Abstract: Disclosed is a current-injection organic semiconductor laser diode comprising a pair of electrodes, an optical resonator structure, and one or more organic layers including a light amplification layer composed of an organic semiconductor, which has a sufficient overlap between the distribution of exciton density and the electric field intensity distribution of the resonant optical mode during current injection to emit laser light.

Abstract: A common mode noise filter includes a laminated body including first to fourth insulating layers stacked on one another, first to fourth coil conductors spirally extending and disposed on upper surfaces of the first to fourth insulating layers, respectively, a first via-electrode connecting the first coil conductor to the second coil conductor, a second via-electrode connecting the third coil conductor to the fourth coil conductor, first and second connection parts connecting the first via-electrode to first and second inner ends of the first and second coil conductors, respectively, and third and fourth connection parts connecting the second via-electrode to third and fourth inner ends of the third and fourth coil conductors, respectively. The first connection part overlaps the second connection part when viewed from above. The third connection part overlaps the fourth connection part when viewed from above. The common mode noise filter is operable in high frequencies.

Abstract: A chip resistor includes an insulating substrate made of alumina, a pair of electrodes disposed on an upper surface of the insulating substrate, a glass glaze layer made of glass disposed on the upper surface of the insulating substrate, and a resistive element disposed on the upper surface of the glass glaze layer. The resistive element is disposed between the pair of electrodes. The softening point of the glass of the glass glaze layer ranges from 580° C. to 760° C. This chip resistor prevents the resistive element from being peeled off.

Abstract: A common mode noise filter includes plural non-magnetic layers stacked in a laminating direction, and first, second, and third coil conductors constituting first, second, and third coils which are formed on the non-magnetic layers and are independent from one another. The first and third coil conductors deviate from the second coil conductor in a direction perpendicular to the laminating direction.

Abstract: A chip resistor includes an insulating substrate made of alumina, a pair of electrodes disposed on an upper surface of the insulating substrate, a glass glaze layer made of glass disposed on the upper surface of the insulating substrate, and a resistive element disposed on the upper surface of the glass glaze layer. The resistive element is disposed between the pair of electrodes. The softening point of the glass of the glass glaze layer ranges from 580° C. to 760° C. This chip resistor prevents the resistive element from being peeled off.

Abstract: A common mode noise filter includes a laminated body including first to fourth insulating layers stacked on one another, first to fourth coil conductors spirally extending and disposed on upper surfaces of the first to fourth insulating layers, respectively, a first via-electrode connecting the first coil conductor to the second coil conductor, a second via-electrode connecting the third coil conductor to the fourth coil conductor, first and second connection parts connecting the first via-electrode to first and second inner ends of the first and second coil conductors, respectively, and third and fourth connection parts connecting the second via-electrode to third and fourth inner ends of the third and fourth coil conductors, respectively. The first connection part overlaps the second connection part when viewed from above. The third connection part overlaps the fourth connection part when viewed from above. The common mode noise filter is operable in high frequencies.

Abstract: A common mode noise filter includes first to fourth insulator layers stacked in a stacking direction and first to third coils provided on the first to fourth insulator layers independently of one another. The first coil includes a first coil conductor provided on the first insulator layer and a second coil conductor provided on the fourth insulator layer and connected to the first coil conductor. The second coil is provided on the second insulator layer. The third coil is provided on the third insulator layer. The first coil conductor overlaps the second coil viewing from above. At least a part of the second coil overlaps at least a part of the third coil viewing from above. The second coil conductor overlaps the third coil viewing from above.

Abstract: In a common mode noise filter, first coil (12) includes first coil conductor (16) and second coil conductor (17) with spiral shapes. Second coil (13) includes third coil conductor (18) and fourth coil conductor (19) with spiral shapes. First coil conductor (16), third coil conductor (18), second coil conductor (17), and fourth coil conductor (19) are placed in this order from above. First metal layer (14) configured to be connected to a ground is provided above first coil conductor (16).

Abstract: A common mode noise filter includes first to fourth insulator layers stacked in a stacking direction and first to third coils provided on the first to fourth insulator layers independently of one another. The first coil includes a first coil conductor provided on the first insulator layer and a second coil conductor provided on the fourth insulator layer and connected to the first coil conductor. The second coil is provided on the second insulator layer. The third coil is provided on the third insulator layer. The first coil conductor overlaps the second coil viewing from above. At least a part of the second coil overlaps at least a part of the third coil viewing from above. The second coil conductor overlaps the third coil viewing from above.

Abstract: In a common mode noise filter, first coil (12) includes first coil conductor (16) and second coil conductor (17) with spiral shapes. Second coil (13) includes third coil conductor (18) and fourth coil conductor (19) with spiral shapes. First coil conductor (16), third coil conductor (18), second coil conductor (17), and fourth coil conductor (19) are placed in this order from above. First metal layer (14) configured to be connected to a ground is provided above first coil conductor (16).

Abstract: A common mode noise filter includes plural non-magnetic layers stacked in a laminating direction, and first, second, and third coil conductors constituting first, second, and third coils which are formed on the non-magnetic layers and are independent from one another. The first and third coil conductors deviate from the second coil conductor in a direction perpendicular to the laminating direction.

