Patents by Inventor Ken Nanaumi
Ken Nanaumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9786576Abstract: A positive-type photosensitive resin composition includes (A) a phenol resin modified by a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms; (B) a compound that produces an acid by light; (C) a thermal crosslinking agent; and (D) a solvent. The positive-type photosensitive resin composition according to the present invention can be developed by an alkaline aqueous solution, and an effect thereof is that a resist pattern having sufficiently high sensitivity and resolution, excellent adhesion, and good thermal shock resistance can be formed.Type: GrantFiled: November 7, 2008Date of Patent: October 10, 2017Assignee: HITACHI CHEMICAL COMPANY, LTDInventors: Hiroshi Matsutani, Takumi Ueno, Alexandre Nicolas, Ken Nanaumi
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Patent number: 8461699Abstract: The positive tone photosensitive composition of the invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound producing an acid by light, a thermal crosslinking agent and an acrylic resin. It is possible to provide a positive tone photosensitive composition that can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution, and can form a resist pattern with excellent adhesiveness and thermal shock resistance.Type: GrantFiled: December 16, 2009Date of Patent: June 11, 2013Assignee: Hitachi Chemical Company, Ltd.Inventors: Hiroshi Matsutani, Takumi Ueno, Alexandre Nicolas, Yukihiko Yamashita, Ken Nanaumi, Akitoshi Tanimoto
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Patent number: 8426985Abstract: A positive tone photosensitive composition comprising: (A) an alkali-soluble resin having a phenolic hydroxyl group; (B) a phenol resin modified by a compound having an unsaturated hydrocarbon group containing 4 to 100 carbon atoms; (C) a compound that generates an acid by the action of light; (D) a thermal cross-linker that crosslinks the ingredient (A) and the ingredient (B) by heating; and (E) a solvent.Type: GrantFiled: September 2, 2009Date of Patent: April 23, 2013Assignee: Hitachi Chemical Company, Ltd.Inventors: Hiroshi Matsutani, Takumi Ueno, Alexandre Nicolas, Ken Nanaumi
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Patent number: 8084130Abstract: The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.Type: GrantFiled: September 25, 2007Date of Patent: December 27, 2011Assignee: Hitachi Chemical Co., Ltd.Inventors: Mitsuyoshi Hamada, Akira Nagai, Hiroaki Ikeba, Ken Nanaumi, Kouhei Yasuzawa
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Publication number: 20110254178Abstract: The positive tone photosensitive composition of the invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound producing an acid by light, a thermal crosslinking agent and an acrylic resin. It is possible to provide a positive tone photosensitive composition that can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution, and can form a resist pattern with excellent adhesiveness and thermal shock resistance.Type: ApplicationFiled: December 16, 2009Publication date: October 20, 2011Inventors: Hiroshi Matsutani, Takumi Ueno, Alexandre Nicolas, Yukihiko Yamashita, Ken Nanaumi, Akitoshi Tanimoto
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Publication number: 20110250396Abstract: A positive-type photosensitive resin composition includes (A) a phenol resin modified by a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms; (B) a compound that produces an acid by light; (C) a thermal crosslinking agent; and (D) a solvent. The positive-type photosensitive resin composition according to the present invention can be developed by an alkaline aqueous solution, and an effect thereof is that a resist pattern having sufficiently high sensitivity and resolution, excellent adhesion, and good thermal shock resistance can be formed.Type: ApplicationFiled: November 7, 2008Publication date: October 13, 2011Inventors: Hiroshi Matsutani, Takumi Ueno, Alexandre Nicolas, Ken Nanaumi
