Abstract: An autofocus apparatus includes a control unit configured to set an offset amount based on information relating to a shape of a first high-frequency component of an image signal obtained by photoelectrically converting an object image formed by an image pickup optical system that includes a focus lens while driving the focus lens, and to move the focus lens to a position that shifts from a first position of the focus position by a sum of the offset amount and a predetermined amount that is determined by characteristic information of the image pickup optical system.

Abstract: A computing unit computes a computed value for input data. A comparing unit compares the computed value of the computing unit with a computed value of another node which is included in an input/output set. An output unit outputs the computed value as output data of a node itself when the result of the comparison by the comparing unit shows that the computed value matches either one of computed values. When the computed value does not match any one of the computed values of other nodes, a transferring unit adds the computed value of the node itself to the input/output set, and transfers the input/output set to another node.

Abstract: Provided is an imaging apparatus that acquires an object distance to an object and focus position information for each of a plurality of divided areas of an imaging screen corresponding to an imaging area. The imaging apparatus acquires data of the amount of field curvature corresponding to the imaging distance and removes a field curvature component from the object distance and the defocus amount so as to determine a plurality of objects which is equi-spaced from the imaging apparatus and faces the imaging apparatus. When the plurality of objects is equi-spaced from the imaging apparatus and is arrayed so as to face the imaging apparatus, a focused position at which an error in the defocus amount on the entire imaging screen is minimized is calculated. If otherwise, a focusing reference area is selected and then a preferential focusing operation is performed for an object corresponding to the area.

Abstract: Disclosed is a method for producing a glass substrate, which involves a first polishing step and a second polishing step both for polishing the surface of the glass substrate with a polishing solution containing a polishing agent. The method is characterized by additionally involving a heating step for heating the glass substrate, wherein the heating step is carried out after the first polishing step and before the second polishing step.

Abstract: A magnetic shielding material which can decrease the thickness by having excellent conductivity even at low temperatures of, for example, 77 K or lower, in a strong magnetic field of a magnetic flux density of 1 T or more is provide. A magnetic shielding material to be used at low temperatures of 77 K or lower in the magnetic field of a magnetic flux density of 1 T or more, comprises aluminum having a purity of 99.999% by mass or more.

Abstract: In an image sensor in which each microlens of a microlens array is disposed at a position corresponding to each pixel on a side to which light flux is incident, a layer formed of a member different from a member constituting the microlens array is disposed on the side of the microlens array to which light flux is incident, and a surface of the layer formed of the different member has a phase structure optically-opposite to that of the microlens array.

Abstract: A semiconductor device includes a circuit substrate, a first semiconductor chip disposed on the circuit substrate, a plurality of first spacers disposed on the first semiconductor chip, a second semiconductor chip which includes a first adhesive agent layer on a lower face thereof and is disposed on upper portions of the plurality of spacers, a wire which connects the circuit substrate to the first semiconductor chip, and a first sealing material which seals a gap between the first semiconductor chip and the first adhesive agent layer, wherein each height of the plurality of the first spacers is greater than height of the wire relative to an upper face of the first semiconductor chip.

Abstract: Provided is an imaging apparatus that acquires an object distance to an object and focus position information for each of a plurality of divided areas of an imaging screen corresponding to an imaging area. The imaging apparatus acquires data of the amount of field curvature corresponding to the imaging distance and removes a field curvature component from the object distance and the defocus amount so as to determine a plurality of objects which is equi-spaced from the imaging apparatus and faces the imaging apparatus. When the plurality of objects is equi-spaced from the imaging apparatus and is arrayed so as to face the imaging apparatus, a focused position at which an error in the defocus amount on the entire imaging screen is minimized is calculated. If otherwise, a focusing reference area is selected and then a preferential focusing operation is performed for an object corresponding to the area.

Abstract: A wireless power supply system according to an embodiment includes a power transmitting unit that transmits electric power. The wireless power supply system includes a power receiving unit that receives the electric power output from the power transmitting unit. Even if one of a plurality of power transmitting coils stops transmitting electric power, the wireless power supply system can increase the electric power transmitted by the other power transmitting coils.

