Patents by Inventor Ken Furukuwa

Ken Furukuwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic circuit board and method for manufacturing the same
    Patent number: 7285730
    Abstract: In the ceramic circuit board, within the through hole of the ceramic substrate is arranged the metal column which is 0 to 150 ?m shorter relative to the thickness of the ceramic substrate; the metal circuit plates are attached to both surfaces of the ceramic substrate to stop up the through hole; and the metal column and the metal circuit plate are bonded together via the brazing material. For its manufacture, the metal column with brazing material is used that is made 40 to 140 ?m longer relative to the thickness of the ceramic substrate by being formed of the metal column which is 0 to 150 ?m shorter relative to the thickness of the ceramic substrate and has its both ends coated with the brazing material.
    Type: Grant
    Filed: February 9, 2004
    Date of Patent: October 23, 2007
    Assignee: Kyocera Corporation
    Inventor: Ken Furukuwa
  • Ceramic circuit board and method for manufacturing the same
    Patent number: 7143929
    Abstract: In the ceramic circuit board, within the through hole of the ceramic substrate is arranged the metal column which is 0 to 150 ?m shorter relative to the thickness of the ceramic substrate; the metal circuit plates are attached to both surfaces of the ceramic substrate to stop up the through hole; and the metal column and the metal circuit plate are bonded together via the brazing material. For its manufacture, the metal column with brazing material is used that is made 40 to 140 ?m longer relative to the thickness of the ceramic substrate by being formed of the metal column which is 0 to 150 ?m shorter relative to the thickness of the ceramic substrate and has its both ends coated with the brazing material.
    Type: Grant
    Filed: February 9, 2004
    Date of Patent: December 5, 2006
    Assignee: Kyocera Corporation
    Inventor: Ken Furukuwa
  • Ceramic circuit board and method for manufacturing the same
    Publication number: 20040154830
    Abstract: In the ceramic circuit board, within the through hole of the ceramic substrate is arranged the metal column which is 0 to 150 &mgr;m shorter relative to the thickness of the ceramic substrate; the metal circuit plates are attached to both surfaces of the ceramic substrate to stop up the through hole; and the metal column and the metal circuit plate are bonded together via the brazing material. For its manufacture, the metal column with brazing material is used that is made 40 to 140 &mgr;m longer relative to the thickness of the ceramic substrate by being formed of the metal column which is 0 to 150 &mgr;m shorter relative to the thickness of the ceramic substrate and has its both ends coated with the brazing material.
    Type: Application
    Filed: February 9, 2004
    Publication date: August 12, 2004
    Applicant: KYOCERA CORPORATION
    Inventor: Ken Furukuwa
  • Ceramic circuit board and method for manufacturing the same
    Publication number: 20040155356
    Abstract: In the ceramic circuit board, within the through hole of the ceramic substrate is arranged the metal column which is 0 to 150 &mgr;m shorter relative to the thickness of the ceramic substrate; the metal circuit plates are attached to both surfaces of the ceramic substrate to stop up the through hole; and the metal column and the metal circuit plate are bonded together via the brazing material. For its manufacture, the metal column with brazing material is used that is made 40 to 140 &mgr;m longer relative to the thickness of the ceramic substrate by being formed of the metal column which is 0 to 150 &mgr;m shorter relative to the thickness of the ceramic substrate and has its both ends coated with the brazing material.
    Type: Application
    Filed: February 9, 2004
    Publication date: August 12, 2004
    Applicant: KYOCERA CORPORATION.
    Inventor: Ken Furukuwa
  • Ceramic circuit board and method for manufacturing the same
    Patent number: 6730856
    Abstract: In the ceramic circuit board, within the through hole of the ceramic substrate is arranged the metal column which is 0 to 150 &mgr;m shorter relative to the thickness of the ceramic substrate; the metal circuit plates are attached to both surfaces of the ceramic substrate to stop up the through hole; and the metal column and the metal circuit plate are bonded together via the brazing material. For its manufacture, the metal column with brazing material is used that is made 40 to 140 &mgr;m longer relative to the thickness of the ceramic substrate by being formed of the metal column which is 0 to 150 &mgr;m shorter relative to the thickness of the ceramic substrate and has its both ends coated with the brazing material.
    Type: Grant
    Filed: August 20, 2002
    Date of Patent: May 4, 2004
    Assignee: Kyocera Corporation
    Inventor: Ken Furukuwa
  • Ceramic circuit board and method for manufacturing the same
    Publication number: 20030056981
    Abstract: In the ceramic circuit board, within the through hole of the ceramic substrate is arranged the metal column which is 0 to 150 &mgr;m shorter relative to the thickness of the ceramic substrate; the metal circuit plates are attached to both surfaces of the ceramic substrate to stop up the through hole; and the metal column and the metal circuit plate are bonded together via the brazing material. For its manufacture, the metal column with brazing material is used that is made 40 to 140 &mgr;m longer relative to the thickness of the ceramic substrate by being formed of the metal column which is 0 to 150 &mgr;m shorter relative to the thickness of the ceramic substrate and has its both ends coated with the brazing material.
    Type: Application
    Filed: August 20, 2002
    Publication date: March 27, 2003
    Applicant: KYOCERA CORPORATION
    Inventor: Ken Furukuwa