Patents by Inventor Keisuke OKUMURA
Keisuke OKUMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11154202Abstract: A management method of a patch for managing a sticking state of a patch with respect to an individual having a body temperature includes a step (1) of sticking the patch to the individual, a step (2) of detecting a temperature change caused by sticking the patch to the individual, and a step (3) of judging whether or not the patch is stuck to the individual based on a presence or absence of the temperature change.Type: GrantFiled: February 3, 2017Date of Patent: October 26, 2021Assignee: NITTO DENKO CORPORATIONInventors: Keisuke Okumura, Ryoma Yoshioka
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Publication number: 20210265096Abstract: An inductor includes a wire having a generally circular shape in cross section, and the magnetic layer covering the wire, wherein the wire includes a conductive wire and an insulating layer covering the conductive wire, the magnetic layer contains anisotropic magnetic particles and a binder, and includes in a surrounding region of the wire within 1.5 times the radius of the wire, a first region in which the anisotropic magnetic particles are oriented along the circumferential direction of the wire, and a second region in which the anisotropic magnetic particles are oriented along the crossing direction that crosses the circumferential direction, or in which the anisotropic magnetic particles are not oriented.Type: ApplicationFiled: June 4, 2019Publication date: August 26, 2021Applicant: NITTO DENKO CORPORATIONInventors: Yoshihiro FURUKAWA, Keisuke OKUMURA
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Publication number: 20210252840Abstract: A laminated sheet includes a sheet-shaped inductor including a plurality of wirings and a magnetic layer embedding the plurality of wirings, and a processing stability layer disposed on at least one surface 6 in a thickness direction of the inductor. The magnetic layer includes a binder and a magnetic particle having a generally flat shape and whose material is a metal. The processing stability layer includes a cured product of a thermosetting resin composition. The thermosetting resin composition includes a thermosetting resin as an essential component. The thermosetting resin composition includes at least one kind of particle, as an optical component, selected from the group consisting of a first particle having a generally spherical shape and a second particle having a generally flat shape and whose material is an inorganic compound.Type: ApplicationFiled: February 12, 2021Publication date: August 19, 2021Applicant: NITTO DENKO CORPORATIONInventors: Yoshihiro FURUKAWA, Keisuke OKUMURA
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Publication number: 20210257149Abstract: A mark-including inductor includes a sheet-shaped inductor including a plurality of wirings and a magnetic layer embedding the plurality of wirings, and a mark disposed at one side in a thickness direction of the inductor and/or formed in the magnetic layer.Type: ApplicationFiled: February 12, 2021Publication date: August 19, 2021Applicant: NITTO DENKO CORPORATIONInventors: Keisuke OKUMURA, Yoshihiro FURUKAWA
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Publication number: 20210259111Abstract: A laminated sheet includes a sheet-shaped inductor including a plurality of wirings and a magnetic layer embedding the plurality of wirings, and a mark formable layer disposed on one surface in a thickness direction of the inductor.Type: ApplicationFiled: February 12, 2021Publication date: August 19, 2021Applicant: NITTO DENKO CORPORATIONInventors: Keisuke OKUMURA, Yoshihiro FURUKAWA
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Publication number: 20210257148Abstract: A frame member-including inductor includes an inductor including a plurality of wirings, and a magnetic layer embedding the plurality of wirings, and a frame member in which the inductor is set.Type: ApplicationFiled: February 12, 2021Publication date: August 19, 2021Applicant: NITTO DENKO CORPORATIONInventors: Yoshihiro FURUKAWA, Keisuke OKUMURA
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Publication number: 20210249171Abstract: A magnetic wiring circuit board includes an insulating layer; a wire disposed on a one-side surface in a thickness direction of the insulating layer and having a one-side surface in the thickness direction disposed to face the one-side surface in the thickness direction of the insulting layer at spaced intervals thereto, an other-side surface in the thickness direction in contact with the one-side surface in the thickness direction of the insulating layer, and side surfaces each connecting an end edge of the one-side surface in the thickness direction to an end edge of the other-side surface in the thickness direction; and a magnetic layer containing a magnetic particle having a shape of an aspect ratio of 2 or more and embedding the wire.Type: ApplicationFiled: October 19, 2018Publication date: August 12, 2021Applicant: NITTO DENKO CORPORATIONInventors: Keisuke OKUMURA, Yoshihiro FURUKAWA
