Patents by Inventor Kelly E. Hollar

Kelly E. Hollar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10234772
    Abstract: A calibration curve for a wafer comprising a layer on a substrate is determined. The calibration curve represents a local parameter change as a function of a treatment parameter associated with a wafer exposure to a light. The local parameter of the wafer is measured. An overlay error is determined based on the local parameter of the wafer. A treatment map is computed based on the calibration curve to correct the overlay error for the wafer. The treatment map represents the treatment parameter as a function of a location on the wafer.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: March 19, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Mangesh Bangar, Bruce E. Adams, Kelly E. Hollar, Abhilash J. Mayur, Huixiong Dai, Jaujiun Chen
  • Publication number: 20180101103
    Abstract: A calibration curve for a wafer comprising a layer on a substrate is determined. The calibration curve represents a local parameter change as a function of a treatment parameter associated with a wafer exposure to a light. The local parameter of the wafer is measured. An overlay error is determined based on the local parameter of the wafer. A treatment map is computed based on the calibration curve to correct the overlay error for the wafer. The treatment map represents the treatment parameter as a function of a location on the wafer.
    Type: Application
    Filed: December 1, 2017
    Publication date: April 12, 2018
    Inventors: Mangesh BANGAR, Bruce E. ADAMS, Kelly E. HOLLAR, Abhilash J. MAYUR, Huixiong DAI, Jaujiun CHEN
  • Patent number: 9864280
    Abstract: A calibration curve for a wafer comprising a layer on a substrate is determined. The calibration curve represents a local parameter change as a function of a treatment parameter associated with a wafer exposure to a light. The local parameter of the wafer is measured. An overlay error is determined based on the local parameter of the wafer. A treatment map is computed based on the calibration curve to correct the overlay error for the wafer. The treatment map represents the treatment parameter as a function of a location on the wafer.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: January 9, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Mangesh Bangar, Bruce E. Adams, Kelly E. Hollar, Abhilash J Mayur, Huixiong Dai, Jaujiun Chen
  • Publication number: 20170097576
    Abstract: A calibration curve for a wafer comprising a layer on a substrate is determined. The calibration curve represents a local parameter change as a function of a treatment parameter associated with a wafer exposure to a light. The local parameter of the wafer is measured. An overlay error is determined based on the local parameter of the wafer. A treatment map is computed based on the calibration curve to correct the overlay error for the wafer. The treatment map represents the treatment parameter as a function of a location on the wafer.
    Type: Application
    Filed: October 2, 2015
    Publication date: April 6, 2017
    Inventors: Mangesh Bangar, Bruce E. Adams, Kelly E. Hollar, Abhilash J. Mayur, Huixiong Dai, Jaujiun Chen