Abstract: Embodiments of the present invention generally relate to the field of semiconductor, in particular to a system and method for conveying and inspecting semiconductor package. More particularly, the present invention relates to the post-seal inspection system and method that performs automatic conveyance of semiconductor package for inspection process.

Abstract: A system and method that obtains contact heights of a packaged chip. In particular, the system includes a first light source for emitting direct light, a second light source for emitting structured light, two or more cameras pointed towards the packaged chip for capturing a first set of images of the packaged chip, and a second set of images of the packaged chip, and at least one processor that processes the first set of images and the second set of images captured by the cameras to determine contact heights of the packaged chip. The cameras capture the first set of images when the first light source emits direct light towards the packaged chip, and capture the second set of images when the second light source emits structured light towards the packaged chip.