Patents by Inventor Keisuke Tsunetsugu

Keisuke Tsunetsugu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7571582
    Abstract: A vacuum heat insulator according to the present invention includes a core molded to be plate-shaped with the use of a binding agent. The vacuum heat insulator assumes any one of the following configurations. A) The core is formed by curing a fiber aggregate by means of a binding agent. The fibers have an average fiber diameter of at least 0.1 ?m but at most 10 ?m, and voids defined by fibers have a void diameter of at most 40 ?m. The core has a percentage of the voids of at least 80%. B) The binding agent is varied in concentration in a through-thickness direction of the core. C) A cured layer solidified by the binding agent is formed on at least one side surface of the core. D) The core contains fibers having a length of at most 100 ?m. The fibers are oriented perpendicular to a direction of heat transmission. Such vacuum heat insulator is excellent in adiabatic property.
    Type: Grant
    Filed: June 2, 2003
    Date of Patent: August 11, 2009
    Assignee: Panasonic Corporation
    Inventors: Yoshihide Hirai, Chie Hirai, Yasuaki Tanimoto, Keisuke Tsunetsugu, Hiroto Nakama, Yukako Akeyama
  • Patent number: 7537817
    Abstract: In a vacuum heat insulator, a heat seal layer of its enveloping member of a laminated structure is made of a film having a melting point of at least 200° C. Alternatively, the heat seal layer is made of a film having a melting point above 100° C. and below 200° C., and fins are bent on a low-temperature side. Either of these structures can inhibit a decrease in gas barrier property even in a high-temperature atmosphere of approx. 150° C. Thus, the heat-insulating property of the vacuum heat insulator is maintained for a long period of time. This vacuum heat insulator is preferable for an apparatus that has a heat source or a portion to be kept warm exceeding a temperature of 100° C.
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: May 26, 2009
    Assignee: Panasonic Corporation
    Inventors: Keisuke Tsunetsugu, Hiroto Nakama
  • Publication number: 20060263571
    Abstract: In a vacuum heat insulator, a heat seal layer of its enveloping member of a laminated structure is made of a film having a melting point of at least 200° C. Alternatively, the heat seal layer is made of a film having a melting point above 100° C. and below 200° C., and fins are bent on a low-temperature side. Either of these structures can inhibit a decrease in gas barrier property even in a high-temperature atmosphere of approx. 150° C. Thus, the heat-insulating property of the vacuum heat insulator is maintained for a long period of time. This vacuum heat insulator is preferable for an apparatus that has a heat source or a portion to be kept warm exceeding a temperature of 100° C.
    Type: Application
    Filed: March 29, 2004
    Publication date: November 23, 2006
    Inventors: Keisuke Tsunetsugu, Hiroto Nakama
  • Publication number: 20050175809
    Abstract: A vacuum heat insulator according to the present invention includes a core molded to be plate-shaped with the use of a binding agent. The vacuum heat insulator assumes any one of the following configurations. A) The core is formed by curing a fiber aggregate by means of a binding agent. The fibers have an average fiber diameter of at least 0.1 ?m but at most 10 ?m, and voids defined by fibers have a void diameter of at most 40 ?m. The core has a percentage of the voids of at least 80%. B) The binding agent is varied in concentration in a through-thickness direction of the core. C) A cured layer solidified by the binding agent is formed on at least one side surface of the core. D) The core contains fibers having a length of at most 100 ?m. The fibers are oriented perpendicular to a direction of heat transmission. Such vacuum heat insulator is excellent in adiabatic property.
    Type: Application
    Filed: June 2, 2003
    Publication date: August 11, 2005
    Applicant: Matsushita Refrigeration Co.
    Inventors: Yoshihide Hirai, Chie Hirai, Yasuaki Tanimoto, Keisuke Tsunetsugu, Hiroto Nakama, Yukako Akeyama