Abstract: A semiconductor integrated circuit is provided. In the semiconductor integrated circuit, each of ESD protection circuitries is disposed between two of TSV bumps arrayed in a matrix, the two being arranged adjacent to each other. First main power lines are disposed to overlap P-channel ESD protection elements. Second main power lines are disposed to overlap N-channel ESD protection elements. The first and second main power lines are arranged orthogonally to each other.

Abstract: An object of the present invention is to provide an adsorbent suitable as an adsorbent for a canister which is capable of reducing an amount of evaporated fuel gas released into the atmosphere even where a motor vehicle is allowed to park for a prolonged period of time, a process for producing the adsorbent as well as a canister using the adsorbent and a method for using the canister. The above object can be accomplished by an adsorbent in which an integrated volume of pores having an average diameter of 3,000 to 100,000 nm as measured with a mercury porosimeter is 6.5 mL/dl or more and an equilibrium adsorption as measured in an n-butane volume concentration of 2,000 ppm is 0.16 g/dL or more, a process for producing the adsorbent, as well as a canister and a method for using the canister.

Abstract: A semiconductor integrated circuit includes a plurality of bonding pads formed along an edge of a semiconductor substrate; a plurality of I/O cells arranged along the edge under the plurality of bonding pads; an upper layer wire mesh including a plurality of upper layer wirings; and a core region formed on the semiconductor substrate. In the semiconductor integrated circuit, the core region has an area larger than an area occupied by the upper layer wire mesh in a plane parallel to a surface of the semiconductor substrate.

Abstract: An electronic apparatus comprises a housing that contains a heat-generating component, a heat radiating component and a fan that is adapted to apply air to the heat radiating component and including an inlet port and an outlet port. The electronic apparatus further comprises a support member situated within the housing and arranged so that that the outlet port of the fan faces the heat radiating component. Being coupled to the fan and the heat radiating component, the support member comprises an opening portion to direct air to the fan, where the opening portion is aligned with the inlet port of the fan.

Abstract: An object of the present invention is to provide an adsorbent suitable as an adsorbent for a canister which is capable of reducing an amount of evaporated fuel gas released into the atmosphere even where a motor vehicle is allowed to park for a prolonged period of time, a process for producing the adsorbent as well as a canister using the adsorbent and a method for using the canister. The above object can be accomplished by an adsorbent in which an integrated volume of pores having an average diameter of 3,000 to 100,000 nm as measured with a mercury porosimeter is 6.5 mL/dl or more and an equilibrium adsorption as measured in an n-butane volume concentration of 2,000 ppm is 0.16 g/dL or more, a process for producing the adsorbent, as well as a canister and a method for using the canister.

Abstract: An electronic apparatus comprises a housing that contains a heat-generating component, a heat radiating component and a fan that is adapted to apply air to the heat radiating component and including an inlet port and an outlet port. The electronic apparatus further comprises a support member situated within the housing and arranged so that that the outlet port of the fan faces the heat radiating component. Being coupled to the fan and the heat radiating component, the support member comprises an opening portion to direct air to the fan, where the opening portion is aligned with the inlet port of the fan.

Abstract: According to one embodiment, a cooling device includes a heat diffusion plate, a heat receiving portion, a heat sink and a heat pipe. The heat receiving portion is provided on the heat diffusion plate and thermally connected to an object to be cooled. The heat sink is provided on the heat diffusion plate, and it releases the heat of the heat receiving portion to outside. The heat pipe has a first end portion to be connected to the heat receiving portion and a second end portion located on an opposite side to the first end portion and to be connected to the heat sink.

Abstract: A cooling device comprises a heat radiating portion, heat-transferring component, such as a heat pipe, a fan and a support member. The heat radiating portion radiates the heat generated by the heat-generating component. The heat-transferring component transfers the heat generated by the heat-generating component, from the heat receiving portion to the heat radiating portion. The fan applies cooling air to the heat radiating portion. The fan is coupled to the heat radiating portion. The support member includes a first part to hold the heat radiating portion, and a second part to hold the fan.

Abstract: A generating unit generates an apparatus reference frame phase that becomes a reference in a data multiplexing/demultiplexing apparatus, based on a reception frame phase of the data input to a predetermined reception buffer and a predetermined delay amount. A multiplexing/demultiplexing unit reads data from the reception buffer based on the apparatus reference frame phase generated by the generating unit, and multiplexes or demultiplexes the data.

Abstract: To provide an activated carbon sheet molding that can reduce a leak amount of fuel vapor, realize small ventilation resistance, and is excellent in moldability and strength, and an element for a fuel evaporative emission preventing device for preventing evaporative emission of fuel vapor from a fuel tank system and an intake system by using the activated carbon sheet molding. The object can be achieved by an activated carbon sheet molding made of activated carbon that satisfies b/a=0.3 through 0.55 provided that a 100%-concentration n-butane adsorbing amount per 100 parts by weight of activated carbon at 40° C. is defined as a parts by weight, and a 1%-concentration n-butane adsorbing amount is defined as b parts by weight.

