Patents by Inventor Keizo Matsuo

Keizo Matsuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080023875
    Abstract: A process, for manufacturing items out of a single or multi-layer plastic film having a thickness of at least 0.110 mm and featuring containers shape-formed out of the film plane by thermoforming, is such that a panel or strip-shaped flat material having a thickness of at least 0.4 mm is thinned before thermoforming by biaxial stretching in the longitudinal and transverse directions to the thickness of the plastic film. The biaxial stretching of the flat material leads to an improvement in the mechanical properties and barrier action against oxygen, water vapor and aromas.
    Type: Application
    Filed: June 28, 2007
    Publication date: January 31, 2008
    Inventors: Jean Jammet, Oliver Muggil, Keizo Matsuo
  • Patent number: 5871831
    Abstract: Packaging for medicaments such as blister packs contain a plurality of recesses which hold contents. A lidding foil closes off the packaging and protects the contents. The contents such as tablets are pushed through the lidding foil whereupon the lidding foil breaks. The lidding foil features at least one conductive strip and the medicament packaging can be connected to a computer. On pushing the contents through the lidding foil, the lidding foil breaks and the computer recognizes the impulse emitted as a result of this action. The conductive strips contain, as current carrying fraction, an SnO.sub.2 /SbO.sub.3 hydroxide mixture on a mica substrate.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: February 16, 1999
    Assignee: Alusuisse Technology & Management Ltd.
    Inventors: Patrik Zeiter, Markus Luthi, Keizo Matsuo