Patents by Inventor Kenichi Hiraki

Kenichi Hiraki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10065265
    Abstract: A joined body is formed by joining end surfaces of two joining members to each other by a friction welding. The joined body includes a hollow portion formed on at least one of the two joining members, the hollow portion being configured to have an opening at the joining face between the two joining members. The joined body also includes an annular groove portion formed on an inner circumferential surface of the hollow portion at a position separated from a joining face in an axial direction.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: September 4, 2018
    Assignee: KYB Corporation
    Inventors: Takahiko Hara, Takayasu Kawakami, Hiroshi Oyama, Yusuke Takahashi, Kenichi Hiraki
  • Publication number: 20160008917
    Abstract: A joined body formed by joining end surfaces of two joining members to each other by a friction welding, the joined body includes a hollow portion formed on at least one of the two joining members, the hollow portion being configured to have an opening at the joining face between the two joining members; and an annular groove portion formed on an inner circumferential surface of the hollow portion at a position separated from a joining face in an axial direction.
    Type: Application
    Filed: March 27, 2014
    Publication date: January 14, 2016
    Applicant: KAYABA INDUSTRY CO., LTD.
    Inventors: Takahiko HARA, Takayasu KAWAKAMI, Hiroshi OYAMA, Yusuke TAKAHASHI, Kenichi HIRAKI
  • Patent number: 7354655
    Abstract: An object of the present invention is to provide an adhesive resin composition which displays excellent adhesive strength on bonding to a barrier material, during initial adhesion, durable adhesion, and even after soak in fuel oil, and which also has excellent moldability. Furthermore, another object of the present is to provide an adhesive resin composition which when recycled, displays good compatible in a regrind layer with polyethylene resins and barrier materials such as saponified products of ethylene-vinyl acetate copolymers or polyamide based resins, and which is consequently capable of suppressing deterioration in the low temperature impact resistance of a multi-layer vessel containing a regrind layer.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: April 8, 2008
    Assignee: Japan Polyolefins Co., Ltd.
    Inventors: Tatsuo Yamaguchi, Shinji Miwa, Fumio Asada, Kenichi Hiraki, Naoki Minorikawa
  • Publication number: 20030175538
    Abstract: An object of the present invention is to provide an adhesive resin composition which displays excellent adhesive strength on bonding to a barrier material, during initial adhesion, durable adhesion, and even after soak in fuel oil, and which also has excellent moldability. Furthermore, another object of the present is to provide an adhesive resin composition which when recycled, displays good compatible in a regrind layer with polyethylene resins and barrier materials such as saponified products of ethylene-vinyl acetate copolymers or polyamide based resins, and which is consequently capable of suppressing deterioration in the low temperature impact resistance of a multi-layer vessel containing a regrind layer.
    Type: Application
    Filed: November 26, 2002
    Publication date: September 18, 2003
    Applicant: JAPAN POLYOLEFINS CO., LTD.
    Inventors: Tatsuo Yamaguchi, Shinji Miwa, Fumio Asada, Kenichi Hiraki, Naoki Minorikawa
  • Patent number: 6492475
    Abstract: The present invention relates to an ethylene-&agr;-olefin copolymer; a composition thereof; a film thereof; a polar group-containing resin material; and productions and use of the ethylene-&agr;-olefin copolymer. The ethylene-&agr;-olefin copolymer of the present invention is characterized in satisfying the following conditions (A) to (E): (A) a density in the range of 0.92 to 0.96 g/cm3; (B) a melt flow rate (MFR) in the range of 0.01 to 200 g/10 min; (C) a molecular weight distribution (Mw/Mn) in the range of 1.5 to 5.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: December 10, 2002
    Assignee: Japan Polyolefins Co., Ltd.
    Inventors: Toshiaki Egashira, Reiji Higuchi, Kazuyuki Sakamoto, Kimiya Miyoshi, Masahiro Wakayama, Tatsuo Yamaguchi, Fumio Asada, Sinji Miwa, Kenichi Hiraki, Masaaki Ikeda, Yoshimi Shimizu
  • Patent number: 6200156
    Abstract: A lead wire connection terminal fitment capable of permitting a plurality of lead wires to be readily press-fitted in a single lead wire press fit groove. The terminal fitment may be in the form of a relay terminal fitment, which includes a metal plate formed with a lead wire press fit groove by machining in which lead wires are press-fitted. A pair of inner surfaces of the metal plate defining the lead wire press fit groove therebetween are formed thereon with a plurality of projections and recesses engaged with an outer periphery of lead wires. The projections biting into the lead wires are so arranged that a space defined between the projections opposite to each other is reduced in width at a position thereof spaced by a distance in a depth direction of the lead wire press fit groove, resulting in being divided into a first space portion increased in width and a second space portion decreased in width.
    Type: Grant
    Filed: November 26, 1999
    Date of Patent: March 13, 2001
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Kenichi Hiraki, Tsuyoshi Ohta, Kazufumi Daimon
  • Patent number: 5721526
    Abstract: A high-voltage variable resistor capable of significantly reducing a circuit board as compared with a prior art. Terminal fitments each are arranged so as to function as a connector for forming electrical connection between a slide element slid on each of variable resistance patterns and a terminal acting as an output section. A contact point between a contact on a contact support of the terminal fitment and a plate-like member of the slide element is positioned apart from a surface of the circuit board. The terminal fitment includes a positioner, which is positioned outside the pattern in a radial direction thereof, so that the positioner intersects the pattern while being spaced therefrom.
    Type: Grant
    Filed: July 18, 1996
    Date of Patent: February 24, 1998
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Kazufumi Daimon, Tsuyoshi Ohta, Kenichi Hiraki
  • Patent number: 5517171
    Abstract: A high-voltage electronic component including a terminal connection structure capable of connecting a lead wire to a terminal fitment without soldering. An insulating substrate having a resistance element for a variable resistor formed on a front surface thereof and a high-voltage resistor are received in a hollow insulating casing. The insulating substrate is mounted on a rear surface thereof with a terminal fitment. The terminal fitment is formed with a press-fit channel in which a lead wire is press-fitted. Upon press fitting of the lead wire, the insulating casing is formed with an opening, through which insulating resin is charged in the insulating casing to form an insulating resin layer in which the terminal fitment and lead wire are embedded.
    Type: Grant
    Filed: March 17, 1994
    Date of Patent: May 14, 1996
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Hirokazu Kotani, Hiromasa Saikatsu, Hitoshi Ishiwari, Kenichi Hiraki
  • Patent number: 5475358
    Abstract: A high-voltage variable resistor unit capable of simply and positively connecting, to a holder of a high-voltage fixed resistor used as a bleeder resistor, a wire-like terminal inserted into an electrically conductive rubber terminal provided on a side of a fly-back transformer. An insulating substrate which is formed thereon with a resistance pattern including a pair of electrodes respectively connected to first and second lead wires is received in a holder of a hollow shape made of insulating resin. The holder includes a holder body formed with an opening through which the insulating substrate is received. A wire-like terminal formed by being a rigid metal wire is heldly fitted in terminal fitting members provided on an outside of the holder. The terminal fitting members includes at least one terminal fitting member provided a wall of the holder facing the opening of the insulating casing and at least one terminal fitting member provided on one of side walls of the holder adjacent to the wall.
    Type: Grant
    Filed: March 17, 1994
    Date of Patent: December 12, 1995
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Hirokaza Kotani, Hiromasa Saikatsu, Hitoshi Ishiwari, Kenichi Hiraki