Patents by Inventor Keng Hung Lin

Keng Hung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder Bump Bonding In Semiconductor Package Using Solder Balls Having High-Temperature Cores
    Publication number: 20130043573
    Abstract: A semiconductor die is solder bump-bonded to a leadframe or circuit board using solder balls having cores made of a material with a melting temperature higher than the melting temperature of the solder to ensure that in the finished structure the die is parallel to the leadframe or circuit board.
    Type: Application
    Filed: August 15, 2011
    Publication date: February 21, 2013
    Applicants: ADVANCED ANALOGIC TECHNOLOGIES (HONG KONG) LIMITED, ADVANCED ANALOGIC TECHNOLOGIES, INC.
    Inventors: Richard K. Williams, Keng Hung Lin
  • Bump-On-Leadframe Semiconductor Package With Low Thermal Resistance
    Publication number: 20130043572
    Abstract: In a bump-on-leadframe semiconductor package a metal bump formed on a integrated circuit die is used to facilitate the transfer of heat generated in a semiconductor substrate to a metal heat slug and then to an external mounting surface.
    Type: Application
    Filed: August 16, 2011
    Publication date: February 21, 2013
    Applicants: Advanced Analogic Technologies (Hong Kong) Limited, Advanced Analogic Technologies, Inc.
    Inventors: Richard K. Williams, Keng Hung Lin
  • Multi-Die Semiconductor Package With One Or More Embedded Die Pads
    Publication number: 20130043574
    Abstract: To avoid shorts between adjacent die pads in mounting a multi-die semiconductor package to a printed circuit board (PCB), one of the die pads is embedded in the polymer capsule, while the other die pad is exposed at the bottom of the package to provide a thermal escape path to the PCB. This arrangement is particularly useful when one of the dice in a multi-die package generates more heat than another die in the package.
    Type: Application
    Filed: August 16, 2011
    Publication date: February 21, 2013
    Applicants: ADVANCED ANALOGIC TECHNOLOGIES (HONG KONG) LIMITED, ADVANCED ANALOGIC TECHNOLOGIES, INC.
    Inventors: Richard K. Williams, Keng Hung Lin