Abstract: An optical waveguide includes a diamond layer including a first surface, a second surface and a diamond layer including a complex defect; a first clad layer in contact with the first surface; a second clad layer in contact with the second surface and including a polarity; and a metal layer in Schottky contact with the second clad layer.

Abstract: There is provided a technique that includes removing a substance adhering to the interior of the process container by performing a cycle a predetermined number of times under a first temperature, the cycle including: (a) supplying one gas of a nitrogen- and hydrogen-containing gas and a fluorine-containing gas into the process container after a substrate is processed; and (b) supplying the other gas different from the one gas of the nitrogen- and hydrogen-containing gas and the fluorine-containing gas into the process container where the one gas remains.

Abstract: There is provided a technique that includes removing a substance adhering to the interior of the process container by performing a cycle a predetermined number of times under a first temperature, the cycle including: (a) supplying one gas of a nitrogen- and hydrogen-containing gas and a fluorine-containing gas into the process container after a substrate is processed; and (b) supplying the other gas different from the one gas of the nitrogen- and hydrogen-containing gas and the fluorine-containing gas into the process container where the one gas remains.

Abstract: There is provided a technique that includes removing a substance adhering to the interior of the process container by performing a cycle a predetermined number of times under a first temperature, the cycle including: (a) supplying one gas of a nitrogen- and hydrogen-containing gas and a fluorine-containing gas into the process container after a substrate is processed; and (b) supplying the other gas different from the one gas of the nitrogen- and hydrogen-containing gas and the fluorine-containing gas into the process container where the one gas remains.

Abstract: A heat exchanging ventilation device includes supply air blower (8); exhaust air blower (9); a supply air blowing passage through which air to be delivered to indoor from outdoor by supply air blower (8) passes; a exhaust air blowing passage through which air to be delivered to the outdoor from the indoor by the exhaust air blower passes; heat exchange element (11) disposed at a position where both the supply air blowing passage and the exhaust air blowing passage pass and exchanging heat between air delivered by supply air blower (8) and air delivered by exhaust air blower (9); supply air damper (12) provided on supply air inlet (2) side of the supply air blowing passage; exhaust air damper (13) provided on exhaust air outlet (3) side of the exhaust air blowing passage; and circulation damper (14) provided at boundary portion (25) which separates the supply air blowing passage and the exhaust air blowing passage from each other.

Abstract: Supply air conduit (7) along which air is sent from outdoors to indoors by the air supply fan (9), exhaust air conduit (8) along which air is sent from indoors to outdoors by the air exhaust fan (10), and heat exchange element (6) provided at a position where supply air conduit (7) and exhaust air conduit (8) intersect, for exchanging heat between indoor air and outdoor air for ventilation are included. In addition, in exhaust air conduit (8), humidity detection unit (14) is provided at a position upstream of heat exchange element (6), and, in supply air conduit (7), temperature detection unit (13) is provided at a position upstream of heat exchange element (6). In addition, controller (11) reduces, when a temperature detected by temperature detection unit (13) and humidity detected by humidity detection unit (14) are predetermined values, speed of an air supply motor and an air exhaust motor so that air flow rates at which moisture neither condenses nor freezes are attained.

Abstract: A heat exchanging ventilation device includes supply air blower (8); exhaust air blower (9); a supply air blowing passage through which air to be delivered to indoor from outdoor by supply air blower (8) passes; a exhaust air blowing passage through which air to be delivered to the outdoor from the indoor by the exhaust air blower passes; heat exchange element (11) disposed at a position where both the supply air blowing passage and the exhaust air blowing passage pass and exchanging heat between air delivered by supply air blower (8) and air delivered by exhaust air blower (9); supply air damper (12) provided on supply air inlet (2) side of the supply air blowing passage; exhaust air damper (13) provided on exhaust air outlet (3) side of the exhaust air blowing passage; and circulation damper (14) provided at boundary portion (25) which separates the supply air blowing passage and the exhaust air blowing passage from each other.

