Abstract: A tantalum oxide film is formed on a lower conductive film by vapor-deposition, and then is treated with active oxygen species. The treated film is annealed at a temperature lower than the crystallization temperature of tantalum oxide by 10 to 80° C. in an inert atmosphere. Subsequently, an upper conductive film is formed on the annealed tantalum oxide film.

Abstract: A method of reducing by-product deposition inside wafer processing equipment includes providing a chamber having a peripheral inner wall and placing a semiconductor wafer within the chamber. The method also includes placing a ring within the chamber proximate the peripheral inner wall and introducing a plurality of reactant gases into the chamber and reacting the gases. The method also includes introducing a heated gas into the chamber through the ring proximate the peripheral inner wall to increase the temperature of the peripheral inner wall.

Abstract: A method of reducing by-product deposition inside wafer processing equipment includes providing a chamber having a peripheral inner wall and placing a semiconductor wafer within the chamber. The method also includes placing a ring within the chamber proximate the peripheral inner wall and introducing a plurality of reactant gases into the chamber and reacting the gases. The method also includes introducing a heated gas into the chamber through the ring proximate the peripheral inner wall to increase the temperature of the peripheral inner wall.

Abstract: Rapid thermal nitridation is carried out to form a nitride film on a lower electrode which is made of silicon, and a tantalum oxide dielectric film is further formed thereon. Then, wet oxidization is carried out to oxidize the lower electrode through the dielectric film and the nitride film, thus an oxide film is formed between the lower electrode and the nitride film. Further, silicon which is not bonded to nitrogen in the nitride film is oxidized, thus an oxide film whose effective thickness is equal to or greater than 2 nm. The oxidization also recrystallizes the dielectric film. Finally, an upper electrode is formed, and the capacitor is completed.

Abstract: Rapid thermal nitridation is carried out to form a nitride film (19) on a lower electrode (15) which is made of silicon, and a tantalum oxide dielectric film (23) is further formed thereon. Then, wet oxidization is carried out to oxidize the lower electrode through the dielectric film (23) and the nitride film (19), thus an oxide film (17) is formed between the lower electrode (15) and the nitride film (19). Further, silicon which is not bonded to nitrogen in the nitride film (19) is oxidized, thus an oxide film (21) whose effective thickness is equal to or greater than 2 nm. The oxidization also recrystallizes the dielectric film (23). Finally, an upper electrode (25) is formed, and the capacitor is completed.

Abstract: A semiconductor device fabricating method includes a preparatory process that brings a first source gas containing tungsten atoms into contact with a workpiece and that does not bring a second source gas containing nitrogen atoms into contact with the workpiece, and a film forming process that forms a tungsten nitride film on the workpiece by using the first and the second source gases so as to fabricate a semiconductor device. The semiconductor device fabricating method is capable of preventing the tungsten nitride film from peeling off from a layer underlying the same when the tungsten nitride film is subjected to heat treatment.

Abstract: In a silicon nitride film formation method, a substrate to be subjected to film formation is heated, and silicon tetrachloride and ammonia gases are supplied to the substrate heated to a predetermined temperature. The ratio of the partial pressure of the silicon tetrachloride gas to that of the ammonia gas is set to not less than 0.5.

Abstract: A tantalum oxide film is formed on a lower conductive film by vapor-deposition, and then is treated with active oxygen species. The treated film is annealed at a temperature lower than the crystallization temperature of tantalum oxide by 10 to 80° C. in an inert atmosphere. Subsequently, an upper conductive film is formed on the annealed tantalum oxide film.

Abstract: A method of reducing by-product deposition inside wafer processing equipment includes providing a chamber having a peripheral inner wall and placing a semiconductor wafer within the chamber. The method also includes placing a ring within the chamber proximate the peripheral inner wall and introducing a plurality of reactant gases into the chamber and reacting the gases. The method also includes introducing a heated gas into the chamber through the ring proximate the peripheral inner wall to increase the temperature of the peripheral inner wall.

Abstract: Novel 4H-3,1-benzoxazine derivative of the formula: ##STR1## wherein X and Y each independently represent a halogen atom of a lower alkyl group; m and n each independently represent an integer of 0 to 2, and when m or n is 2, the plurality or each of X or Y may have the same or different meanings; R is a hydrogen atom, an alkyloxy group, an alkynyloxy group, an alkylthio group or an alkenylthio group, and a process for their production are provided. The compounds are highly effective against pathogenic fungi while being well tolerated by cultivated plants.

Abstract: Novel acetal compounds of the formula: ##STR1## wherein X is a halogen atom, a trifluromethyl group or a lower alkyl group; Y is a halogen atom, a lower alkyl group or a lower alkyloxy group; m and n each independently are an integer of 0 to 2, and when m or n is 2, the plurality of each of X or Y may have the same or different meanings; R.sub.1 and R.sub.2 independently represent a saturated or unsaturated lower hydrocarbon residue, or R.sub.1 and R.sub.2 together form a substituted or unsubstituted alkylene chain which, when taken together with ##STR2## to which they are attached, form a ring structure, and a process for their production are provided. The compounds are highly effective against pathogenic fungi while being well tolerated by cultivated plants.