Patents by Inventor Ken Sasabe

Ken Sasabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040009090
    Abstract: To provide a nickel based brazing filler metal which does not contain at all boron (B) or phosphorus (P) that is likely to form a hard and brittle compound in the brazed layer, in which the liquidus is lowered below 1,100° C. by adding a small amount of silicon (Si) and is abundant in ductility, heat-resistance and corrosion resistance. This is attained by a nickel based brazing filler metal characterized by containing manganese (Mn) of 13 to 20% by wt. and silicon (Si) of 5 to 7% by wt. added as melting point depression elements and chrome (Cr) of 16 to 21% by wt. and the balance consisting of nickel (Ni) and the impurities.
    Type: Application
    Filed: July 10, 2003
    Publication date: January 15, 2004
    Applicants: NATIONAL SPACE DEVELOPMENT AGENCY OF JAPAN, THE JAPAN WELDING ENGINEERING SOCIETY
    Inventors: Makoto Shirai, Ken Sasabe, Takehiko Watanabe
  • Patent number: 4838474
    Abstract: A method of diffusion bonding of aluminum or an alumina ceramic to aluminum, an alumina ceramic or a metal other than aluminum, which comprises interposing an aluminum alloy prepared by including 0.2 to 3% by weight of magnesium and/or 0.1 to 1.5% by weight of lithium into aluminum or an aluminum alloy between the surfaces of materials to be bonded, and heating said surfaces to be bonded of these materials under pressure at a temperature at which magnesium or lithium diffuses.
    Type: Grant
    Filed: March 3, 1988
    Date of Patent: June 13, 1989
    Assignee: National Research Institute for Metals
    Inventors: Osamu Ohashi, Ken Sasabe