Abstract: Supply air conduit (7) along which air is sent from outdoors to indoors by the air supply fan (9), exhaust air conduit (8) along which air is sent from indoors to outdoors by the air exhaust fan (10), and heat exchange element (6) provided at a position where supply air conduit (7) and exhaust air conduit (8) intersect, for exchanging heat between indoor air and outdoor air for ventilation are included. In addition, in exhaust air conduit (8), humidity detection unit (14) is provided at a position upstream of heat exchange element (6), and, in supply air conduit (7), temperature detection unit (13) is provided at a position upstream of heat exchange element (6). In addition, controller (11) reduces, when a temperature detected by temperature detection unit (13) and humidity detected by humidity detection unit (14) are predetermined values, speed of an air supply motor and an air exhaust motor so that air flow rates at which moisture neither condenses nor freezes are attained.

Abstract: A design apparatus preferentially selects a low coefficient in a range in which design conditions are met from a group of coefficients (coefficient library) indicative of an increase in delay time at the time of voltage drop for combinations of one of a plurality of clock buffers which differ in parameter and one of a plurality of wiring loads, which differ in parameter, connected to the one of the plurality of clock buffers, selects from the plurality of clock buffers and the plurality of wiring loads a clock buffer and a wiring load each having a parameter associated with the selected coefficient, and designs a clock path.

Abstract: At least one side of a sealing member is formed on an outer edge of a first substrate, and a common transfer terminal portion is formed along at least a part of the sealing member formed on the outer edge of the first substrate.

Abstract: Provided is a substrate processing apparatus comprising: a process chamber for processing a substrate; a heater for heating an interior of the process chamber; a holder for sustaining the substrate in the process chamber; and a substrate transfer plate for transferring the substrate to the holder; wherein the holder has a retainer for sustaining the substrate at its outer periphery and a main body for sustaining the retainer, a portion of the retainer extending at least from a back region thereof with respect to an inserting direction of the substrate transfer plate to a region adjacent thereto and to be sustained by the main body and lying outer than the substrate upon putting the substrate on the retainer being made thicker than other portions of the retainer.

Abstract: At least one side of a sealing member is formed on an outer edge of a first substrate, and a common transfer terminal portion is formed along at least a part of the sealing member formed on the outer edge of the first substrate.

Abstract: A thermal treatment apparatus, a method for manufacturing a semiconductor device, and a method for manufacturing a substrate, wherein the occurrence of slip dislocation in a substrate during heat treatment is reduced, and a high-quality semiconductor device can be manufactured, are intended to be provided. A substrate support is formed from a main body portion and a supporting portion. In the main body portion, a plurality of placing portions extend parallel, and supporting portions are provided on the placing portions. A substrate is placed on the supporting portion. The supporting portion has a smaller area than an area of a flat face of the substrate, and is formed from a silicon plate having a thickness larger than thickness of the substrate, so that deformation during heat treatment is reduced. The supporting portion is made of silicon, and a layer coated with silicon carbide (SiC) is formed on a substrate-placing face of the supporting portion.

Abstract: A thermal treatment apparatus, a method for manufacturing a semiconductor device, and a method for manufacturing a substrate, wherein the occurrence of slip dislocation in a substrate during heat treatment is reduced, and a high-quality semiconductor device can be manufactured, are intended to be provided. A substrate support 30 is formed from a main body portion 56 and a supporting portion 58. In the main body portion 56, a plurality of placing portions 66 extend parallel, and supporting portions 58 are provided on the placing portions 66. A substrate 68 is placed on the supporting portion 58. The supporting portion 58 has a smaller area than an area of a flat face of the substrate, and is formed from a silicon plate having a thickness larger than thickness of the substrate, so that deformation during heat treatment is reduced. The supporting portion 58 is made of silicon, and a layer coated with silicon carbide (SiC) is formed on a substrate-placing face of the supporting portion 58.

