Abstract: An object is to provide a small and highly reliable inductor capable of handling a large current. The inductor includes: magnetic core formed by pressing a mixture of a powdered magnetic material and a binder; coil part disposed inside magnetic core; and external electrode formed by bending end portion of coil part protruding from magnetic core. Coil part and external electrode are made of a flat conductor, and a width of end portion of coil part protruding from magnetic core is less than an average width of coil part disposed inside magnetic core.

Abstract: With an Al—Cu bonded structure, an Ag layer can be remained at the Al—Cu bonding interlayer providing ductile deformation behavior and a tensile strength at the bonded interlayer similar to that of the Al base material. This results in superior bonding characteristics. Furthermore, a thin Al—Cu bonded structure can be obtained as a result of using the Al—Cu dissimilar material bonded section, which has superior workability, as the base material to perform rolling for wall-thickness reduction. The thin Al—Cu structure has superior dimensional accuracy and can meet diverse dimensional demands. The structure combines the light weight of Al with its particular heat transfer and heat dissipative characteristics and anti-corrosive properties of Cu, allowing it to meet the compact, thin, light-weight, and high-performance needs of electronic devices. The structure can be widely used in heat exchanges and heat transfer devices.

Abstract: With an Al—Cu bonded structure, an Ag layer can be remained at the Al—Cu bonding interlayer, providing ductile deformation behavior and a tensile strength at the bonded interlayer similar to that of the Al base material. This results in superior bonding characteristics. Furthermore, a thin Al—Cu bonded structure can be obtained as a result of using the Al—Cu dissimilar material bonded section, which has superior workability, as the base material to perform rolling for wall-thickness reduction. The thin Al—Cu structure has superior dimensional accuracy and can meet diverse dimensional demands. The structure combines the light weight of Al with its particular heat transfer and heat dissipative characteristics and anti-corrosive properties of Cu, allowing it to meet the compact, thin, light-weight, and high-performance needs of electronic devices. The structure can be widely used in heat exchangers and heat transfer devices.

Abstract: A molded transformer includes a transformer body including a coil bobbin having a spool having a central through-hole and a collar at each of two ends thereof, and a conductive wire, such as a copper wire, wound around the spool, and an EE type or EI type ferrite core which is inserted into the coil bobbin; and a thermoplastic resin for molding the transformer body in such a manner that only a terminal portion used for mounting is exposed through the resin. The resin has a low molecular weight, ensuring a low molding stress and a low melting viscosity.