Patents by Inventor Ken Leong
Ken Leong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10510721Abstract: Various molded chip combinations and methods of manufacturing the same are disclosed. In one aspect, a molded chip combination is provided that includes a first semiconductor chip that has a first PHY region, a second semiconductor chip that has a second PHY region, an interconnect chip interconnecting the first PHY region to the second PHY region, and a molding joining together the first semiconductor chip, the second semiconductor chip and the interconnect chip.Type: GrantFiled: August 11, 2017Date of Patent: December 17, 2019Assignee: Advanced Micro Devices, Inc.Inventors: Milind S. Bhagavat, Lei Fu, Ivor Barber, Chia-Ken Leong, Rahul Agarwal
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Publication number: 20190051633Abstract: Various molded chip combinations and methods of manufacturing the same are disclosed. In one aspect, a molded chip combination is provided that includes a first semiconductor chip that has a first PHY region, a second semiconductor chip that has a second PHY region, an interconnect chip interconnecting the first PHY region to the second PHY region, and a molding joining together the first semiconductor chip, the second semiconductor chip and the interconnect chip.Type: ApplicationFiled: August 11, 2017Publication date: February 14, 2019Inventors: Milind S. Bhagavat, Lei Fu, Ivor Barber, Chia-Ken Leong, Rahul Agarwal
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Publication number: 20130258619Abstract: Various circuit boards and stiffener frames and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes fabricating a stiffener frame that has a surface adapted to engage a side of a circuit board. The surface includes a projection to protect a corner of the circuit board.Type: ApplicationFiled: March 30, 2012Publication date: October 3, 2013Inventors: Tom J. Ley, Eric S. Tosaya, Chia-Ken Leong
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Patent number: 8405187Abstract: Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices on the first side. A stiffener frame is coupled on the first side. The stiffener frame has first and second spaced apart opposing walls that define a channel in which the first plurality of passive devices is positioned, and a central opening that does not cover a central portion of the first side of the substrate.Type: GrantFiled: June 10, 2011Date of Patent: March 26, 2013Assignee: Globalfoundries Inc.Inventors: Eric Tosaya, Jun Zhai, Chia-Ken Leong, Tom Ley
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Patent number: 8216887Abstract: Various semiconductor chip packages and methods of assembling and making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a stiffener frame to a first side of a substrate. The stiffener frame has a central opening to accommodate a semiconductor chip and an outer edge surface. A semiconductor chip is coupled to the first side in the opening. A lid is coupled to the stiffener frame with an adhesive. The lid has a first edge surface set back from the outer edge surface of the stiffener frame. The adhesive is set back from the outer edge surface of the stiffener frame.Type: GrantFiled: May 4, 2009Date of Patent: July 10, 2012Assignee: Advanced Micro Devices, Inc.Inventors: Stephen F. Heng, Sanjay Dandia, Chia-Ken Leong
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Publication number: 20110241161Abstract: Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices on the first side. A stiffener frame is coupled on the first side. The stiffener frame has first and second spaced apart opposing walls that define a channel in which the first plurality of passive devices is positioned, and a central opening that does not cover a central portion of the first side of the substrate.Type: ApplicationFiled: June 10, 2011Publication date: October 6, 2011Applicant: GLOBALFOUNDRIES Inc.Inventors: Eric Tosaya, Jun Zhai, Chia-Ken Leong, Tom Ley
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Patent number: 8008133Abstract: Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices on the first side. A stiffener frame is coupled on the first side. The stiffener frame has first and second spaced apart opposing walls that define a channel in which the first plurality of passive devices is positioned, and a central opening that does not cover a central portion of the first side of the substrate.Type: GrantFiled: February 11, 2008Date of Patent: August 30, 2011Assignee: Globalfoundries Inc.Inventors: Eric Tosaya, Jun Zhai, Chia-Ken Leong, Tom Ley
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Publication number: 20100276799Abstract: Various semiconductor chip packages and methods of assembling and making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a stiffener frame to a first side of a substrate. The stiffener frame has a central opening to accommodate a semiconductor chip and an outer edge surface. A semiconductor chip is coupled to the first side in the opening. A lid is coupled to the stiffener frame with an adhesive. The lid has a first edge surface set back from the outer edge surface of the stiffener frame. The adhesive is set back from the outer edge surface of the stiffener frame.Type: ApplicationFiled: May 4, 2009Publication date: November 4, 2010Inventors: Stephen F. Heng, Sanjay Dandia, Chia-Ken Leong
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Publication number: 20090200659Abstract: Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices on the first side. A stiffener frame is coupled on the first side. The stiffener frame has first and second spaced apart opposing walls that define a channel in which the first plurality of passive devices is positioned, and a central opening that does not cover a central portion of the first side of the substrate.Type: ApplicationFiled: February 11, 2008Publication date: August 13, 2009Inventors: Eric Tosaya, Jun Zhai, Chia-Ken Leong, Tom Ley
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Patent number: 7472101Abstract: An extended state machine that makes use of an inference engine as the infrastructure for adding inferential capabilities to the state machine's execution. The result is a state machine that may operate on partial or disordered information, inferring intermediate states that have yet to be formally traversed. In addition, controls such as state timeouts and transition priorities allow for finer control of the state machine's execution, particularly in unexpected circumstances.Type: GrantFiled: July 12, 2005Date of Patent: December 30, 2008Assignee: TIBCO Software Inc.Inventors: Puneet Aurora, Suresh Subramani, Nick Che Ken Leong
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Publication number: 20080284047Abstract: Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices in the first side. A polymeric stiffener ring is formed on the first side. The stiffener ring embeds the first plurality of passive devices without covering a central portion of the first surface of the substrate. A semiconductor chip is mounted on the central portion of the first surface of the substrate.Type: ApplicationFiled: May 15, 2007Publication date: November 20, 2008Inventors: Eric Tosaya, Jun Zhai, Chia-Ken Leong, Tom Ley
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Patent number: 4417707Abstract: A human powered hang glider (10) has a fixed wing portion (12) and a pair of movable wing portions (14, 16). Flexible sheet material (26, 28) is connected to trailing edges (30, 32) of the movable wing portions (14, 16). A support structure (34, 36) for the flexible sheet material (26, 28) overlies each flexible sheet material (26, 28). Elastic bands (52) and wires (74, 76) are connected in opposing relationship to the movable wing portions (14, 16) to allow reciprocation of the movable wing portions (14, 16). When the flexible bands (52) cause upward movement of the movable wing portions (14, 16) the flexible sheet members (26, 28) move away from their associated support structures (34, 36), allowing air to pass through the support structures (34, 36). When pilot (70 pulls on wires (74, 76) to move the movable wing portions (14, 16) downward, the flexible sheet portions (26, 28) move against their associated support structures (34, 36) to provide increased lift from the movable wing portions (14, 16).Type: GrantFiled: January 26, 1982Date of Patent: November 29, 1983Inventor: Ken Leong
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Patent number: D641720Type: GrantFiled: March 26, 2010Date of Patent: July 19, 2011Assignee: Advanced Micro Devices, Inc.Inventors: Stephen Heng, Sanjay Dandia, Nikon Banouvong, Chia-Ken Leong
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Patent number: D658607Type: GrantFiled: June 17, 2011Date of Patent: May 1, 2012Assignee: Advanced Micro Devices, Inc.Inventors: Stephen Heng, Sanjay Dandia, Nikon Banouvong, Chia-Ken Leong