Patents by Inventor Ken Koseki

Ken Koseki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978022
    Abstract: A meeting management apparatus manages a plurality of group meeting that a plurality of attendees can attend using an attendee terminal. The meeting management apparatus includes: a data acquiring part that acquires state data indicating a state of each of the plurality of group meetings; and a terminal control part that transmits, to the attendee terminal, state data corresponding to each of the plurality of group meetings in association with meeting identification information for identifying each of the plurality of group meetings.
    Type: Grant
    Filed: April 12, 2023
    Date of Patent: May 7, 2024
    Assignee: V-CUBE, INC.
    Inventors: Yosuke Kamezaki, Hironori Nurishi, Ei Sou, Ken Koseki
  • Publication number: 20230379435
    Abstract: A meeting management apparatus managing a plurality of group meetings that each of a plurality of communication terminals can attend, including: an information acquiring part that acquires information in which (i) an individual meeting which is a group meeting selected from among a plurality of group meetings and (ii) a plurality of attendee terminals that are communication terminals attending the individual meeting among the plurality of communication terminals are associated with each other; and a terminal control part that executes, in parallel, the individual meeting for transmitting and receiving voices between the plurality of attendee terminals and a general meeting for transmitting voices from a predetermined source terminal to the plurality of communication terminals.
    Type: Application
    Filed: May 23, 2023
    Publication date: November 23, 2023
    Inventors: Yosuke KAMEZAKI, Hironori NURISHI, Ei SOU, Ken KOSEKI
  • Publication number: 20230262168
    Abstract: A meeting management apparatus managing a plurality of group meetings that a plurality of users can attend using a communication terminal, the meeting management apparatus including: a terminal control part that executes a first meeting in which voices are transmitted and received between a plurality of the communication terminals used by the plurality of users; and an operation receiving part that receives, during or after execution of the first meeting, a selection operation for selecting a second user from among the plurality of users, performed by a first user among the plurality of users, wherein the terminal control part executes, during or after the execution of the first meeting, a second meeting in which voices are transmitted or received between the communication terminal used by the first user and the communication terminal used by the second user corresponding to the selection operation.
    Type: Application
    Filed: April 20, 2023
    Publication date: August 17, 2023
    Inventors: Yosuke KAMEZAKI, Hironori NURISHI, Ei SOU, Ken KOSEKI
  • Publication number: 20230262199
    Abstract: A meeting management apparatus manages a plurality of group meetings that a plurality of users can attend using a communication terminal, and includes a data acquiring part that acquires user data concerning a plurality of users before the start of an event including the plurality of group meetings, a pattern determining part that determines a pattern in which each of the plurality of users and any one of the plurality of group meetings are associated with each other on the basis of the user data, and a terminal control part that causes each of the plurality of users to attend the group meeting associated with the user in the pattern among the plurality of group meetings after the start of the event.
    Type: Application
    Filed: April 19, 2023
    Publication date: August 17, 2023
    Inventors: Yosuke KAMEZAKI, Hironori NURISHI, Ei SOU, Ken KOSEKI
  • Publication number: 20230245074
    Abstract: A meeting management apparatus manages a plurality of group meetings that a plurality of attendees can attend using a communication terminal. The meeting management apparatus includes: a memory that stores meeting attribute data indicating an attribute of a group meeting in association with each of the plurality of group meetings; and a terminal control part that transmits meeting attribute data corresponding to each of the plurality of group meetings to an attendee terminal, in association with meeting identification information for identifying each of the plurality of group meetings.
    Type: Application
    Filed: April 12, 2023
    Publication date: August 3, 2023
    Inventors: Yosuke KAMEZAKI, Hironori NURISHI, Ei SOU, Ken KOSEKI
  • Publication number: 20230244433
    Abstract: A meeting management apparatus manages a plurality of group meeting that a plurality of attendees can attend using an attendee terminal. The meeting management apparatus includes: a data acquiring part that acquires state data indicating a state of each of the plurality of group meetings; and a terminal control part that transmits, to the attendee terminal, state data corresponding to each of the plurality of group meetings in association with meeting identification information for identifying each of the plurality of group meetings.
    Type: Application
    Filed: April 12, 2023
    Publication date: August 3, 2023
    Inventors: Yosuke KAMEZAKI, Hironori NURISHI, Ei SOU, Ken KOSEKI
  • Patent number: 10645326
    Abstract: Disclosed herein is an image pickup circuit including: amplifying means for amplifying a charge corresponding to an amount of light received by a photodetector, and outputting a pixel signal; ramp signal generating means for generating a ramp signal whose voltage drops with a fixed slope from a predetermined initial voltage; and comparing means for comparing the pixel signal output by the amplifying means with the ramp signal output by the ramp signal generating means. A reference potential of the pixel signal output by the amplifying means and a reference potential of the ramp signal output by the ramp signal generating means are at a same level.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: May 5, 2020
    Assignee: Sony Corporation
    Inventors: Hayato Wakabayashi, Yoshiaki Inada, Ken Koseki
  • Patent number: 10554912
    Abstract: A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: February 4, 2020
    Assignee: Sony Corporation
    Inventors: Toshiaki Nagai, Ken Koseki, Yosuke Ueno, Atsushi Suzuki
  • Patent number: 10200642
    Abstract: A camera module of the disclosure includes: an imaging unit that includes a plurality of pixels, acquires a first detection value in one of the pixels in a second term out of a first term, the second term, a third term, and a fourth term that are set in order, acquires a second detection value in the relevant one of the pixels in the fourth term, and obtains a pixel value of the relevant one of the pixels on the basis of a difference between the first and second detection values; a lens unit including a lens and an actuator that drives the lens; and a driver unit that generates a drive signal and drives the actuator using the drive signal, in which the drive signal makes a transition in each of the first and third terms.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: February 5, 2019
    Assignees: SONY CORPORATION, ROHM CO., LTD.
