Patents by Inventor Keith Bodendorf

Keith Bodendorf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220235557
    Abstract: A device for making a molded stair tread is described. The device can have: a base; a pivoting assembly; a molding template connected to the pivoting assembly; a holding device connected to the molding template, the holding device having a clamp jaw and a pivot configured to rotate the holding device relative to the molding template; and a locking mechanism configured to hold the molding template and the holding device in an open configuration such that the holding device can accept a first part of the plastic sheet and configured to release the molding template and the holding device such that the holding device is in a securing configuration that secures, via the clamp jaw, the first part of the plastic sheet to the first side of the molding template at the first longitudinal edge of the molding template. Methods for making the stair tread are described as well as the molded stair tread.
    Type: Application
    Filed: April 13, 2022
    Publication date: July 28, 2022
    Applicant: Mannington Mills, Inc.
    Inventors: Keith BODENDORF, Dennis H. BRADWAY, Joseph F. FINLAW
  • Patent number: 11332941
    Abstract: A device for making a molded stair tread is described. The device can have: a base; a pivoting assembly; a molding template connected to the pivoting assembly; a holding device connected to the molding template, the holding device having a clamp jaw and a pivot configured to rotate the holding device relative to the molding template; and a locking mechanism configured to hold the molding template and the holding device in an open configuration such that the holding device can accept a first part of the plastic sheet and configured to release the molding template and the holding device such that the holding device is in a securing configuration that secures, via the clamp jaw, the first part of the plastic sheet to the first side of the molding template at the first longitudinal edge of the molding template. Methods for making the stair tread are described as well as the molded stair tread.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: May 17, 2022
    Assignee: MANNINGTON MILLS, INC.
    Inventors: Keith Bodendorf, Dennis H. Bradway, Joseph F. Finlaw
  • Publication number: 20210010272
    Abstract: A device for making a molded stair tread is described. The device can have: a base; a pivoting assembly; a molding template connected to the pivoting assembly; a holding device connected to the molding template, the holding device having a clamp jaw and a pivot configured to rotate the holding device relative to the molding template; and a locking mechanism configured to hold the molding template and the holding device in an open configuration such that the holding device can accept a first part of the plastic sheet and configured to release the molding template and the holding device such that the holding device is in a securing configuration that secures, via the clamp jaw, the first part of the plastic sheet to the first side of the molding template at the first longitudinal edge of the molding template. Methods for making the stair tread are described as well as the molded stair tread.
    Type: Application
    Filed: June 23, 2020
    Publication date: January 14, 2021
    Applicant: Mannington Mills, Inc.
    Inventors: Keith BODENDORF, Dennis H. BRADWAY, Joseph F. FINLAW
  • Publication number: 20020023844
    Abstract: A one-step, integrated process and apparatus for producing electrolytic copper foil having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, which employs two “super anodes” on a rotating drum cathode to deposit the treatment.
    Type: Application
    Filed: June 11, 2001
    Publication date: February 28, 2002
    Applicant: Yates Foil USA, Inc.
    Inventors: Charles B. Yates, George Gaskill, Ajesh Shah, Chinsai T. Cheng, Keith Bodendorf, Adam M. Wolski
  • Patent number: 6270648
    Abstract: A one-step, integrated process and apparatus for producing electrolytic copper foil having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, which employs two “super anodes” on a rotating drum cathode to deposit the treatment.
    Type: Grant
    Filed: October 22, 1999
    Date of Patent: August 7, 2001
    Assignee: Yates Foil USA, Inc.
    Inventors: Charles B. Yates, George Gaskill, Ajesh Shah, Chinsai T. Cheng, Keith Bodendorf, Adam M. Wolski
  • Patent number: 6270645
    Abstract: A simplified process and apparatus for electrodepositing a bond-enhancing copper treatment layer on a surface of copper foil, preferably wherein a single treatment layer is uniformly applied on raw copper foil using a current density of from about 40 to about 100 A/ft2, a plating time of greater than 30 seconds, and the electrolyte is a copper sulfate-sulfuric acid solution containing arsenic, chloride ions and 2 imidazalidinethione. The raw foil is transferred to a station for applying the treatment directly from a rotating drum cathode machine on which it is produced, at the same speed at which the raw foil is produced, and then to a barrier layer station, a stainproofing station and a chemical adhesion promoter station, after which it is dried and coiled.
    Type: Grant
    Filed: September 26, 1997
    Date of Patent: August 7, 2001
    Assignee: Circuit Foil USA, Inc.
    Inventors: Charles B. Yates, Adam Wolski, George Gaskill, Chinsai T. Cheng, Keith Bodendorf, Paul Dufresne
  • Patent number: 5989727
    Abstract: Treated electrolytic copper foil wherein the shiny side of the raw foil is modified and smoothed by an electrodeposited copper gilding layer, a copper-clad laminate produced with such foil, and an electrical circuit produced from such a laminate. The preferred foil has the surface of the shiny side of the raw foil modified by an electrodeposited copper gilding layer, a copper dendritic layer electrodeposited on the gilding layer, and a second copper gilding layer electrodeposited on the first dendritic layer, while a copper dendritic layer is electrodeposited on the surface of the matte side of the foil, and a copper gilding is electrodeposited on the latter dendritic layer.
    Type: Grant
    Filed: March 4, 1998
    Date of Patent: November 23, 1999
    Assignee: Circuit Foil U.S.A., Inc.
    Inventors: Charles B. Yates, Adam Wolski, George Gaskill, Chinsai T. Cheng, Keith Bodendorf, Paul Dufresne