Patents by Inventor Ken Liao
Ken Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11805342Abstract: A sound producing package structure includes a shell and a chip. The shell includes a top structure, a bottom structure and a sidewall structure. The chip is disposed inside the shell and configured to produce an acoustic wave, wherein the chip includes a thin film structure and an actuator configured to actuate the thin film structure, and the thin film structure is substantially parallel to the top structure and the bottom structure. A first opening is formed on the sidewall structure, and the acoustic wave propagates outwards through the first opening.Type: GrantFiled: June 16, 2021Date of Patent: October 31, 2023Assignee: xMEMS Labs, Inc.Inventors: Chiung C. Lo, Hsien-Ken Liao, Martin George Lim
-
Publication number: 20230340372Abstract: The disclosure provides a cleaning composition, comprising purified water, sodium ionized water, coconut oil, calcium oxide and an alkaline substance. A content of the purified water is greater than 50 wt %. A content of the sodium ionized water is 15 to 25 wt %. A content of the coconut oil is 3 to 7 wt %. A content of the calcium oxide is 0.5 to 2.5 wt %. A content of the alkaline substance is 7 to 13 wt %. The purified water, the sodium ionized water, the coconut oil and the alkaline substance account for less than or equal to 100 wt % of the total weight percentage of the cleaning composition. The disclosure further provides a preparation method of a cleaning composition.Type: ApplicationFiled: April 20, 2023Publication date: October 26, 2023Inventor: YIN KEN LIAO
-
Patent number: 11758312Abstract: A sound producing package structure includes a first sub-package structure and a second sub-package structure. The first sub-package structure includes a first substrate having a first opening and a first chip including a first membrane, wherein a first cavity is formed between the first membrane and the first substrate. The first sub-package structure and the second sub-package structure are stacked, and the second sub-package structure includes a second substrate and a second chip. The second substrate is connected to the first substrate and has a second opening. The second chip includes a second membrane, wherein a second cavity is formed between the second membrane and the second substrate. A gap, connected to the first opening and the second opening, is formed between the first substrate and the second substrate, such that an ambient of the sound producing package structure, the first cavity and the second cavity are connected.Type: GrantFiled: May 9, 2022Date of Patent: September 12, 2023Assignee: XMEMS TAIWAN CO., LTD.Inventors: Hsien-Ken Liao, Chiung C. Lo
-
Publication number: 20220386004Abstract: A sound producing package structure includes a first sub-package structure and a second sub-package structure. The first sub-package structure includes a first substrate having a first opening and a first chip including a first membrane, wherein a first cavity is formed between the first membrane and the first substrate. The first sub-package structure and the second sub-package structure are stacked, and the second sub-package structure includes a second substrate and a second chip. The second substrate is connected to the first substrate and has a second opening. The second chip includes a second membrane, wherein a second cavity is formed between the second membrane and the second substrate. A gap, connected to the first opening and the second opening, is formed between the first substrate and the second substrate, such that an ambient of the sound producing package structure, the first cavity and the second cavity are connected.Type: ApplicationFiled: May 9, 2022Publication date: December 1, 2022Applicant: XMEMS TAIWAN CO., LTD.Inventors: Hsien-Ken Liao, Chiung C. Lo
-
Patent number: 11252511Abstract: A package structure includes a housing and a sound producing chip. The sound producing chip is disposed within the housing. The sound producing chip includes a membrane and an actuator. The membrane includes a coupling plate and a spring structure connected to the coupling plate. The actuator is configured to receive a driving signal to actuate the membrane. The spring structure is situated between the coupling plate and the actuator. The coupling plate is actuated to move by the actuator via the spring structure.Type: GrantFiled: May 31, 2021Date of Patent: February 15, 2022Assignee: xMEMS Labs, Inc.Inventors: Chiung C. Lo, David Hong, Jemm Yue Liang, Lei Chen, Hai-Hung Wen, JengYaw Jiang, Martin George Lim, Wen-Chien Chen, Hsien-Ken Liao, Chun-I Chang
-
Publication number: 20210314688Abstract: A sound producing package structure includes a shell and a chip. The shell includes a top structure, a bottom structure and a sidewall structure. The chip is disposed inside the shell and configured to produce an acoustic wave, wherein the chip includes a thin film structure and an actuator configured to actuate the thin film structure, and the thin film structure is substantially parallel to the top structure and the bottom structure. A first opening is formed on the sidewall structure, and the acoustic wave propagates outwards through the first opening.Type: ApplicationFiled: June 16, 2021Publication date: October 7, 2021Applicant: xMEMS Labs, Inc.Inventors: Chiung C. Lo, Hsien-Ken Liao, Martin George Lim
