Abstract: In an exemplary embodiment, a coil component includes: an element body part 10 that is formed containing a magnetic material; a coil 40 that is embedded within the element body part 10 and constituted by a wound conductive wire; lead wires 44a, 44b that are extended from the conductive wire and are led out from the coil 40; and terminal parts 70a, 70b that are joined to the lead wires 44a, 44b; wherein tip parts 46a, 46b of the lead wires 44a, 44b, each having a prescribed length from the tip, are embedded in the element body part 10 and also extend along the bottom face 22 of the element body part 10, and the terminal parts 70a, 70b are joined to the tip parts 46a, 46b of the lead wires 44a, 44b on the bottom face 22 of the element body part 10.

Abstract: A coil component, adopted to be mounted on an electronic device, includes: an element body part; a coil fixed to the element body part and constituted by a wound conductive wire; lead wires that are each extended from the conductive wire and led out from the coil, and whose tip parts are each disposed a bottom face, which is a mounting face, of the element body part; and terminal parts that are each constituted by the tip part and a metal member that is joined to the tip part on the bottom face, and also has an opening at a position overlapping the tip part in a direction intersecting the bottom face.

Abstract: A coil component, adopted to be mounted on an electronic device, includes: an element body part; a coil fixed to the element body part and constituted by a wound conductive wire; lead wires that are each extended from the conductive wire and led out from the coil, and whose tip parts are each disposed a bottom face, which is a mounting face, of the element body part; and terminal parts that are each constituted by the tip part and a metal member that is joined to the tip part on the bottom face, and also has an opening at a position overlapping the tip part in a direction intersecting the bottom face.

Abstract: In an exemplary embodiment, a coil component includes: an element body part 10; a coil 40 embedded within the element body part 10 and constituted by a wound conductive wire; lead wires 44a, 44b that are each extended from the conductive wire and led out from the coil 40, and whose tip parts 46a, 46b are each fixed to a bottom face 22 of the element body part 10; and terminal parts 70a, 70b that are each constituted by the tip part 46a or 46b and a metal member 72a or 72b that is joined to the tip part 46a or 46b on the bottom face 22, and also has an opening 74 or 76 at a position overlapping the tip part 46a or 46b in a direction intersecting the bottom face 22.

Abstract: In an exemplary embodiment, a coil component includes: an element body part 10 that is formed containing a magnetic material; a coil 40 that is embedded within the element body part 10 and constituted by a wound conductive wire; lead wires 44a, 44b that are extended from the conductive wire and are led out from the coil 40; and terminal parts 70a, 70b that are joined to the lead wires 44a, 44b; wherein tip parts 46a, 46b of the lead wires 44a, 44b, each having a prescribed length from the tip, are embedded in the element body part 10 and also extend along the bottom face 22 of the element body part 10, and the terminal parts 70a, 70b are joined to the tip parts 46a, 46b of the lead wires 44a, 44b on the bottom face 22 of the element body part 10.

Abstract: In an exemplary embodiment, a coil component includes: an element body part 10; a coil 40 embedded within the element body part 10 and constituted by a wound conductive wire; lead wires 44a, 44b that are each extended from the conductive wire and led out from the coil 40, and whose tip parts 46a, 46b are each fixed to a bottom face 22 of the element body part 10; and terminal parts 70a, 70b that are each constituted by the tip part 46a or 46b and a metal member 72a or 72b that is joined to the tip part 46a or 46b on the bottom face 22, and also has an opening 74 or 76 at a position overlapping the tip part 46a or 46b in a direction intersecting the bottom face 22.

Abstract: An electronic component has a shaft, a flange formed at an end of the shaft and constituting a core together with the shaft, a coiled conductor wound around the shaft, and an electrode terminal formed on the flange and connected electrically to an end of the conductor; wherein the shaft and flange are made of metal magnetic grains containing Fe which are bonded to each other by bonding of oxide film formed on each metal magnetic grain, and the shaft is more densely filled with the metal magnetic material than is the flange. The electronic component can achieve size reduction and frequency increase by improving the magnetic permeability while also improving the plating property for the terminal electrode.

Abstract: An electronic component has a shaft, a flange formed at an end of the shaft and constituting a core together with the shaft, a coiled conductor wound around the shaft, and an electrode terminal formed on the flange and connected electrically to an end of the conductor; wherein the shaft and flange are made of metal magnetic grains containing Fe which are bonded to each other by bonding of oxide film formed on each metal magnetic grain, and the shaft is more densely filled with the metal magnetic material than is the flange. The electronic component can achieve size reduction and frequency increase by improving the magnetic permeability while also improving the plating property for the terminal electrode.

Abstract: Provided is an electronic component having a core that can achieve size reduction and frequency increase by improving the magnetic permeability further while also improving the plating property for the terminal electrode. An electronic component has a shaft, a flange formed at an end of the shaft and constituting a core together with the shaft, a coiled conductor wound around the shaft, and an electrode terminal formed on the flange and connected electrically to an end of the conductor; wherein the shaft and flange are made of a metal magnetic material, and the shaft is more densely filled with the metal magnetic material than is the flange.

Abstract: Provided is an electronic component having a core that can achieve size reduction and frequency increase by improving the magnetic permeability further while also improving the plating property for the terminal electrode. An electronic component has a shaft, a flange formed at an end of the shaft and constituting a core together with the shaft, a coiled conductor wound around the shaft, and an electrode terminal formed on the flange and connected electrically to an end of the conductor; wherein the shaft and flange are made of a metal magnetic material, and the shaft is more densely filled with the metal magnetic material than is the flange.

Abstract: To provide a ceramic composition and a ceramic wiring board that can be formed by the firing at a low temperature of 1,000° C. or less, has high strength and is advantageous when electronic component regions utilizing a ceramic layer are formed thereon. A raw ceramic material or calcined powder thereof having a composition consisting of 100 parts by mass of a main component that consists of 52 to 62% by mass of SiO2, 12 to 22% by mass of MgO, and 21 to 32% by mass of CaO and 0.5 to 3 parts by mass of a boron component in terms of the oxide form is molded and fired to obtain a ceramic composition that contains a diopside crystal as a primary crystal. By forming a wiring layer with conductive material on a substrate made of the ceramic composition, a ceramic wiring board is obtained.

Abstract: To provide a ceramic composition and a ceramic wiring board that can be formed by the firing at a low temperature of 1,000° C. or less, has high strength and is advantageous when electronic component regions utilizing a ceramic layer are formed thereon. A raw ceramic material or calcined powder thereof having a composition consisting of 100 parts by mass of a main component that consists of 52 to 62% by mass of SiO2, 12 to 22% by mass of MgO, and 21 to 32% by mass of CaO and 0.5 to 3 parts by mass of a boron component in terms of the oxide form is molded and fired to obtain a ceramic composition that contains a diopside crystal as a primary crystal. By forming a wiring layer with conductive material on a substrate made of the ceramic composition, a ceramic wiring board is obtained.

Abstract: A ceramic composition is provided with a glass based material including SiO2, Al2O3, B2O3, and at least one selected from a group of Cao and MgO, and particles dispersed in the glass based material. The particles includes CaSiO3 or MgSiO3 as a main component. A sintered state of the ceramic composition has an anti-bending strength of 1500 kg/cm2 or higher.

Abstract: Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module.

Abstract: A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.

Abstract: A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.