Patents by Inventor Keizo Takemiya

Keizo Takemiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin molding material for sealing and electronic component device
    Patent number: 10662315
    Abstract: An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: May 26, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Mitsuyoshi Hamada, Fumio Furusawa, Ryoichi Ikezawa, Keizo Takemiya, Toru Baba
  • EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE
    Publication number: 20170121505
    Abstract: An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.
    Type: Application
    Filed: January 12, 2017
    Publication date: May 4, 2017
    Inventors: Mitsuyoshi Hamada, Fumio Furusawa, Ryoichi Ikezawa, Keizo Takemiya, Toru Baba
  • EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE
    Publication number: 20140128505
    Abstract: An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.
    Type: Application
    Filed: May 10, 2012
    Publication date: May 8, 2014
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Mitsuyoshi Hamada, Fumio Furusawa, Ryoichi Ikezawa, Keizo Takemiya, Toru Baba
  • Encapsulant epoxy resin composition and electronic device
    Patent number: 6372351
    Abstract: In the present invention, provided are i) an encapsulant epoxy resin composition comprising an epoxy resin, a curing agent, a non-conductive carbon and an inorganic filler, and ii) an electronic device having an encapsulating member comprising a cured product of this composition.
    Type: Grant
    Filed: April 14, 2000
    Date of Patent: April 16, 2002
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Keizo Takemiya, Hidenori Abe