Abstract: An elastic wave device includes a piezoelectric substrate, a comb-shaped electrode above an upper surface of the piezoelectric substrate, a wiring connected to the comb-shaped electrode, an element cover above the upper surface of the piezoelectric substrate for covering the comb-shaped electrode across a space, a first electrode above an upper surface of the element cover, a sealing resin above the upper surface of the piezoelectric substrate for covering the element cover and the first electrode, a terminal electrode above an upper surface of the sealing resin, and a second electrode passing through the sealing resin for electrically connecting the first electrode with the terminal electrode. The first and second electrodes are made of films produced by electro-plating. The diameter of plating particles of the first electrode may be larger than that of plating particles of the second electrode.

Abstract: An acoustic wave device includes a piezoelectric substrate, comb-shaped electrodes, wires, a sealing body, terminal electrodes, and connection electrodes. The comb-shaped electrodes are disposed on the piezoelectric substrate and are connected to the wires. The sealing body is disposed on the piezoelectric substrate in such a manner that the comb-shaped electrodes are sealed between the piezoelectric substrate and the sealing body. The terminal electrodes are disposed on the sealing body. The connection electrodes penetrate the sealing body so as to electrically connect the wires and the terminal electrodes, respectively. A first linear expansion coefficient in a first temperature range below a first glass transition temperature of the sealing body is larger than a second linear expansion coefficient in a second temperature range above the first glass transition temperature.

Abstract: An acoustic wave device includes a piezoelectric substrate, comb-shaped electrodes, wires, a sealing body, terminal electrodes, and connection electrodes. The comb-shaped electrodes are disposed on the piezoelectric substrate and are connected to the wires. The sealing body is disposed on the piezoelectric substrate in such a manner that the comb-shaped electrodes are sealed between the piezoelectric substrate and the sealing body. The terminal electrodes are disposed on the sealing body. The connection electrodes penetrate the sealing body so as to electrically connect the wires and the terminal electrodes, respectively. A first linear expansion coefficient in a first temperature range below a first glass transition temperature of the sealing body is larger than a second linear expansion coefficient in a second temperature range above the first glass transition temperature.

Abstract: An elastic wave device includes a piezoelectric substrate, a comb-shaped electrode above an upper surface of the piezoelectric substrate, a wiring connected to the comb-shaped electrode, an element cover above the upper surface of the piezoelectric substrate for covering the comb-shaped electrode across a space, a first electrode above an upper surface of the element cover, a sealing resin above the upper surface of the piezoelectric substrate for covering the element cover and the first electrode, a terminal electrode above an upper surface of the sealing resin, and a second electrode passing through the sealing resin for electrically connecting the first electrode with the terminal electrode. The first and second electrodes are made of films produced by electro-plating. The diameter of plating particles of the first electrode may be larger than that of plating particles of the second electrode.

Abstract: A proximity detection device has transmitting and receiving electrodes and a multiline driving unit that simultaneously applies periodic alternating voltages to at least two of the transmitting electrodes. A measurement unit measures currents or amounts of accumulated charge from the receiving electrodes in synchronization with the simultaneous application of periodic alternating voltages to the at least two transmitting electrodes by the multiline driving unit. A linear computing unit performs linear computation of measurement results from a measurement unit in response to electrostatic capacitances of respective intersections between the transmitting and receiving electrodes. The linear computing unit has a memory unit that stores an output of the linear computation for readout at plural times. A proximity computing unit performs a computation to determine an approach and/or a position of an object relative to a detection area based on the output from the linear computing unit stored in the memory unit.

Abstract: A proximity detector detects the approach of an object based on a stray capacitance. A differential electrode has an apparent stray capacitance that varies in response to an approaching object. An individual capacitance detector detects an individual stray capacitance of the differential electrode based on a stray capacitance of the differential electrode obtained by repeatedly charging and discharging the differential electrode in opposite phases and based on a stray capacitance of the differential electrode obtained by repeatedly charging and discharging the differential electrode in the same phase. A proximity calculator detects the approach of the object based on the detected individual stray capacitance.

Abstract: Provided are a capacitive coordinate input device and a capacitive coordinate input method for detecting at high speed the position of an object, such as a human finger or a pen, by detecting a change in capacitance at each intersection of a plurality of electrodes arranged corresponding to two-dimensional coordinates. Tri-state driving is performed such that, immediately after a voltage of a transmitting electrode is changed, impedance of other transmitting electrodes having no voltage change is temporarily increased.

Abstract: Provided is a structure in which an input image is normalized by a normalization value in a case where an amount of saturation is within an allowable range so as to adjust an intensity of a backlight according to the normalization value. Allowing slight saturation of an image thereby, effectively reduce the power consumption in the backlight.

Abstract: An electrostatic detection device includes a detection panel 1 having one or a plurality of detection electrodes, charge/discharge means 2 for repeatedly performing charge/discharge, characteristic extraction means 3 for repeatedly extracting characteristics, accumulation analog/digital conversion means 4 for accumulating the characteristics and performing analog/digital conversion, post-processing means 5 for calculating approach or a position of the object, control means 7 for managing an overall state and sequence, gain changing means 52 for changing a gain of the first and last characteristic extraction of the charge/discharge, and abnormality detection means 10 for detection whether or not there is abnormality. Accordingly, it is possible to attenuate or remove an influence of noises with a simple configuration.