-
Publication number: 20210297787Abstract: A package structure includes a housing and a sound producing chip. The sound producing chip is disposed within the housing. The sound producing chip includes a membrane and an actuator. The membrane includes a coupling plate and a spring structure connected to the coupling plate. The actuator is configured to receive a driving signal to actuate the membrane. The spring structure is situated between the coupling plate and the actuator. The coupling plate is actuated to move by the actuator via the spring structure.Type: ApplicationFiled: May 31, 2021Publication date: September 23, 2021Inventors: Chiung C. Lo, David Hong, Jemm Yue Liang, Lei Chen, Hai-Hung Wen, JengYaw Jiang, Martin George Lim, Wen-Chien Chen, Hsien-Ken Liao, Chun-I Chang
-
Patent number: 10867816Abstract: A method for processing a semiconductor wafer is provided. The method includes placing a semiconductor wafer on a wafer chuck. The method further includes performing a process over the wafer. The method also includes supplying a cooling gas to the backside of the semiconductor wafer via a groove and a number of ventilation apertures located in the groove. Two of the neighboring ventilation apertures are separated in a circumferential direction relative to the center of the wafer chuck by a predetermined angle that is less than 90 degrees.Type: GrantFiled: October 11, 2017Date of Patent: December 15, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chung-Hsiu Cheng, Young-Shuen Chou, I-Che Chiu, Tsung-Hao Lu, Ken Liao
-
Patent number: 10362406Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through the base layer, a conduction part arranged on the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, an acoustic wave sensor mounted on the top surface of the base layer to face toward the sound hole, a processor chip mounted on the top surface of the base layer and electrically connected to the acoustic wave sensor and the conduction part, and one or multiple electronic components electrically bonded to the cover plate.Type: GrantFiled: October 26, 2016Date of Patent: July 23, 2019Assignee: LINGSEN PRECISION INDSUTRIES, LTD.Inventors: Yao-Ting Yeh, Hsien-Ken Liao, Jyong-Yue Tian, Ming-Te Tu
-
Patent number: 10362377Abstract: A MEMS microphone package includes a substrate including a sound hole, a first conduction part and a second conduction part, a sidewall connected with one end thereof to the substrate and having a conducting line electrically connected to the second conduction part, a cover plate connected to an opposite end of the sidewall and defining a chamber therein and having a solder pad and a fifth contact in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted on the substrate inside the chamber and electrically connected to the first conduction part and the second conduction part, and a acoustic wave sensor mounted on the substrate inside the chamber to face toward the sound hole and electrically connected to the first conduction part using flip-chip technology.Type: GrantFiled: October 26, 2016Date of Patent: July 23, 2019Assignee: LINGSEN PRECISION INDUSTRIES, LTD.Inventors: Hsien-Ken Liao, Ming-Te Tu, Jyong-Yue Tian, Yao-Ting Yeh
-
Patent number: 10336262Abstract: A seating assembly comprises a lower seating assembly having a lower surface displaced above a floor pan, a mounting bracket operably coupling a forward edge of the lower seating assembly to the floor pan, and a storage bin comprising a horizontally disposed frame member disposed between the lower surface and the floor pan, wherein the storage bin, the floor pan, and the lower surface define an enclosure below the lower seating assembly.Type: GrantFiled: April 18, 2017Date of Patent: July 2, 2019Assignee: FORD GLOBAL TECHNOLOGIES, LLCInventors: Kevin Mozurkewich, Murtatha Zalzala, Nicholas Salenbien, Ammeswara Rao Sajja, Ken Liao
-
Patent number: 10333007Abstract: A short-channel metal oxide semiconductor varactor may include a source region of a first polarity having a source via contact. The varactor may further include a drain region of the first polarity having a drain via contact. The varactor may further include a channel region of the first polarity between the source region and the drain region. The channel region may include a gate. The varactor may further include at least one self-aligned contact (SAC) on the gate and between the source via contact and the drain via contact.Type: GrantFiled: August 25, 2017Date of Patent: June 25, 2019Assignee: QUALCOMM IncorporatedInventors: Ye Lu, Yun Yue, Chuan-Hsing Chen, Bin Yang, Lixin Ge, Ken Liao
-
Patent number: 10300810Abstract: A latch assembly can be used for a vehicle seat where the latch assembly includes a cushion latch coupled to a cushion pan where the cushion latch includes a support bracket and a pin. The pin may be coupled to at least one resilient element and a pull strap. The latch assembly additionally includes a latch catch bracket coupled to a support arm where the pin of the cushion latch engages the latch catch bracket to immobilize the cushion pan.Type: GrantFiled: December 21, 2017Date of Patent: May 28, 2019Assignee: Ford Global Technologies, LLCInventors: Nicholas Salenbien, Ken Liao
