Abstract: A solder pump includes a pump body having a solder reservoir and pump chamber formed therein in fluid communication with each other. A nozzle portion is provided in communication with the pump chamber for dispensing solder. A thin movable diaphragm is positioned adjacent the pump chamber and movable into the pump chamber for selectively pressurizing solder in the pump chamber for dispensing solder through the nozzle portion. A diaphragm clamp is secured to the body for supporting the diaphragm. The clamp includes an internal channel extending therein and enclosed by the diaphragm. The channel is provided in communication with a source of pressurized air for selectively forcing the diaphragm into the pump chamber. An adjustable stop is positioned within the pump chamber adjacent the diaphragm for limiting movement of the diaphragm into the pump chamber.