    Inventors: Takahiro Akahane, Ken Koseki, Kenichi Shigenami, Go Asayama, Rei Takamori, Tatsuya Ninomiya, Masato Nishinouchi, Masanori Onodera, Tatsuro Shimizu
  • Publication number: 20180255259
    Abstract: Disclosed herein is an image pickup circuit including: amplifying means for amplifying a charge corresponding to an amount of light received by a photodetector, and outputting a pixel signal; ramp signal generating means for generating a ramp signal whose voltage drops with a fixed slope from a predetermined initial voltage; and comparing means for comparing the pixel signal output by the amplifying means with the ramp signal output by the ramp signal generating means. A reference potential of the pixel signal output by the amplifying means and a reference potential of the ramp signal output by the ramp signal generating means are at a same level.
    Type: Application
    Filed: May 2, 2018
    Publication date: September 6, 2018
    Inventors: Hayato Wakabayashi, Yoshiaki Inada, Ken Koseki
  • Publication number: 20180220088
    Abstract: A camera module of the disclosure includes: an imaging unit that includes a plurality of pixels, acquires a first detection value in one of the pixels in a second term out of a first term, the second term, a third term, and a fourth term that are set in order, acquires a second detection value in the relevant one of the pixels in the fourth term, and obtains a pixel value of the relevant one of the pixels on the basis of a difference between the first and second detection values; a lens unit including a lens and an actuator that drives the lens; and a driver unit that generates a drive signal and drives the actuator using the drive signal, in which the drive signal makes a transition in each of the first and third terms.
    Type: Application
    Filed: March 1, 2016
    Publication date: August 2, 2018
    Inventors: TAKAHIRO AKAHANE, KEN KOSEKI, KENICHI SHIGENAMI, GO ASAYAMA, REI TAKAMORI, TATSUYA NINOMIYA, MASATO NISHINOUCHI, MASANORI ONODERA, TATSURO SHIMIZU
  • Patent number: 10027912
    Abstract: A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: July 17, 2018
    Assignee: Sony Corporation
    Inventors: Toshiaki Nagai, Ken Koseki, Yosuke Ueno, Atsushi Suzuki
  • Patent number: 9986193
    Abstract: Disclosed herein is an image pickup circuit including: amplifying means for amplifying a charge corresponding to an amount of light received by a photodetector, and outputting a pixel signal; ramp signal generating means for generating a ramp signal whose voltage drops with a fixed slope from a predetermined initial voltage; and comparing means for comparing the pixel signal output by the amplifying means with the ramp signal output by the ramp signal generating means. A reference potential of the pixel signal output by the amplifying means and a reference potential of the ramp signal output by the ramp signal generating means are at a same level.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: May 29, 2018
    Assignee: Sony Corporation
    Inventors: Hayato Wakabayashi, Yoshiaki Inada, Ken Koseki
  • Publication number: 20180124340
    Abstract: A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.
    Type: Application
    Filed: November 1, 2017
    Publication date: May 3, 2018
    Inventors: Toshiaki Nagai, Ken Koseki, Yosuke Ueno, Atsushi Suzuki
  • Patent number: 9865633
    Abstract: A solid-state imaging device in which the potential of a signal line, which is obtained before a pixel has an operating period, is fixed to an intermediate potential between a first power-supply potential and a second power-supply potential.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: January 9, 2018
    Assignee: Sony Corporation
    Inventors: Keiji Mabuchi, Toshifumi Wakano, Ken Koseki
  • Patent number: 9838626
    Abstract: A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: December 5, 2017
    Assignee: Sony Corporation
    Inventors: Toshiaki Nagai, Ken Koseki, Yosuke Ueno, Atsushi Suzuki
  • Publication number: 20170288691
    Abstract: A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.
    Type: Application
    Filed: June 22, 2017
    Publication date: October 5, 2017
    Inventors: Toshiaki Nagai, Ken Koseki, Yosuke Ueno, Atsushi Suzuki
  • Patent number: 9736409
    Abstract: A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: August 15, 2017
    Assignee: Sony Corporation
    Inventors: Toshiaki Nagai, Ken Koseki, Yosuke Ueno, Atsushi Suzuki
  • Publication number: 20170171487
    Abstract: Disclosed herein is an image pickup circuit including: amplifying means for amplifying a charge corresponding to an amount of light received by a photodetector, and outputting a pixel signal; ramp signal generating means for generating a ramp signal whose voltage drops with a fixed slope from a predetermined initial voltage; and comparing means for comparing the pixel signal output by the amplifying means with the ramp signal output by the ramp signal generating means. A reference potential of the pixel signal output by the amplifying means and a reference potential of the ramp signal output by the ramp signal generating means are at a same level.
    Type: Application
    Filed: February 24, 2017
    Publication date: June 15, 2017
    Inventors: Hayato Wakabayashi, Yoshiaki Inada, Ken Koseki
  • Patent number: 9654717
    Abstract: Disclosed herein is an image pickup circuit including: amplifying means for amplifying a charge corresponding to an amount of light received by a photodetector, and outputting a pixel signal; ramp signal generating means for generating a ramp signal whose voltage drops with a fixed slope from a predetermined initial voltage; and comparing means for comparing the pixel signal output by the amplifying means with the ramp signal output by the ramp signal generating means. A reference potential of the pixel signal output by the amplifying means and a reference potential of the ramp signal output by the ramp signal generating means are at a same level.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: May 16, 2017
    Assignee: Sony Corporation
    Inventors: Hayato Wakabayashi, Yoshiaki Inada, Ken Koseki