Abstract: In order to fix a laser diode 12 to an optical base 11, a plurality of threaded pins 15 are at first fixed to the optical base by the use of, for example, an anaerobic adhesive. Then, the laser diode is faced to the optical base in an area between the threaded pins. The laser diode is adjusted in position and angle with respect to the optical base by, for example, 5 axes 3D adjustment. Thereafter, the laser diode is fixed to the threaded pins by the use of solder pieces 16.

Abstract: Disposed in a corner portion formed by a base plate (122) and a vertical wall (124) with being always pressed against the corner portion by a presser bar spring (16), a lens holder (14A) has an adjustment groove (14Aa) extending in a direction perpendicular to the vertical wall. The adjustment groove (14Aa) has a taper shape where a width thereof becomes narrower in proportion to near to the vertical wall and the width thereof becomes wider in proportion to apart from the vertical wall. By moving an adjustment pin (18a) with the adjustment pin inserted in the adjustment groove (14Aa) through a hole (122b) formed in the base plate, the lens holder is moved along an optical axis (OA) of a laser beam, thereby adjusting a position of a beam spread lens (BSL) without a center axis (CA) thereof out of the optical axis.

Abstract: In an optical pickup (1) in which an objective lens (6) is moved in a focusing direction by the use of a focusing coil (7) and first and second magnetic circuits (8,9) coupled to the focusing coil, the first and the second magnetic circuits have a first and a second magnetic flux density, respectively. The objective lens is held by a lens holder (5) which is elastically coupled to a damper base (2) through a suspension member (3,4) to be movable in the focusing direction. The lens holder has a first part and a second part which are spaced from each other. In cooperation with the focusing coil, the first and the second magnetic circuit generate first and second force urging a first and a second part of the lens holder in the focusing direction, respectively.

Abstract: There is disclosed a lens holder capable of firmly holding the objective lens of an optical pickup to the holder without contamination of the effective range of the objective lens due to adhesive. An optical pickup using this lens holder is also disclosed. The lens holder 10 has a seat portion 3 for locking the objective lens 1 of the optical pickup. The seat portion 3 has a top-end surface 3a that is inclined and sinks outward.

Abstract: In a method of fixing a part on a main base, the method comprises the step of mechanically fixing the part on the main base by using solder. The main base preferably may be made of resin while the part preferably may be made of one where the solder enables to adhere to the part. The resin of the main base comprises, for example, a liquid-crystal polymer. The main base may comprise an optical base for use in an optical pickup. The part may comprise a leaf spring or a photodiode (PD) base to which a photodiode is adhered.

Abstract: A disk device for reproducing information and/or for recording information having a casing in which all parts of the disk device are included. The casing includes a number of first bosses and a recording/reproducing unit. The recording/reproducing unit includes at least a disk motor and an optical head. The optical head accesses the disk to reproduce information from the disk and/or record information in the disk. The recording/reproducing unit is arranged to have corners at positions corresponding to the first bosses of the casing. A plurality of vibration absorbing parts are provided and arranged at corners of the recording/reproducing unit. The vibration absorbing parts are also fixed to the first bosses to absorb vibrations of the recording/reproducing unit. The recording/reproducing unit further includes a chassis having mounting holes at the corners thereof. Each vibration absorbing part is respectively fitted to a periphery of one of such mounting holes.

Abstract: A hole portion of a supporting frame is formed so as to permit a positional deviation of a suspension wire deviated from a normal position in at least one of tracking and focusing directions.

Abstract: In an optical pickup comprising an object lens a lens holder for holding the object lens, a damper base for supporting the lens holder through a plurality of suspension wires to allow the lens holder to shift up and down and right and left, and an actuator base including a supporting block for fixedly supporting the damper base by using a screw, the damper base has an oval hole which allows the screw to pass therethrough.

Abstract: In an optical pickup (1) in which an objective lens (22) is held by a lens holder (21) elastically suspended by a damper base (23) through a conductive wire (24), the damper base has a base body (41) and is provided with a first and a second conductive land (42,43) attached directly to a principal insulation surface of the base body. The first conductive land is electrically connected to the conductive wire. The second conductive land is electrically connected to the first conductive land and is for being electrically connected with a flexible circuit member such as an FPC (16).

Abstract: A disk device includes a drive mechanism having at least a disk motor and an optical head, the disk motor rotating a recording disk, and the optical head accessing the disk to reproduce information from the disk and/or record information in the disk. A first printed circuit board controls the disk motor and the optical head of the drive mechanism, the first printed circuit board receiving signals from the optical head and/or sending signals to the optical head to perform the reproducing of information and/or the recording of information. The disk device further comprises a second printed circuit board electrically coupling the drive mechanism to the first printed circuit board, the second printed circuit board including a connector coupled to wire patterns of the signals received and/or sent by the first printed circuit board, and the connector being coupled to the first printed circuit board.

Abstract: In an optical lens, a projection is formed on a peripheral surface of a lens body and protrudes to a radial direction of the lens body. The lens body has an outside diameter smaller than a predetermined inside diameter of a cavity of a lens holder. The projection interferes with a fitting of the lens body in the cavity without resistance. When the lens body is pressed in the cavity, the projection is deformed by the lens holder and follow the lens body fitting in the cavity.

Abstract: A disk device includes a drive mechanism having at least a disk motor and an optical head, the disk motor rotating a recording disk, and the optical head accessing the disk to reproduce information from the disk and/or record information in the disk. A first printed circuit board controls the disk motor and the optical head of the drive mechanism, the first printed circuit board receiving signals from the optical head and/or sending signals to the optical head to perform the reproducing of information and/or the recording of information. The disk device further comprises a second printed circuit board electrically coupling the drive mechanism to the first printed circuit board, the second printed circuit board including a connector coupled to wire patterns of the signals received and/or sent by the first printed circuit board, and the connector being coupled to the first printed circuit board.

Abstract: An optical semiconductor device includes a plurality of light emitting elements, such as a semiconductor laser device, on the same semiconductor substrate, or an optical semiconductor device includes a light emitting element and light receiving element on the same semiconductor substrate, or an optical semiconductor device includes a light emitting element and electrical circuit element on the same semiconductor substrate. A light absorbing layer, which prevents the leakage of light from the light emitting element, even when it is reflected at the electrodes, etc., from reaching the other light emitting element or light receiving element or electrical circuit element, is formed on the semiconductor substrate.