Abstract: Implant devices described herein may be adapted to communicate with other devices via an antenna array. The antenna array may be configured to minimize radiation to surrounding tissue and/or maximize signal power in a direction of device(s) with which the implant device communicates.

Abstract: Implant devices described herein may be adapted to communicate with other devices via an antenna array. The antenna array may be configured to minimize radiation to surrounding tissue and/or maximize signal power in a direction of device(s) with which the implant device communicates.

Abstract: An article comprising a tunable filter includes an optical cavity, a tuning device and a filter-disabling device. The tuning device is operable to change the center transmission wavelength of the tunable filter. The filter-disabling device is operable to temporarily disrupt the finesse or otherwise affect the transmissibility of the optical cavity, thereby preventing the transmission of any intervening wavelengths during tuning.

Abstract: A Vertical Cavity Surface Emitting Laser, VSEL. Prior-art VCSELs contain an optical cavity between two mirrors. Near one mirror are positioned current blockers which surround part of the cavity and prevent current from reaching regions of the cavity which are near edges of that mirror. If current reached those regions, lasing would occur there, and the light produced would be scattered by the nearby edges of the mirror. The current blockers reduce that scattering. However, the fabrication steps following those which create the current blockers are expensive. The invention eliminates the expensive steps by (1) placing a layer of gold atop the current blockers and the surrounded lasing region, (2) placing a dielectric layer of high index H atop the gold layer, and (3) placing a quarter-wave stack atop the high index dielectric layer, in the sequence L-H-L- . . . -H-L-H, wherein H represents a high index and L represents a low index. The gold delivers current to the cavity.

Abstract: A micro-mechanical optical modulator having a movable membrane that is spaced from a multi-layer mirror that is disposed on a substrate. The multi-layer mirror includes an anti-reflection layer that is disposed on the substrate, and a coating layer that is disposed on the anti-reflection layer. The combined thickness of the membrane and the coating layer is equal to an integer multiple of one-half of the operating wavelength of the modulator. This thickness restriction is different than prior art Fabry-Perot cavity modulators, which typically independently restrict membrane thickness and coating layer thickness, each to multiples of one quarter of the operating wavelength. By relaxing the requirements imposed by the prior art on layer thickness, modulator performance parameters can be optimized. Specifically, optical bandwidth can be traded for insertion loss and vice versa, as suits the specifics of a particular application.

Abstract: An improved opto-electronic device includes a metallic anti-reflection mirror. The metallic anti-reflection mirror has a first metal layer that is disposed on the substrate of the opto-electronic device, a dielectric layer that is disposed on the first metal layer, and second metal layer that is disposed on the dielectric layer. This layer structure, in combination with particular layer thicknesses and materials selection, creates a cavity that enhances the optical field in second metal layer such that any stray light that is generated by or received by the opto-electronic device is substantially absorbed.

Abstract: A multiple channel transmission system includes at least two plug in modules interconnected by a plurality of optical fiber bundles. For greater transceiver density and design flexibility, two-dimensional transceiver arrays (e.g., N×M arrays of transmitters and/or receivers) are mounted on a major surface of each plug-in module. Optical fiber connectors are employed at a peripheral edge of each plug-in module, and optical fibers interconnecting the transceivers and corresponding edge mounted connectors are bundled into two dimensional (N×M) arrays at the point where they are optically coupled to two dimensional transceiver arrays (e.g., N×M arrays of transmitters and/or receivers). The bundle groups exiting each transmitter array fan out or diverge as they approach a corresponding group of edge mounted fiber connectors. Optical interconnections between plug-in modules are achieved by fiber connections between edge mounted connectors.

Abstract: A Vertical Cavity Surface Emitting Laser, VSEL. Prior-art VCSELs contain an optical cavity between two mirrors. Near one mirror are positioned current blockers which surround part of the cavity and prevent current from reaching regions of the cavity which are near edges of that mirror. If current reached those regions, lasing would occur there, and the light produced would be scattered by the nearby edges of the mirror. The current blockers reduce that scattering. However, the fabrication steps following those which create the current blockers are expensive. The invention eliminates the expensive steps by (1) placing a layer of gold atop the current blockers and the surrounded lasing region, (2) placing a dielectric layer of high index H atop the gold layer, and (3) placing a quarter-wave stack atop the high index dielectric layer, in the sequence L-H-L- . . . -H-L-H, wherein H represents a high index and L represents a low index. The gold delivers current to the cavity.

Abstract: Mechanically compliant bumps for flip-chip bonding have a base that is deposited, for example, on the contact pad of a semiconductor chip. A thin wall depends from the periphery of the upper surface of base. The wall advantageously completely encircles the upper surface of the mechanically compliant bump. The wall, which is capable of flexing or deforming under pressure provides mechanical compliance. The wall is able to flex or deform under pressure even if the bump is formed from high-temperature metal. These mechanically compliant bumps facilitate sound electrical connections even when an electronics device is brought into contact for bonding out of parallel.

Abstract: During device design, wire bonds are typically considered lumped electrical parasitic elements. To minimize their effect, designs attempt to reduced their length. In the invention, wire bonds are considered as transmission lines and their spacing and configuration on the device planned accordingly. Specifically, bond wires are treated as “coplanar wires.” By selecting a proper combination on wire diameter, bond wire spacing, separation of the bond wires from the substrate and the substrate dielectric constant, a desired bond wire impedance is achievable.

