Abstract: A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

Abstract: An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit elements that are electrically connected to the laser. The laser can be protected from the environment using either a cap in which the reflector is integrated or using an encapsulant encasing the laser. An alignment post that is sized to fit into a sleeve is mounted where the optical signal emerges from the sub-mount. Plugging the post into one end of the sleeve and inserting an optical fiber into the other end of the sleeve so that the optical fiber abuts the post will then align the optical fiber to receive the optical signal.

Abstract: A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.

Abstract: A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

Abstract: A module for coupling to a fiber-optic cable includes an optoelectronic assembly that includes a bracket and a metal receptacle. The metal receptacle includes an attachment member operable to releasably connect the receptacle to the bracket, an alignment end operable to receive an alignment device, and a connector end operable to releasably connect to the fiber-optic cable and to orient the cable with the alignment device. The metal receptacle can suppress EMI and can typically withstand higher temperatures than most plastic materials. Thus, when subject to high temperatures, the receptacle typically will not expel gas that can fog a lens or deform. The attachment member allows one to releasably connect the receptacle to an optoelectronic assembly without fixing the receptacle to the assembly with adhesive. Thus, the receptacle can be mounted to an optoelectronic assembly quickly and without an alignment fixture.

Abstract: A transceiver module is adapted to be plugged into a port cage within a host system. The transceiver module includes transceiver electronics and a connector attached to the transceiver electronics. The transceiver electronics are sized to fit within the port cage. The connector includes a module portion and a connector jack attached to the module portion. The module portion is sized to fit along with the transceiver electronics within the port cage. The connector jack is sized with dimensions too big to fit within the port cage. The connector jack remains out of the port cage when the transceiver module is placed within the port cage. The connector jack occupies an area larger than an opening of the port cage.

Abstract: A transceiver module is adapted to be plugged into a port cage within a host system. The transceiver module includes transceiver electronics and a connector attached to the transceiver electronics. The transceiver electronics are sized to fit within the port cage. The connector includes a module portion and a connector jack attached to the module portion. The module portion is sized to fit along with the transceiver electronics within the port cage. The connector jack is sized with dimensions too big to fit within the port cage. The connector jack remains out of the port cage when the transceiver module is placed within the port cage. The connector jack occupies an area larger than an opening of the port cage.

Abstract: An optoelectronic device is provided having an active alignment. The lens and the optoelectronic device are mounted on their respective carrying members, and the carrying members are placed proximate to each other in a loose alignment controlled by alignment pins loosely engaging oversized alignment opening. An alignment range is created by a difference in the diameter of the alignment pins and the alignment opening, allowing the lens and optoelectronic device to be moved with respect to each other and actively aligned. The member carrying the lens may also include a connector stop cooperatively arranged with the alignment pins to provide an aligned coupling between an optical fiber connector and the optoelectronic component.

Abstract: A method and apparatus for ensuring that two guide pins with a centerline in a module (e.g., a fiber optic module) mate with two holes in a connector. A connector guide positioner is provided to position a connector guide in an aligned orientation with respect to the guide pins. When in the aligned orientation, the centerline of the connector guide is in alignment with the centerline of the two guide pins of the module, thereby ensuring that the two holes of the connector mate with the two guide pins when the connector is inserted into the receptacle.

Abstract: A transceiver module is adapted to be plugged into a port cage within a host system. The transceiver module includes transceiver electronics and a connector attached to the transceiver electronics. The transceiver electronics are sized to fit within the port cage. The connector includes a module portion and a connector jack attached to the module portion. The module portion is sized to fit along with the transceiver electronics within the port cage. The connector jack is sized with dimensions too big to fit within the port cage. The connector jack remains out of the port cage when the transceiver module is placed within the port cage. The connector jack occupies an area larger than an opening of the port cage.

Abstract: A method and apparatus for ensuring that two guide pins with a centerline in a module (e.g., a fiber optic module) mate with two holes in a connector. A connector guide positioner is provided to position a connector guide in an aligned orientation with respect to the guide pins. When in the aligned orientation, the centerline of the connector guide is in alignment with the centerline of the two guide pins of the module, thereby ensuring that the two holes of the connector mate with the two guide pins when the connector is inserted into the receptacle.

Abstract: An optical coupling system includes a unitary separation-setting member for establishing precise spatial relationships among a microlens array, an array of light sources, and an array of optical fibers. The separation-setting member includes an interior region with a shoulder against which the lens array is positioned. The shoulder is at a precisely controlled distance from a target plane along which the ends of the optical fibers are aligned. The target plane is defined by the front surface of the separation-setting member. Thus, the dimensions of the separation-setting member control the distance of the fiber ends from the microlenses. Moreover, a back surface of the separation-setting member is at a precisely controlled distance from the shoulder, so that when the back surface is rested against a substrate on which the light sources are mounted, the light sources are precisely positioned relative to the microlenses.

Abstract: An optical coupling system includes a unitary separation-setting member for establishing precise spatial relationships among a microlens array, an array of light sources, and an array of optical fibers. The separation-setting member includes an interior region with a shoulder against which the lens array is positioned. The shoulder is at a precisely controlled distance from a target plane along which the ends of the optical fibers are aligned. The target plane is defined by the front surface of the separation-setting member. Thus, the dimensions of the separation-setting member control the distance of the fiber ends from the microlenses. The dimensions of the separation-setting member also control the distance of the microlenses from light sources, such as VCSELs. A back surface of the separation-setting member is at a precisely controlled distance from the shoulder.

Abstract: A silicon standoff acts as a shim during reflow between a module and a printed circuit board. The silicon standoff is attached to a flexible circuit. A ball grid array interposes the connection pads of the module and the printed circuit board. The height of the standoff is determined based on the amount of ball collapse that is desired. During reflow, the silicon standoff will not collapse, therefore the ball grid array can only collapse as far as the standoff allows before contacting the printed circuit board.