Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.

Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.

Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.

Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.

Abstract: Propped fractures in formations from which fluids are produced are described that have wormholes extending out into the formations from the faces of the fractures at locations distant from boreholes. Methods are given for creating such propped fractures having wormholes in which either a closed propped fracture is formed and then the wormholes are formed, or the entire fracture and channel system is formed before the closure occurs.

Abstract: Compositions and methods are given to prevent, alleviate and remedy water blocks and gas blocks (condensate block or condensate banking). Wettability modifiers are contacted with the formation to change the surfaces from water wet or oil wet to intermediate wet or gas wet. Preferred wettability modifiers include partially or completely fluorinated surfactants or polymers, for example fluorosilanes such as perfluorosilanes, urethane oligomers containing perfluoro alkyl moieties, fluoroacrylates, and fluoroalkyl containing terpolymers or their mixtures. Other examples include surfactants, for example viscoelastic surfactants such as cationic surfactants such as quaternary amines, and zwitterionic surfactants, such as betaines, optionally mixed with co-surfactants.

Abstract: A method is given for diverting acids in matrix acidizing and acid fracturing. The acids are diverted with a diverting agent that is an energized or foamed acidic viscoelastic surfactant system that contains a viscoelastic surfactant that gels and increases in viscosity when the acid in the foamed acidic viscoelastic surfactant system is spent. The method provides a synergistic combination of the diverting capabilities of foams and the diverting capabilities of viscoelastic gel systems. The resistance to flow of the gelled foamed viscoelastic surfactant system is greater than expected from a foam or a viscoelastic gel system alone.

Abstract: The invention relates to composition particularly suitable for squeeze cementing operations at temperature above 160° C. This composition comprises an aqueous base, a liquid set-retarder and a solid phase including a blend of micro fine alumina, micro fine silica and a micro fine cementitious material.

Abstract: Propped fractures in formations from which fluids are produced are described that have wormholes extending out into the formations from the faces of the fractures at locations distant from boreholes. Methods are given for creating such propped fractures having wormholes in which either a closed propped fracture is formed and then the wormholes are formed, or the entire fracture and channel system is formed before the closure occurs.

Abstract: An underbalanced perforating system is disclosed for use in openhole completions to maximize the wellbore and matrix cleanup efficiency, to connect natural fracture patterns, and/or to enable application of new drilling fluid technology in difficult subsurface environments. The perforating system can be used for any hydrocarbon bearing formations with any lithology.

Abstract: A method is given for diverting acids in matrix acidizing and acid fracturing. The acids are diverted with a diverting agent that is an energized or foamed acidic viscoelastic surfactant system that contains a viscoelastic surfactant that gels and increases in viscosity when the acid in the foamed acidic viscoelastic surfactant system is spent. The method provides a synergistic combination of the diverting capabilities of foams and the diverting capabilities of viscoelastic gel systems. The resistance to flow of the gelled foamed viscoelastic surfactant system is greater than expected from a foam or a viscoelastic gel system alone.