Abstract: Systems and methods are described for fabricating a metal or ceramic component using 3D printing. A 3D printed piece is created that includes a body of the component and a support structure. While the 3D printed piece is created using a single printing material, one or more processing parameters are adjusted while printing a first sacrificial interface region coupling the body of the component to the support structure. The body of the component is separated from the support structure by applying a chemical or electrochemical dissolution process to the 3D printed piece. The adjustment to the one or more processing parameters during printing of the first sacrificial interface region creates a localized area that is less resistant to the chemical or electrochemical dissolution process than the body of the component.

Abstract: Ultrasonic filament modeling systems and methods may be utilized to achieve room-temperature 3-D printing of solid (>95%) metal materials. A vibrating tool is applied to a metal filament to form a voxel, inducing mechanical deformation as well as inter-and intra-layer mass transport. Desired structures may be built on a voxel-by-voxel basis. Additionally, by varying the applied ultrasonic energy, the microstructure of the resulting structure may be controlled.

Abstract: A waterproof racket includes an annular skeleton, a receiving pocket having a pocket cavity, and a trampoline layer affixed to the receiving pocket. The annular skeleton is received in the pocket cavity to retain the receiving pocket in an annular configuration. The trampoline layer is affixed to a centerline of the receiving pocket, wherein the trampoline layer is stretched to form a trampoline surface in a tension manner.

Abstract: Fused deposition modeling (FDM) systems and methods may be improved via laser pre-heating of the target substrate ahead of the extrusion nozzle. Higher interface temperatures lead to improved wetting, diffusion, and randomization, thus improving the bond between filaments and between layers, and reducing anisotropy in the resulting finished part.

Abstract: The present invention provides an electrochemical fabrication platform for making structures, arrays of structures and functional devices having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods, systems and system components of the present invention use an electrochemical stamping tool for generating patterns of relief and/or recessed features exhibiting excellent reproducibility, pattern fidelity and resolution on surfaces of solid state ionic conductors and in metal. Electrochemical stamping tools of the present invention are capable high throughput patterning of large substrate areas and, thus, enable a robust and commercially attractive manufacturing pathway to a range of functional systems and devices including nano- and micro-electromechanical systems, sensors, energy storage devices and integrated electronic circuits.

Abstract: A wafer boat which is suitable for supporting wafers in a process furnace is disclosed. The wafer boat includes a base plate, multiple support rods carried by the base plate and multiple wafer support pins carried by each of the support rods. Each of the wafer support pins has an upper surface disposed at an acute angle with respect to a longitudinal axis of each of the support rods. This causes contact of the wafer support pins with the wafer at the wafer's center of gravity and minimizes the contact surface area between the wafer support pins and each wafer.

Abstract: The detent means for a heat sink is provided thereon with an elastic member in connecting with two side clamp holders, the elastic member is bent to render the bending area to be the force bearing point which is communicating in force with the two side clamp holders, the thickness of a lateral arm between the bending area and one of the two side clamp holders is gradually reduced toward the side clamp holder; the lateral arm of the elastic member can be slightly bent and fixed in shape by the force exerting on the elastic member, after being fixed in shape, the elastic variable thereof is fixed for firmly holding by clamping; the detent means can prevent cracking of the main body of the heat source due to an overly large clamping force, and can largely increase the extent of application of the detent means in mating with any of various main bodies of heat sources and heat sinks of different thickness.

Abstract: A wafer blade for picking up or delivering wafers from or to a wafer cassette or a process tool is described. The wafer blade carries a wafer on a top surface of the blade, and is capable of detecting any undesirable contact with wafers on a bottom surface of the blade. The wafer blade is constructed by a blade body of generally elongated shape that has a top surface and a bottom surface parallel to each other, and a strain sensor such as a piezoelectric thin film sensor mounted on and at least partially cover the bottom surface of the blade body for detecting any contact with the wafer and for sending an alarm signal to a central process controller when such contact or scratch of a wafer has occurred.