Abstract: Provided is a substrate processing apparatus comprising: a process chamber for processing a substrate; a heater for heating an interior of the process chamber; a holder for sustaining the substrate in the process chamber; and a substrate transfer plate for transferring the substrate to the holder; wherein the holder has a retainer for sustaining the substrate at its outer periphery and a main body for sustaining the retainer, a portion of the retainer extending at least from a back region thereof with respect to an inserting direction of the substrate transfer plate to a region adjacent thereto and to be sustained by the main body and lying outer than the substrate upon putting the substrate on the retainer being made thicker than other portions of the retainer.

Abstract: A thermal treatment apparatus, a method for manufacturing a semiconductor device, and a method for manufacturing a substrate, wherein the occurrence of slip dislocation in a substrate during heat treatment is reduced, and a high-quality semiconductor device can be manufactured, are intended to be provided. A substrate support 30 is formed from a main body portion 56 and a supporting portion 58. In the main body portion 56, a plurality of placing portions 66 extend parallel, and supporting portions 58 are provided on the placing portions 66. A substrate 68 is placed on the supporting portion 58. The supporting portion 58 has a smaller area than an area of a flat face of the substrate, and is formed from a silicon plate having a thickness larger than thickness of the substrate, so that deformation during heat treatment is reduced. The supporting portion 58 is made of silicon, and a layer coated with silicon carbide (SiC) is formed on a substrate-placing face of the supporting portion 58.

Abstract: A thermal treatment apparatus, a method for manufacturing a semiconductor device, and a method for manufacturing a substrate, wherein the occurrence of slip dislocation in a substrate during heat treatment is reduced, and a high-quality semiconductor device can be manufactured, are intended to be provided. A substrate support 30 is formed from a main body portion 56 and a supporting portion 58. In the main body portion 56, a plurality of placing portions 66 extend parallel, and supporting portions 58 are provided on the placing portions 66. A substrate 68 is placed on the supporting portion 58. The supporting portion 58 has a smaller area than an area of a flat face of the substrate, and is formed from a silicon plate having a thickness larger than thickness of the substrate, so that deformation during heat treatment is reduced. The supporting portion 58 is made of silicon, and a layer coated with silicon carbide (SiC) is formed on a substrate-placing face of the supporting portion 58.

Abstract: In manufacturing a separator for use in a fuel cell, first, a core (31, 94) is interposed between two preforms (17, 90, 101) and a with-core separator (41, 95, 107) is formed. After this, the core is melted by heating and discharged to form multiple cooling water passages (54). Because consequently there is no need to bring separators together to form the cooling water passages, a seal becomes unnecessary. Also, since there is no need to bring separators together the electrical contact resistance also falls.

Abstract: A method for manufacturing a fuel cell separator (18) for sandwiching from both sides via diffusion layers (15, 16) an anode (13) and a cathode (14) disposed on an electrolyte membrane (12). This manufacturing method includes mixing a thermoplastic resin (46) and a conductive material (45) to make a mixture (50), forming a separator starting material (68) with the mixture, and irradiating a contact face (20b, 30b) of this separator starting material with an electron beam (72), hardening the contact face of the separator. Even when reaction heat is produced in the fuel cell (10), elasticity of the separator contact face is ensured.

Abstract: Fuel cell separators (18) sandwich an anode (13) and a cathode (14) which are installed along both sides of an electrolyte film (12) and diffusion layers (16, 16). The separators (18) are made of a mixture material containing a thermoplastic resin selected from ethylene-vinyl acetate copolymers and ethylene-ethyl acrylate copolymers and carbon particles selected from at least one of Ketjen black, graphite and acetylene black. Since the thermoplastic resin is excellent in especially flexibility, the contact surfaces of the separators (18) in contact with the diffusion layers (15, 16) can be a portion excellent in sealability by adding the thermo-plastic resin excellent in sealability to the separators (18).