Patents by Inventor Ken OKOSHI

Ken OKOSHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240175117
    Abstract: A film forming method includes performing a process including a) and b) a plurality of times, with a) being performed before b) in the process: a) supplying borazine-based gas to a substrate, thereby adsorbing the borazine-based gas to the substrate and b) exposing the substrate to a nitrogen plasma.
    Type: Application
    Filed: November 21, 2023
    Publication date: May 30, 2024
    Inventors: Ken OKOSHI, Yamato TONEGAWA, Jun OGAWA
  • Publication number: 20240087925
    Abstract: An information processing apparatus includes a data acquisition unit, a simulation execution unit, and an optimization unit. The data acquisition unit acquires execution result data including an execution result of the substrate processing based on a process parameter including a pressure in the substrate processing apparatus and including sensor data of the pressure in the substrate processing apparatus. The simulation execution unit inputs the execution result data into a simulation model pre-stored in a storage to calculate a pressure in the substrate processing apparatus that is predicted to approach a target value for a substrate processing result. The optimization unit calculates a predicted value of the substrate processing result based on the process parameter including the calculated pressure.
    Type: Application
    Filed: September 6, 2023
    Publication date: March 14, 2024
    Inventors: Youngtai KANG, Yuichi TAKENAGA, Kiwamu ITO, Rui IKEDA, Ken OKOSHI
  • Publication number: 20220254629
    Abstract: With respect to a method of depositing a silicon nitride film on a surface of a substrate, the method includes depositing the silicon nitride film on the surface of the substrate by intermittently supplying trisilylamine into a processing chamber accommodating the substrate.
    Type: Application
    Filed: January 20, 2022
    Publication date: August 11, 2022
    Inventors: Ken OKOSHI, Yamato TONEGAWA, Keiji TABUKI