermoplastic resin having a storage elastic modulus of 10 MPa or more at 300° C. and outer insulating layer(s) other than the innermost insulating layer include(s) an insulating layer formed of a crystalline thermoplastic resin having a melting point of 260° C. or higher and a storage elastic modulus of 1,000 MPa or more at 25° C., and adjacent insulating layers have a relationship such that the storage elastic modulus at 25° C. of the thermoplastic resin of the outer insulating layer is equal to or smaller than the inner insulating layer; and electric/electronic equipment formed using the insulated wire as a winding and/or lead wire of a transformer that is incorporated into the electric/electronic equipment.
    Type: Grant
    Filed: April 16, 2015
    Date of Patent: August 8, 2017
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Keisuke Ikeda, Hideo Fukuda, Daisuke Muto, Keiichi Tomizawa
  • Patent number: 9691521
    Abstract: A rectangular insulated wire includes a rectangular conductor having a generally rectangular cross section, a thermosetting resin layer provided to cover the rectangular conductor, and a plurality of thermoplastic resin layers provided on the thermosetting resin layer. An adhesion strength between the thermosetting resin layer and the thermoplastic resin layer is 50 gf/mm to 100 gf/mm.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: June 27, 2017
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Hideo Fukuda, Makoto Oya, Keisuke Ikeda, Satoko Yamoto, Tsuneo Aoi
  • Publication number: 20170178766
    Abstract: An insulated wire, containing at least one layer of an electrical wire coating, including an extrusion covering resin layer, on an outer periphery of a conductor, wherein the extrusion covering resin layer is composed of a mixed resin of a resin (A) and a resin (B) each having different relative permittivity, wherein the resin (A) is a specific polyallyletherketone resin selected from polyetheretherketone, or the like, wherein the resin (B) is a non-fluorine-based resin having lower relative permittivity at 200° C., than the resin (A), wherein a mixing mass ratio of the mixed resin {a mass of the resin (A):a mass of the resin (B)} is 90:10 to 51:49, and wherein a value of a ratio of the relative permittivity at 200° C. to the relative permittivity at 25° C. and 50% relative humidity; a coil; an electrical or electronic equipment; and a method of producing the insulated wire.
    Type: Application
    Filed: March 8, 2017
    Publication date: June 22, 2017
    Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Takeshi SAITO, Keisuke IKEDA, Hideo FUKUDA
  • Publication number: 20170178765
    Abstract: An insulated wire, having at least one layer as an insulation layer, on an outer periphery of a conductor, wherein at least one layer as the insulation layer is composed of a mixed resin of a crystalline resin (A) and a resin (B) having a glass transition temperature higher, by 30° C. or more, than a glass transition temperature of the crystalline resin (A), in which the glass transition temperature is measured by a thermomechanical analysis, and a mixing mass ratio of the mixed resin (a mass of the crystalline resin (A):a mass of the resin (B)) is 90;10 to 51;49; a coil; an electric or electronic equipment; and a method of producing the insulated wire.
    Type: Application
    Filed: March 8, 2017
    Publication date: June 22, 2017
    Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.
    Inventors: Keisuke IKEDA, Hideo FUKUDA
  • Patent number: 9608410
    Abstract: A surface-emitting light source includes a substrate including a light emitting region where plural light emitting points are disposed and a non-light emitting region located around the light emitting region; and a lens array including plural lenses and a non-lens region around the plural lenses. The substrate and the lens array are directly bonded with each other at the non-light emitting region and the non-lens region such that the plural light emitting points and the plural lenses face each other, and the lens array has a linear expansion coefficient not greater than a linear expansion coefficient of the substrate.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: March 28, 2017
    Assignee: Ricoh Company, Ltd.
    Inventors: Nobuyuki Arai, Keisuke Ikeda, Kenichi Shimizu
  • Patent number: D849795
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: May 28, 2019
    Assignee: Hitachi Koki Co., Ltd.
    Inventors: Takeshi Taniguchi, Shinichi Kakefuda, Youhei Kinugawa, Keisuke Ikeda, Hisashi Irokawa
  • Patent number: D850740
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: June 4, 2019
    Assignee: Hitachi Koki Co., Ltd.
    Inventors: Takeshi Taniguchi, Rui Akiba, Keisuke Ikeda