Abstract: A securing device for a locking member of a heat dissipating element of a CPU includes several engaging members and a main body. The heat dissipating element is locked between upper removable parts and a base of the locking member. The engaging members each has outwardly sticking engaging parts and inwardly sticking engaging parts; all the engaging parts are bent upwardly to become sloping surfaces; the outward engaging parts have sharp outer ends. The outward engaging parts of each of the engaging members engage one of annular walls around recesses formed on the base to fix the engaging member to the base. The main body is disposed under a main board with connecting poles thereof passing through a respective hole of the main board and central holes of the recesses.

Abstract: A retaining clamp for cooling fins comprises a L-shaped retaining lever, a resilient component, and a detachable lever. The L-shaped retaining lever is an elongated lever provides a fixing component at the bottom thereof. An end of the L-shaped retaining lever extends a vertical bent part with a locking hook, and the other end thereof is a narrow hanging part. The resilient component is disposed beneath the L-shaped retaining lever and fixed by the fixing component. The detachable lever has an end thereof extend a handle, and has the other end thereof provide a hook. A hanging groove is on the detachable lever between two ends thereof for being passed through by the hanging part on the L-shaped retaining lever. No flexibility is necessary for the L-shaped retaining lever so that no heat treatment is required and it does not result in deformation. The resilient component can have a changeable height to accommodate cooling fins indifferent sizes.

Abstract: A securing equipment for a heat dissipator of a CPU includes a middle pressing part, an L-shaped removing part, and a first and a second holed connecting part at two ends of the middle part. The whole body of the equipment is made by punching and pressing a stainless spring steel. The removing part sticks up from a lower end of the second part, and fixedly abuts the second part and has a hole communicating with the hole of same. The. holes of both the first and the second parts engage a respective fixing protrusion of a socket, which a CPU is fitted onto; thus, the middle pressing part presses a heat dissipator disposed on the CPU to fix same in position. The upper portion of the removing part is depressed and pushed towards the middle part to separate the second hole from the corresponding fixing protrusion for removing the securing member from the heat dissipator.

Abstract: A retaining clamp for cooling fins comprises a L-shaped retaining lever, a resilient component, and a detachable lever. The L-shaped retaining lever is an elongated lever provides a fixing component at the bottom thereof. An end of the L-shaped retaining lever extends a vertical bent part with a locking hook, and the other end thereof is a narrow hanging part. The resilient component is disposed beneath the L-shaped retaining lever and fixed by the fixing component. The detachable lever has an end thereof extend a handle, and has the other end thereof provide a hook. A hanging groove is on the detachable lever between two ends thereof for being passed through by the hanging part on the L-shaped retaining lever. No flexibility is necessary for the L-shaped retaining lever so that no heat treatment is required and it does not result in deformation. The resilient component can have a changeable height to accommodate cooling fins indifferent sizes.

Abstract: A thermal reactor has a processing tube with a multiple-walled inner chamber. The geometry of the multiple-walled inner chamber having flow passageways between the walls, directs the flow of heat to the wafers loaded in the wafer boats for maintaining a flat zone temperature profile. The thermal budget, TB, which is a function of time and temperature, at each vertical zone in the processing tube is substantially equal in all zones.

Abstract: A securing equipment for a heat dissipater of a CPU includes a holed main body, and a movable element. The heat dissipater is positioned in a holding member for the bottom to abut the top of the CPU. The main body has rear hooks separably connected to rear holes of the holding member. The movable element includes a control part, and a front part having up-sticking portions pivoted to the upper portion of the control part. The lower portion of the control part is pivoted to the front of the main body so as to be pivotable between a vertical position where the up-sticking portions stand upright in a locking position and a horizontal position where the up-sticking portions is in a sloping unlocking position. The front part of the movable element is further formed with hooks, which engage front holes of the holding member when the up-sticking portions stand upright in the locking position, so as to cause the main body to be pressed against the tops of the radiating fins of the heat dissipater.