Abstract: The invention provides organic optical waveguide devices which are lithographically formed and employ polymeric materials having low optical loss, good long term and short term stability, good flexibility and reduced stress or crack induced scattering loss. An optical element has a substrate; a patterned, light transmissive core composition on the surface of the substrate; and a light reflecting cladding composition on the pattern of the core. The core composition has a glass transition temperature of about 80° C. or less and the cladding composition has a glass transition temperature of about 60° C. or less.

Abstract: The invention provides organic optical waveguide devices which are lithographically formed and employ polymeric materials having low optical loss, good long term and short term stability, good flexibility and reduced stress or crack induced scattering loss. An optical element has a substrate; a patterned, light transmissive core composition on the surface of the substrate; and a light reflecting cladding composition on the pattern of the core. The core composition has a glass transition temperature of about 80° C. or less and the cladding composition has a glass transition temperature of about 60° C. or less.

Abstract: The invention provides organic optical waveguide devices which are lithographically formed and employ polymeric materials having low optical loss, good long term and short term stability, good flexibility and reduced stress or crack induced scattering loss. An optical element has a substrate; a patterned, light transmissive core composition on the surface of the substrate; and a light reflecting cladding composition on the pattern of the core. The core composition has a glass transition temperature of about 80° C. or less and the cladding composition has a glass transition temperature of about 60° C. or less.

Abstract: The invention provides improved high contrast, photopolymerizable compositions suitable for producing high contrast waveguides. The high contrast, photopolymerizable compositions of this invention include a nitrone compound component. The photosensitive composition is an admixture of a free radical polymerizable acrylate or methacrylate component having at least two ethylenically unsaturated groups, a photoinitiator, and a nitrone compound.

Abstract: The invention provides a waveguide connector assembly for the precision interconnection of mating arrays of parallel optical waveguides which are preferably photolithographically formed on substrates. The connector assembly has a base with several parallel channel walls cut along a surface of the base. A waveguide assembly is positioned on the base. The waveguide assembly comprises a substrate and several transparent, polymeric waveguides on and raised from a surface of the substrate. The waveguides have a polygonal cross section with flat edges. The waveguide assembly is positioned on the base such that each of the waveguides is set in one of the channels and contacts the walls of the channel at two or more points. A cover plate holds the waveguide assembly on the base.

Abstract: The invention provides a low stress optical waveguide assembly wherein one or more waveguide cores have a conformal cladding in register the waveguide core. The core and cladding are preferably lithographically formed on a substrate. A connector assembly provides for the precision interconnection of mating arrays of parallel optical waveguides. The connector assembly has a base with several parallel channel walls cut along a surface of the base. A waveguide assembly is positioned on the base. The waveguide assembly comprises a substrate and one or more transparent, polymeric waveguides on and raised from a surface of the substrate. A conformal cladding is in register with the waveguide core. Such conformal cladding contributes to a reduction in waveguide stress. The waveguide assembly is positioned on the base such that each of the waveguides is set in one of the channels and contacts the walls of the channel. A cover plate holds the waveguide assembly on the base.