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Patent number: 11073645Abstract: A temperature sensor includes a solar cell, and a thermochromic resin covering the solar cell and having a light transmittance changeable according to a temperature change.Type: GrantFiled: February 3, 2017Date of Patent: July 27, 2021Assignee: NITTO DENKO CORPORATIONInventors: Keisuke Okumura, Ryoma Yoshioka
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Patent number: 11006515Abstract: A magnetic wiring circuit board includes an insulating layer, a plurality of wiring portions spaced from each other, a magnetic layer disposed so as to embed the plurality of wiring portions on the insulating layer, and a suppressing portion for suppressing magnetic coupling of at least the two wiring portions.Type: GrantFiled: April 2, 2019Date of Patent: May 11, 2021Assignee: NITTO DENKO CORPORATIONInventors: Yoshihiro Furukawa, Keisuke Okumura
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Patent number: 11006530Abstract: A method for producing a wired circuit board includes a step (1) of forming a seed layer on one surface in a thickness direction of a peeling layer, a step (2) of forming a conductive pattern on one surface in the thickness direction of the seed layer, a step (3) of covering the seed layer and the conductive pattern with an insulating layer, a step (4) of peeling the peeling layer from the seed layer, and a step (5) of removing the seed layer. The insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.Type: GrantFiled: June 1, 2016Date of Patent: May 11, 2021Assignee: NITTO DENKO CORPORATIONInventors: Keisuke Okumura, Eiji Toyoda, Shotaro Masuda
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Patent number: 10998484Abstract: Provided is a semiconductor device manufacturing method which can suppress the occurrence of positional deviation or inclination of a semiconductor element when the semiconductor element is fixed so as to be sandwiched-between two insulating substrates. The semiconductor device manufacturing method includes: obtaining a laminated body in which a semiconductor element is temporarily adhered on a first electrode formed on a first insulating substrate with a first pre-sintering layer sandwiched therebetween; temporarily adhering the semiconductor element on a second electrode formed on a second insulating substrate with a second pre-sintering layer sandwiched therebetween, the second pre-sintering layer being provided on a side opposite to the first pre-sintering layer, to obtain a semiconductor device precursor; and simultaneously heating the first pre-sintering layer and the second pre-sintering layer, to bond the semiconductor element to the first electrode and the second electrode.Type: GrantFiled: October 4, 2016Date of Patent: May 4, 2021Assignee: NITTO DENKO CORPORATIONInventors: Keisuke Okumura, Satoshi Honda
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Publication number: 20210037640Abstract: A magnetic wiring circuit board includes an insulating layer, a plurality of wiring portions spaced from each other, a magnetic layer disposed so as to embed the plurality of wiring portions on the, and a suppressing portion for suppressing magnetic coupling of at least the two wiring portions.Type: ApplicationFiled: April 2, 2019Publication date: February 4, 2021Applicant: NITTO DENKO CORPORATIONInventors: Yoshihiro FURUKAWA, Keisuke OKUMURA
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Publication number: 20200075238Abstract: A method for producing a module includes a first step of preparing a conductive layer disposed at one side in a thickness direction of a first peeling layer, a second step of forming a conductive pattern from the conductive layer, a third step of pushing the conductive pattern into a first adhesive layer containing a first magnetic particle and a first resin component, and a fourth step of peeling the first peeling layer.Type: ApplicationFiled: November 16, 2017Publication date: March 5, 2020Applicant: NITTO DENKO CORPORATIONInventors: Keisuke OKUMURA, Yoshihiro FURUKAWA