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Publication number: 20110204528Abstract: A positive tone photosensitive composition comprising: (A) an alkali-soluble resin having a phenolic hydroxyl group; (B) a phenol resin modified by a compound having an unsaturated hydrocarbon group containing 4 to 100 carbon atoms; (C) a compound that generates an acid by the action of light; (D) a thermal cross-linker that crosslinks the ingredient (A) and the ingredient (B) by heating; and (E) a solvent.Type: ApplicationFiled: September 2, 2009Publication date: August 25, 2011Inventors: Hiroshi Matsutani, Takumi Ueno, Alexandre Nicolas, Ken Nanaumi
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Publication number: 20090326100Abstract: The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.Type: ApplicationFiled: September 25, 2007Publication date: December 31, 2009Inventors: Mitsuyoshi Hamada, Akira Nagai, Hiroaki Ikeba, Ken Nanaumi, Kouhei Yasuzawa
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Patent number: 7538150Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.Type: GrantFiled: September 7, 2005Date of Patent: May 26, 2009Assignee: Hitachi Chemical Company, LtdInventors: Kenichi Oohori, Yoshihiro Nakamura, Hikari Murai, Yoshiyuki Takeda, Yasuyuki Hirai, Shinichi Kamoshida, Minoru Kakitani, Norihiro Abe, Syunichi Numata, Teruki Aizawa, Ken Nanaumi
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Publication number: 20060008632Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.Type: ApplicationFiled: September 7, 2005Publication date: January 12, 2006Inventors: Kenichi Oohori, Yoshihiro Nakamura, Hikari Murai, Yoshiyuki Takeda, Yasuyuki Hirai, Shinichi Kamoshida, Minoru Kakitani, Norihiro Abe, Syunichi Numata, Teruki Aizawa, Ken Nanaumi
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Publication number: 20040076805Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a dihydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.Type: ApplicationFiled: July 9, 2003Publication date: April 22, 2004Inventors: Kenichi Oohori, Yoshihiro Nakamura, Hiraki Murai, Yoshiyuki Takeda, Yasuyuki Hirai, Shinichi Kamoshida, Minoru Kakitani, Norihiro Abe, Syunichi Numata, Teruki Aizawa, Ken Nanaumi
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Patent number: 6475629Abstract: Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.Type: GrantFiled: February 2, 2001Date of Patent: November 5, 2002Assignee: Hitachi Chemical Company, Ltd.Inventors: Kazumasa Takeuchi, Tetsuya Saito, Ken Nanaumi
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Patent number: 6252010Abstract: Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.Type: GrantFiled: October 29, 1998Date of Patent: June 26, 2001Assignee: Hitachi Chemical Company, Ltd.Inventors: Kazumasa Takeuchi, Tetsuya Saito, Ken Nanaumi
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Patent number: 5885723Abstract: Provided is bonding film for printed circuit boards which is resistant to cracking even when bent with a small radius of curvature, has a sufficient mechanical strength even in its semi-cured state so that the handling may be facilitated, is not undesirably brittle and therefore does not produce undesired debris when cut, and is flexible and flame retardant at the same time. The bonding film may consist of (i) high polymer epoxy resin; (ii) denatured polyamide obtained by reacting epoxy resin and polyamide; (iii) polyfunctional epoxy resin; and (iv) curing agent. Preferably, the denatured polyamide includes a polyalkylene-glycol residue or a polycarbonate-diol residue. Preferably, the high polymer epoxy resin is produced by the polymerization of bifunctional epoxy resin and bifunctional phenol resin, and has a weight averaged molecular weight equal to 50,000 or higher.Type: GrantFiled: December 19, 1997Date of Patent: March 23, 1999Assignee: Hitachi Chemical Company, Ltd.Inventors: Atsushi Takahashi, Shinji Ogi, Koji Morita, Kazunori Yamamoto, Ken Nanaumi, Kiyoshi Hirosawa, Akinari Kida, Takao Hirayama, Toshihiko Ito, Hiroaki Hirakura
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Patent number: 5380789Abstract: A catalyst selected from a perfluorosulfonic acid and an anhydride thereof enables a non-conjugated drying oil to react with a phenol to form a phenol-added vegetable oil without causing hydrolysis of the non-conjugated drying oil. The phenol-added vegetable oil is allowed to react with an aldehyde to form a vegetable oil-modified phenolic resin. A laminate produced by impregnating paper with the vegetable oil-modified phenolic resin and laminating and molding the impregnated paper is excellent in low temperature punching quality and electrical properties and is free from low molecular weight components oozing out the surface of the laminate.Type: GrantFiled: August 10, 1993Date of Patent: January 10, 1995Assignee: Hitachi Chemical Company, Ltd.Inventors: Ken Nanaumi, Takeshi Horiuchi, Masahiro Nomoto, Mitsuhiro Inoue
