Abstract: Provided is a test apparatus for testing a plurality of devices under test formed on a semiconductor wafer, including: a probe card to be connected to respective contacts of the plurality of the devices under test on a connection surface to be overlapped on the semiconductor wafer, the probe card being provided with a plurality of corresponding contacts on a rear surface of the connection surface; and a test head that tests the plurality of devices under test on the semiconductor wafer by sequentially connecting to each part of the plurality of contacts of the probe card.

Abstract: Provided is a circuit board unit for connecting a connecting terminal of a testing apparatus to a connected terminal of a device under test, including: a circuit board having, on one surface, a contact corresponding to the connected terminal; and a connector guide provided on the one surface of the circuit board, the connector guide guiding a connector having the connecting terminal to the circuit board, and pulling the connector towards the circuit board. In this circuit board unit, the connector guide may bias the connector on a side of the connecting terminal, towards the circuit board. Moreover in the circuit board unit, the circuit board may further have a substrate frame that is coupled to the connector guide and biases the connector guide towards the circuit board.

Abstract: Provided is a test apparatus for testing a plurality of devices under test formed on a semiconductor wafer, including: a probe card to be connected to respective contacts of the plurality of the devices under test on a connection surface to be overlapped on the semiconductor wafer, the probe card being provided with a plurality of corresponding contacts on a rear surface of the connection surface; and a test head that tests the plurality of devices under test on the semiconductor wafer by sequentially connecting to each part of the plurality of contacts of the probe card.

Abstract: There is provided a device-dependent replaceable unit for use with a test apparatus, which can reduce signal deterioration. The device-dependent replaceable unit is selected depending on a type of a device under test, and to be mounted on the test apparatus to form a signal path between the device under test and the test apparatus. The device-dependent replaceable unit includes a socket board that has a front surface and a back surface, where the device under test is to be moved close to or away from the front surface of the socket board, and a plurality of spring pins that are positioned in a same manner as a plurality of connection terminals of the device under test, where the spring pins are supported by the socket board in such a manner that upper ends of the spring pins protrude from the front surface of the socket board and come into contact with the connection terminals of the device under test.

Abstract: Provided is a circuit board unit for connecting a connecting terminal of a testing apparatus to a connected terminal of a device under test, including: a circuit board having, on one surface, a contact corresponding to the connected terminal; and a connector guide provided on the one surface of the circuit board, the connector guide guiding a connector having the connecting terminal to the circuit board, and pulling the connector towards the circuit board. In this circuit board unit, the connector guide may bias the connector on a side of the connecting terminal, towards the circuit board. Moreover in the circuit board unit, the circuit board may further have a substrate frame that is coupled to the connector guide and biases the connector guide towards the circuit board.