Abstract: Solid-state imaging apparatuses are disclosed. In one example, an apparatus includes a first substrate and a second substrate. The first substrate includes a pixel array that is arrayed in columns and rows. The second substrate is stacked on the first substrate, and includes first and second analog circuits that overlap with the pixel array in a third direction intersecting the column and row directions. A pixel divider section divides pixels in the array into a first area and a second area. The first and second analog circuits respectively connect to pixels in the first and second areas, and are adjacent to each other with a circuit divider section interposed therebetween, the circuit divider section being located with an overlap with the pixel divider section in the third direction.

Abstract: Solid-state imaging apparatuses are disclosed. In one example, an apparatus includes a first substrate and a second substrate. The first substrate includes a pixel array that is arrayed in columns and rows. The second substrate is stacked on the first substrate, and includes first and second analog circuits that overlap with the pixel array in a third direction intersecting the column and row directions. A pixel divider section divides pixels in the array into a first area and a second area. The first and second analog circuits respectively connect to pixels in the first and second areas, and are adjacent to each other with a circuit divider section interposed therebetween, the circuit divider section being located with an overlap with the pixel divider section in the third direction.