Patents by Inventor Kelly F. Folts

Kelly F. Folts has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Collapsible probe tower device and method of forming thereof
    Patent number: 9373539
    Abstract: A collapsible probe tower device and methods of forming thereof, are disclosed. In one example embodiment, a method of forming a device includes providing a semiconductor die substrate having a contact pad and a probe pad, wherein the contact pad and probe pad are adhered to the substrate, forming a contact bump by applying a conductive material to a contact structure surface of a contact tower, wherein the contact tower includes the contact pad, forming a probe bump by applying a conductive material to a probe structure surface of a probe tower, wherein the probe tower includes the probe pad, and heating the conductive material that forms the contact bump and the probe bump to provide a first reflow, wherein after the first reflow, the height of a top surface of the probe bump exceeds the height of a top surface of the contact bump.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: June 21, 2016
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Trent S. Uehling, Kelly F. Folts
  • Collapsible Probe Tower Device and Method of Forming Thereof
    Publication number: 20150287654
    Abstract: A collapsible probe tower device and methods of forming thereof, are disclosed. In one example embodiment, a method of forming a device includes providing a semiconductor die substrate having a contact pad and a probe pad, wherein the contact pad and probe pad are adhered to the substrate, forming a contact bump by applying a conductive material to a contact structure surface of a contact tower, wherein the contact tower includes the contact pad, forming a probe bump by applying a conductive material to a probe structure surface of a probe tower, wherein the probe tower includes the probe pad, and heating the conductive material that forms the contact bump and the probe bump to provide a first reflow, wherein after the first reflow, the height of a top surface of the probe bump exceeds the height of a top surface of the contact bump.
    Type: Application
    Filed: April 7, 2014
    Publication date: October 8, 2015
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Trent S. Uehling, Kelly F. Folts