Abstract: A buffer station for thermal control of semiconductor substrates in a semiconductor substrate processing system is configured to interface with first and second vacuum transfer modules of the system so as to allow substrates to be transferred therebetween. The buffer station comprises a first vacuum transfer module interface configured to allow substrates to be transferred between the first vacuum transfer module and the buffer station, and a second transfer module interface configured to allow substrates to be transferred between the second vacuum transfer module and the buffer station. At least one buffer chamber between the first and second vacuum transfer module interfaces includes a lower pedestal configured to receive a substrate on a support surface thereof. One or more semiconductor substrate storage shelves are above the lower pedestal. Each shelf is configured to receive a substrate from the first or second vacuum transfer module and store the respective substrate thereon.

Abstract: A buffer station for thermal control of semiconductor substrates in a semiconductor substrate processing system is configured to interface with first and second vacuum transfer modules of the system so as to allow substrates to be transferred therebetween. The buffer station comprises a first vacuum transfer module interface configured to allow substrates to be transferred between the first vacuum transfer module and the buffer station, and a second transfer module interface configured to allow substrates to be transferred between the second vacuum transfer module and the buffer station. At least one buffer chamber between the first and second vacuum transfer module interfaces includes a lower pedestal configured to receive a substrate on a support surface thereof. One or more semiconductor substrate storage shelves are above the lower pedestal. Each shelf is configured to receive a substrate from the first or second vacuum transfer module and store the respective substrate thereon.

Abstract: Embodiments include a disk drive having a drive motor assembly including at least one component selected from the group consisting of a rotatable hub, disk spacer, disk clamp, backiron, lower bearing bushing, and lower mounting flange. At least one of the components comprises a low sulfur outgassing free machining stainless steel material. The low sulfur outgassing free machining stainless steel material may include a free machining stainless steel that outgases sulfur at a rate insufficient to cause visually observable sulfide corrosion when tested by placing a copper strip into contact with the free machining stainless steel in an environment having a temperature of 50° C. and 90% relative humidity for a 7 day test period and then observing the copper strip.