Abstract: In order to form a semiconductor integrated circuit capable of effectively using a chip area, there is provided a semiconductor integrated circuit (1) including: a plurality of bonding pads (5, 6, 7) formed along an edge of a semiconductor substrate (2); a plurality of I/O cells (3) arranged along the edge under the plurality of bonding pads (5, 6, 7); an upper layer wire mesh (24) including a plurality of upper layer wirings (13); and a core region (4) formed on the semiconductor substrate (2). In the semiconductor integrated circuit (1), the core region (4) has an area larger than an area occupied by the upper layer wire mesh (24) in a plane parallel to a surface of the semiconductor substrate (2).

Abstract: A data transmitting apparatus includes an actually-used-system package that is connected to outside via a plurality of ports and is actually transmitting data, a waiting-system package that is connected to outside via a plurality of ports and is waiting to substitute the actually-used-system package to transmit data when a failure occurs in the actually-used-system package, a switching requesting unit that switches, when a failure occurs in a port of the actually-used-system package, the port of the actually-used-system package to another port and issues to the waiting-system package a switching request indicating that switching is made to a port corresponding to a switching-target port, and a port switching unit that switches the port of the waiting-system package according to the switching request when the waiting-system package receives the switching request issued from the switching requesting unit.

Abstract: A wireless repeater on a communication line has a structure that includes a plurality of wireless communication media, and a band control unit that changes the first bandwidth of the communications line according to increase and decrease in the number of wireless communication media by an operation dividing the first bandwidth of the communications line into a plurality of second bandwidths and an operation multiplexing a plurality of second bandwidths adjusting to the first bandwidth, responding to the number of the wireless communication media.

Abstract: A cooling device comprises a heat radiating portion, heat-transferring component, such as a heat pipe, a fan and a support member. The heat radiating portion radiates the heat generated by the heat-generating component. The heat-transferring component transfers the heat generated by the heat-generating component, from the heat receiving portion to the heat radiating portion. The fan applies cooling air to the heat radiating portion. The fan is coupled to the heat radiating portion. The support member includes a first part to hold the heat radiating portion, and a second part to hold the fan.

Abstract: High purity phosphoric acid having an Sb content of 200 ppb or less and a sulfide ion content of 200 ppb or less as impurity contents on a 85 weight percent H3PO4 basis. The high purity phosphoric acid is useful as an etching solution for semiconductor devices having a silicon nitride film, an etching solution for liquid crystal display panels having an alumina film, a metallic aluminum etching solution, an alumina etching solution for ceramics, a raw material of phosphate glass for optical fiber, a food additive, and so forth. A metallic material having low capability of forming a lithium compound penetrates through the whole thickness of the active material layer 5.

Abstract: A cooling device having a heat receiving portion, a heat radiating portion, a heat pipe, and a fan. The heat receiving portion is held on a wiring board and thermally connected to a heat-generating component. The heat radiating portion radiates the heat generated by the heat-generating component, at a position remote from the heat receiving portion. The heat pipe transfers the heat generated by the heat-generating component, from the heat receiving portion to the heat radiating portion. The heat pipe couples the heat receiving portion and the heat radiating portion. The fan applies cooling air to the heat radiating portion. The fan is coupled to the heat radiating portion.

Abstract: According to one embodiment, a cooling device includes a heat diffusion plate, a heat receiving portion, a heat sink and a heat pipe. The heat receiving portion is provided on the heat diffusion plate and thermally connected to an object to be cooled. The heat sink is provided on the heat diffusion plate, and it releases the heat of the heat receiving portion to outside. The heat pipe has a first end portion to be connected to the heat receiving portion and a second end portion located on an opposite side to the first end portion and to be connected to the heat sink.

Abstract: A generating unit generates an apparatus reference frame phase that becomes a reference in a data multiplexing/demultiplexing apparatus, based on a reception frame phase of the data input to a predetermined reception buffer and a predetermined delay amount. A multiplexing/demultiplexing unit reads data from the reception buffer based on the apparatus reference frame phase generated by the generating unit, and multiplexes or demultiplexes the data.

Abstract: A data transmission apparatus, which transmits data from a first communication line to a second communication line and performs a traffic priority control on the data, includes: a monitoring unit that monitors a condition of the second communication line; a storage unit that stores a plurality of tables each of which includes information for the traffic priority control; and a control unit that performs the traffic priority control using a table that is selected from among the tables based on the condition.

Abstract: A heat dissipating device includes a heat receiving unit having a heat receiving surface thermally connected to a heat generating object and a heat dissipating surface in an opposite to the receiving surface, a heat transferring unit mounted on the dissipating surface, transferring the heat received in the heat receiving surface, and diffusing the transferred heat to the dissipating surface, and a heat dissipating unit mounted on the dissipating surface and dissipating the diffused heat. An electronic apparatus includes a circuit board having an electronic part generating heat, a main body installing the circuit board, and the heat dissipating device described above.