Abstract: A modulator that provides low insertion loss and wide bandwidth. The modulator has a single layer, quarter wave membrane that is suspended over a substrate. The membrane has a refractive index, nm, in a range of about 1.1ns0.5≦nm≦1.4ns0.5. When actuated, the membrane moves toward the substrate, altering the reflectivity of the modulator. In some embodiments, the substrate is germanium, which has a protective layer disposed thereon to protect it from etchant during MEMS fabrication procedures.

Abstract: A flip-chip bonding system. In flip chip bonding, a planar array of metallic pads is bonded to a mirror-image array by a film of solder between each pad-pair. Prior to bonding, testing may be done, by applying a mechanical probe to the pads, and reading, or applying, electrical signals. The probe may damage very small pads. Under the invention, small pads are configured in two parts, connected together. One part is used for probing, and the other is used to make the solder connection.

Abstract: Mechanically compliant bumps for flip-chip bonding have a base that is deposited, for example, on the contact pad of a semiconductor chip. A thin wall depends from the periphery of the upper surface of base. The wall advantageously completely encircles the upper surface of the mechanically compliant bump. The wall, which is capable of flexing or deforming under pressure provides mechanical compliance. The wall is able to flex or deform under pressure even if the bump is formed from high-temperature metal. These mechanically compliant bumps facilitate sound electrical connections even when an electronics device is brought into contact for bonding out of parallel.

Abstract: An article and method including an optical fiber coupled to a microstructure which is easily manufactured. The microstructure is comprised of a plurality of layers including a receptacle layer and a movable layer. The optical fiber has a high reflectivity terminal end forming the non-movable layer. The receptacle layer has an opening aligned with the movable layer for receiving the terminal end of the optical fiber. The optical fiber is inserted into the opening and the receptacle layer and fixed in relation to the microstructure, so as to form cavity between the terminal end of the fiber and the movable layer of the microstructure. The movable layer is physically adapted for moving relative to the non-movable layer under the influence of an actuating force.

Abstract: A robotic optical cross-connect to operate with three motors irrespective of the number of input fibers. A preferred embodiment includes a ferrule loader arm operated by a first motor; a ferrule loader ring rotatably operated by a second motor; and a loading piston upon which the ferrule loader-ring is mounted. The first motor imparts a motion to the ferrule loader arm in a first direction. The loading piston imparts a motion to the ferrule loader ring in a second direction, the second direction being substantially orthogonal to the first direction. A plurality of connectorized patch fibers is connected at a first end (leaving a second end free) to a first fiber bundle arranged in a substantially circular fashion. A second fiber bundle is also arranged in a substantially circular fashion and is configured to receive connections from the free second end of the plurality of patch fibers. Ferrules are loaded from the ferrule loader arm onto the ferrule loader ring.

Abstract: An optical detector is provided including a substantially annular metallic ring positioned on either side of an active (i.e. intrinsic) region of the optical detector to minimize optical crosstalk. Optical crosstalk originates from adjacent optical sources (e.g., VCSELs) emitting light toward the direction of the optical detector. The metallic ring prevents the light which propagates substantially parallel to a base of the optical detector from reaching the active region of the optical detector.

Abstract: A direct-view display comprising an array of micro-mechanical modulators is disclosed, he modulator used to form the display comprises a suspended, vertically moving membrane and a substrate. The device functions based on optical interference effects between the membrane and the substrate which cause the modulator to either substantially reflect or absorb an optical signal. The interference effects are a function of the size of the air gap between the membrane and substrate, which varies as the membrane moves. The membrane moves in response to a data signal, representative of an image, delivered to the modulator. The display generates an image based on the pattern of light and dark sections of the display corresponding to the reflectivity of each modulator at a given point in time.

Abstract: An in-situ method is disclosed for highly accurate lattice matching using reflection high energy electron diffraction dynamics. The method includes the steps of providing a substrate of a first semiconductor material and initiating growth of a second semiconductor material thereon. The oscillation amplitude of intensity I of waveform cycles is monitored using reflection high energy electron diffraction. A maximum intensity I.sup.+ and a minimum intensity I.sup.- is determined over a predetermined number of waveform cycles. The intensity drop .DELTA.I from initial reflectivity to minimum reflectivity of the waveform cycles is determined and normalized figure of merit FM is calculated for the predetermined number of waveform cycles using the relationship: ##EQU1## The fluxes of the second semiconductor material are then adjusted to maximize FM and optimize matching.

Abstract: Optoelectronic devices such as photodetectors, modulators and lasers with improved optical properties are provided with an atomically smooth transition between the buried conductive layer and quantum-well-diode-containing intrinsic region of a p-i-n structure. The buried conductive layer is grown on an underlying substrate utilizing a surfactant-assisted growth technique. The dopant and dopant concentration are selected, as a function of the thickness of the conductive layer to be formed, so that a surface impurity concentration of from 0.1 to 1 monolayer of dopant atoms is provided. The presence of the impurities promotes atomic ordering at the interface between the conductive layer and the intrinsic region, and subsequently results in sharp barriers between the alternating layers comprising the quantum-well-diodes of the intrinsic layer.

Abstract: An optical subsystem arrangement enables the electrical conductive or non-conductive bonding of an optical device to ferrules containing an optical fiber or to the optical fiber itself. In one embodiment, one or more contacts deposited on an end-face of the ferrule is bonded to one or more contacts on the optical component. Another embodiment is an opto/electrical connector for interconnecting an optical fiber through an optoelectronic component to one or more electrical facilities. Another arrangement enables the interconnecting of a plurality of optical devices to a plurality of optical fibers.