-
Patent number: 10299046Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through opposing top and bottom surfaces of the base layer, a conduction part arranged on the base layer and a notch located on the top surface of the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted in the notch and electrically connected to the conduction part, and an acoustic wave sensor mounted on the base layer to face toward the sound hole and electrically connected to the processor chip.Type: GrantFiled: October 27, 2016Date of Patent: May 21, 2019Assignee: LINGSEN PRECISION INDUSTRIES, LTD.Inventors: Hsien-Ken Liao, Ming-Te Tu, Jyong-Yue Tian, Yao-Ting Yeh
-
Publication number: 20180366592Abstract: A short-channel metal oxide semiconductor varactor may include a source region of a first polarity having a source via contact. The varactor may further include a drain region of the first polarity having a drain via contact. The varactor may further include a channel region of the first polarity between the source region and the drain region. The channel region may include a gate. The varactor may further include at least one self-aligned contact (SAC) on the gate and between the source via contact and the drain via contact.Type: ApplicationFiled: August 25, 2017Publication date: December 20, 2018Inventors: Ye LU, Yun YUE, Chuan-Hsing CHEN, Bin YANG, Lixin GE, Ken LIAO
-
Publication number: 20180297533Abstract: A seating assembly comprises a lower seating assembly having a lower surface displaced above a floor pan, a mounting bracket operably coupling a forward edge of the lower seating assembly to the floor pan, and a storage bin comprising a horizontally disposed frame member disposed between the lower surface and the floor pan, wherein the storage bin, the floor pan, and the lower surface define an enclosure below the lower seating assembly.Type: ApplicationFiled: April 18, 2017Publication date: October 18, 2018Applicant: FORD GLOBAL TECHNOLOGIES, LLCInventors: Kevin Mozurkewich, Murtatha Zalzala, Nicholas Salenbien, Ammeswara Rao Sajja, Ken Liao
-
Publication number: 20180166305Abstract: A method for processing a semiconductor wafer is provided. The method includes placing a semiconductor wafer on a wafer chuck. The method further includes performing a process over the wafer. The method also includes supplying a cooling gas to the backside of the semiconductor wafer via a groove and a number of ventilation apertures located in the groove. Two of the neighboring ventilation apertures are separated in a circumferential direction relative to the center of the wafer chuck by a predetermined angle that is less than 90 degrees.Type: ApplicationFiled: October 11, 2017Publication date: June 14, 2018Inventors: Chung-Hsiu CHENG, Young-Shuen CHOU, I-Che CHIU, Tsung-Hao LU, Ken LIAO
-
Publication number: 20180063645Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through the base layer, a conduction part arranged on the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, an acoustic wave sensor mounted on the top surface of the base layer to face toward the sound hole, a processor chip mounted on the top surface of the base layer and electrically connected to the acoustic wave sensor and the conduction part, and one or multiple electronic components electrically bonded to the cover plate.Type: ApplicationFiled: October 26, 2016Publication date: March 1, 2018Inventors: Yao-Ting YEH, Hsien-Ken LIAO, Jyong-Yue TIAN, Ming-Te TU
-
Publication number: 20180063646Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through opposing top and bottom surfaces of the base layer, a conduction part arranged on the base layer and a notch located on the top surface of the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted in the notch and electrically connected to the conduction part, and an acoustic wave sensor mounted on the base layer to face toward the sound hole and electrically connected to the processor chip.Type: ApplicationFiled: October 27, 2016Publication date: March 1, 2018Inventors: Hsien-Ken LIAO, Ming-Te TU, Jyong-Yue TIAN, Yao-Ting YEH
-
Publication number: 20180063616Abstract: A microelectromechanical microphone package structure includes a substrate, sidewall, lid, sound wave transducer and processing module. The substrate has a plate, sound aperture penetrating the plate, and conduction portion disposed on the plate. The sidewall has one end disposed on the plate and has a conduction circuit electrically connected to the conduction portion. A chamber is defined between the lid, sidewall and plate. The lid has at least one solder pad and a third contact in electrical conduction with each other. The third contact is electrically connected to the conduction circuit. The sound wave transducer is disposed on the plate and in the chamber and aligned with the sound aperture. The processing module, which is disposed on the plate and in the chamber and electrically connected to the sound wave transducer and conduction portion, includes a processing chip and electronic component which are stacked and disposed on the plate.Type: ApplicationFiled: October 27, 2016Publication date: March 1, 2018Inventors: Hsien-Ken LIAO, Ming-Te TU, Jyong-Yue TIAN, Yao-Ting YEH