Patents by Inventor Kelly McDonough

Kelly McDonough has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for etching high aspect ratio features
    Patent number: 8475625
    Abstract: Embodiments of the invention provide a method and apparatus, such as a processing chamber, suitable for etching high aspect ratio features. Other embodiments include a showerhead assembly for use in the processing chamber. In one embodiment, a processing chamber includes a chamber body having a showerhead assembly and substrate support disposed therein. The showerhead assembly includes at least two fluidly isolated plenums, a region transmissive to an optical metrology signal, and a plurality of gas passages formed through the showerhead assembly fluidly coupling the plenums to the interior volume of the chamber body.
    Type: Grant
    Filed: May 3, 2006
    Date of Patent: July 2, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Sharma Pamarthy, Huutri Dao, Xiaoping Zhou, Kelly A. McDonough, Jivko Dinev, Farid Abooameri, David E. Gutierrez, Jim Zhongyi He, Robert S. Clark, Dennis M. Koosau, Jeffrey William Dietz, Declan Scanlan, Subhash Deshmukh, John P. Holland, Alexander Paterson
  • Self-passivating plasma resistant material for joining chamber components
    Patent number: 7718029
    Abstract: Embodiments of the invention provide a robust bonding material suitable for joining semiconductor processing chamber components. Other embodiments provide semiconductor processing chamber components joined using a bonding material having metal filler disposed in an adhesive layer. Other embodiments include methods for manufacturing a semiconductor processing chamber component having a bonding material that includes metal filled disposed in an adhesive layer. The metal filler is suitable for reacting with halogen containing plasmas such that a halogen based metal layer is formed on the exposed portion of the bonding material upon exposure to the plasma.
    Type: Grant
    Filed: August 1, 2006
    Date of Patent: May 18, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Jennifer Y. Sun, Li Xu, Senh Thach, Kelly A. McDonough, Robert Scott Clark
  • SELF-PASSIVATING PLASMA RESISTANT MATERIAL FOR JOINING CHAMBER COMPONENTS
    Publication number: 20080029211
    Abstract: Embodiments of the invention provide a robust bonding material suitable for joining semiconductor processing chamber components. Other embodiments provide semiconductor processing chamber components joined using a bonding material having metal filler disposed in an adhesive layer. Other embodiments include methods for manufacturing a semiconductor processing chamber component having a bonding material that includes metal filled disposed in an adhesive layer. The metal filler is suitable for reacting with halogen containing plasmas such that a halogen based metal layer is formed on the exposed portion of the bonding material upon exposure to the plasma.
    Type: Application
    Filed: August 1, 2006
    Publication date: February 7, 2008
    Inventors: JENNIFER Y. SUN, Li Xu, Senh Thach, Kelly A. McDonough, Robert Scott Clark
  • APPARATUS FOR ETCHING HIGH ASPECT RATIO FEATURES
    Publication number: 20070256785
    Abstract: Embodiments of the invention provide a method and apparatus, such as a processing chamber, suitable for etching high aspect ratio features. Other embodiments include a showerhead assembly for use in the processing chamber. In one embodiment, a processing chamber includes a chamber body having a showerhead assembly and substrate support disposed therein. The showerhead assembly includes at least two fluidly isolated plenums, a region transmissive to an optical metrology signal, and a plurality of gas passages formed through the showerhead assembly fluidly coupling the plenums to the interior volume of the chamber body.
    Type: Application
    Filed: May 3, 2006
    Publication date: November 8, 2007
    Inventors: Sharma Pamarthy, Huutri Dao, Xiaoping Zhou, Kelly McDonough, Jivko Dinev, Farid Abooameri, David Gutierrez, Jim He, Robert Clark, Dennis Koosau, Jeffrey Dietz, Declan Scanlan, Subhash Deshmukh, John Holland, Alexander Paterson