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Publication number: 20200066441Abstract: A method for producing a module includes a first step of preparing a seed layer disposed at a one-side surface in a thickness direction of a first peeling layer, a second step of forming a conductive pattern at a one-side surface in the thickness direction of the seed layer by plating allowing electric power to be supplied from the seed layer, a third step of pushing the conductive pattern into a first adhesive layer containing a first magnetic particle, and a fourth step of exposing the other-side surfaces in the thickness direction of the conductive pattern and the first adhesive layer.Type: ApplicationFiled: November 16, 2017Publication date: February 27, 2020Applicant: NITTO DENKO CORPORATIONInventors: Yoshihiro FURUKAWA, Keisuke OKUMURA
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Publication number: 20190344061Abstract: A management method of a patch for managing a sticking state of a patch with respect to an individual having a body temperature includes a step (1) of sticking the patch to the individual, a step (2) of detecting a temperature change caused by sticking the patch to the individual, and a step (3) of judging whether or not the patch is stuck to the individual based on a presence or absence of the temperature change.Type: ApplicationFiled: February 3, 2017Publication date: November 14, 2019Applicant: NITTO DENKO CORPORATIONInventors: Keisuke OKUMURA, Ryoma YOSHIOKA
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Publication number: 20190346602Abstract: A temperature sensor includes a solar cell, and a thermochromic resin covering the solar cell and having a light transmittance changeable according to a temperature change.Type: ApplicationFiled: February 3, 2017Publication date: November 14, 2019Applicant: NITTO DENKO CORPORATIONInventors: Keisuke OKUMURA, Ryoma YOSHIOKA
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Publication number: 20190051807Abstract: Provided is a semiconductor device manufacturing method which can suppress the occurrence of positional deviation or inclination of a semiconductor element when the semiconductor element is fixed so as to be sandwiched-between two insulating substrates. The semiconductor device manufacturing method includes: obtaining a laminated body in which a semiconductor element is temporarily adhered on a first electrode formed on a first insulating substrate with a first pre-sintering layer sandwiched therebetween; temporarily adhering the semiconductor element on a second electrode formed on a second insulating substrate with a second pre-sintering layer sandwiched therebetween, the second pre-sintering layer being provided on a side opposite to the first pre-sintering layer, to obtain a semiconductor device precursor; and simultaneously heating the first pre-sintering layer and the second pre-sintering layer, to bond the semiconductor element to the first electrode and the second electrode.Type: ApplicationFiled: October 4, 2016Publication date: February 14, 2019Inventors: Keisuke OKUMURA, Satoshi HONDA
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Patent number: 10194861Abstract: A wired circuit board includes an insulating layer and a conductive pattern embedded in the insulating layer. The conductive pattern has an exposed surface exposed from one surface in a thickness direction of the insulating layer and the insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.Type: GrantFiled: June 1, 2016Date of Patent: February 5, 2019Assignee: NITTO DENKO CORPORATIONInventors: Keisuke Okumura, Eiji Toyoda, Shotaro Masuda
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Publication number: 20180192948Abstract: A wired circuit board includes an insulating layer and a conductive pattern embedded in the insulating layer. The conductive pattern has an exposed surface exposed from one surface in a thickness direction of the insulating layer and the insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.Type: ApplicationFiled: June 1, 2016Publication date: July 12, 2018Applicant: NITTO DENKO CORPORATIONInventors: Keisuke OKUMURA, Eiji TOYODA, Shotaro MASUDA
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Publication number: 20180199443Abstract: A method for producing a wired circuit board includes a step (1) of forming a seed layer on one surface in a thickness direction of a peeling layer, a step (2) of forming a conductive pattern on one surface in the thickness direction of the seed layer, a step (3) of covering the seed layer and the conductive pattern with an insulating layer, a step (4) of peeling the peeling layer from the seed layer, and a step (5) of removing the seed layer. The insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.Type: ApplicationFiled: June 1, 2016Publication date: July 12, 2018Applicant: NITTO DENKO CORPORATIONInventors: Keisuke OKUMURA, Eiji TOYODA, Shotaro MASUDA