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Patent number: 5206333Abstract: A copolycondensation of a phenol, a naphthol and formaldehyde proceeds smoothly in the presence of an acid and a metallic element selected from the group consisting of transition metallic elements and metallic elements of Group IIa, Group IIIa, Group IVa, Group Va and Group VIa of the Periodic Table, and a naphthol-modified phenolic resin which has a large molecular weight and does not gel is obtained.Type: GrantFiled: May 7, 1992Date of Patent: April 27, 1993Assignee: Hitachi Chemical Company, Ltd.Inventors: Haruaki Sue, Ken Nanaumi, Takuji Itou, Ken Madarame, Shinsuke Hagiwara
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Patent number: 5066691Abstract: An adhesive composition for metal-clad laminates which comprises:(a) 100 parts by weight of a polyvinylbutyral having an average polymerization degree of from 500 to 3,000 and a degree of butyralization of at least 60 mol %,(b) from 10 to 200 parts by weight of an epoxidized polybutadiene per 100 parts by weight of the polyvinylbutyral, the epoxidized polybutadiene having a number average molecular weight of from 1,000 to 10,000 and an epoxy equivalent weight of from 200 to 2,000, and(c) from 1 to 10 parts by weight of a hardener for the epoxidized polybutadiene per 100 parts by weight of the epoxidized polybutadiene.Type: GrantFiled: November 29, 1989Date of Patent: November 19, 1991Assignee: Hitachi Chemical Co., Ltd.Inventors: Toshihisa Kumakura, Ken Nanaumi, Ryoichi Ikezawa, Hideki Eriguchi
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Patent number: 4278786Abstract: A heat-resistant polyamide polymer having melt-moldability is obtained by reacting an aromatic diamine having the general formula: ##STR1## with an equivalent amount of aromatic dicarboxylic acid dihalide in an organic solvent in the presence of an aqueous solution of an alkali-metal hydroxide. When an equimolar mixture of terephthalic acid dihalide and isophthalic dihalide is reacted with the diamine, polyamide polymers with good melt-moldability are obtained.Type: GrantFiled: July 5, 1979Date of Patent: July 14, 1981Assignee: Hitachi, Ltd.Inventors: Ken Nanaumi, Fusaji Shoji, Hisashi Kohkame, Susumu Era
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Patent number: 4229330Abstract: Internally plasticized phenolic resins suitable for use in preparing laminates and the like excellent in electrical properties, heat resistance, solvent resistance as well as punchability are produced by reacting a compound of the formula: ##STR1## wherein R.sub.1 is an alkylene residue having 1 to 3 carbon atoms; and R.sub.2 and R.sub.3 are independently hydrogen or a saturated or unsaturated hydrocarbon group having 1 to 3 carbon atoms, with an epoxidized vegetable oil with heating in the presence of one or more secondary and/or tertiary amines, and adding formaldehyde or one or more phenols and formaldehyde to the reaction system to further proceed the reaction.Type: GrantFiled: August 28, 1978Date of Patent: October 21, 1980Assignee: Hitachi Chemical Company, Ltd.Inventors: Susumu Konii, Yukio Yoshimura, Ken Nanaumi, Kohei Yasuzawa, Takeshi Yoshida, Toyotaro Shinko
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Patent number: 4209429Abstract: Internally plasticized phenolic resins suitable for use in preparing laminates and the like excellent in electrical properties, heat resistance, solvent resistance as well as punchability are produced by reacting a phenol-formaldehyde resin containing less than 4% by weight of unreacted free monohydric phenol or phenols with an epoxidized vegetable oil, and if required with formaldehyde, with heating preferably in the presence of one or more secondary and/or tertiary amines.Type: GrantFiled: August 28, 1978Date of Patent: June 24, 1980Assignee: Hitachi Chemical Company, Ltd.Inventors: Susumu Konii, Yukio Yoshimura, Ken Nanaumi, Kohei Yasuzawa, Takeshi Yoshida, Toyotaro Shinko