Abstract: Seamless pipes are produced by using billets for which the length L of a parent billet, the lengths l of child billets and the number nB of the obtainable child billets are determined on the basis of predetermined tolerances and the conditions of a billet-heating furnace and billet-rolling facilities. In this way, energy saving in the production of seamless pipes can be realized and the productivity in the production of seamless pipes can also be improved.

Abstract: A semiconductor device includes a circuit substrate, a first semiconductor chip disposed on the circuit substrate, a plurality of first spacers disposed on the first semiconductor chip, a second semiconductor chip which includes a first adhesive agent layer on a lower face thereof and is disposed on upper portions of the plurality of spacers, a wire which connects the circuit substrate to the first semiconductor chip, and a first sealing material which seals a gap between the first semiconductor chip and the first adhesive agent layer, wherein each height of the plurality of the first spacers is greater than height of the wire relative to an upper face of the first semiconductor chip.

Abstract: A semiconductor device includes a circuit substrate, a first semiconductor chip disposed on the circuit substrate, a plurality of first spacers disposed on the first semiconductor chip, a second semiconductor chip which includes a first adhesive agent layer on a lower face thereof and is disposed on upper portions of the plurality of spacers, a wire which connects the circuit substrate to the first semiconductor chip, and a first sealing material which seals a gap between the first semiconductor chip and the first adhesive agent layer, wherein each height of the plurality of the first spacers is greater than height of the wire relative to an upper face of the first semiconductor chip.

Abstract: According to an embodiment, a power transmitting device includes a power supply unit, a power transmitting coil, a first switch, a piezoelectric element, and a first switch controller. The power supply unit is configured to generate a transmission power by using power supplied to a power input terminal. Once the first switch is turned on, the first switch electrically connects an external power supply and the power input terminal until the first switch is turned off next time. The piezoelectric element is disposed at a position at which a weight of a placed power receiving device can be detected. The piezoelectric element is configured to generate a detection power according to the weight of the placed power receiving device. The first switch controller is configured to generate a starting power by the detection power and switches the first switch to on by using the starting power.

Abstract: According to an embodiment, a power transmitting device includes a power supply unit, a power transmitting coil, a first switch, a piezoelectric element, and a first switch controller. The power supply unit is configured to generate a transmission power by using power supplied to a power input terminal. Once the first switch is turned on, the first switch electrically connects an external power supply and the power input terminal until the first switch is turned off next time. The piezoelectric element is disposed at a position at which a weight of a placed power receiving device can be detected. The piezoelectric element is configured to generate a detection power according to the weight of the placed power receiving device. The first switch controller is configured to generate a starting power by the detection power and switches the first switch to on by using the starting power.

Abstract: An image processing apparatus includes an acquisition unit configured to divide an image into a plurality of areas and to acquire an object distance and a defocus amount in each area, and a processing unit configured to obtain, for each area, a correction amount corresponding to the object distance and the defocus amount and to perform correction processing for correcting lateral chromatic aberration based on the correction amount.

Abstract: A computing unit computes a computed value for input data. A comparing unit compares the computed value of the computing unit with a computed value of another node which is included in an input/output set. An output unit outputs the computed value as output data of a node itself when the result of the comparison by the comparing unit shows that the computed value matches either one of computed values. When the computed value does not match any one of the computed values of other nodes, a transferring unit adds the computed value of the node itself to the input/output set, and transfers the input/output set to another node.

Abstract: In an image sensor in which each microlens of a microlens array is disposed at a position corresponding to each pixel on a side to which light flux is incident, a layer formed of a member different from a member constituting the microlens array is disposed on the side of the microlens array to which light flux is incident, and a surface of the layer formed of the different member has a phase structure optically -opposite to that of the microlens array.

Abstract: A semi-organic insulation coating includes an inorganic component and an organic resin, a Zr compound and an Si compound contains a plate-like silica as an inorganic component and are included in a ratio in a dry coating of 20 to 70 mass % of Zr compound (converted to ZrO2) and 10 to 50 mass % of Si compound containing plate-like silica (converted to SiO2), and the remainder is substantially an organic resin, whereby a magnetic steel sheet with a semi-organic insulation coating has no deterioration of corrosion resistance and water resistance without containing a chromium compound and being excellent in powdering resistance, scratch resistance, sticking resistance, TIG weldability, punchability and coating appearance.

Abstract: A semiconductor device includes a circuit substrate, a first semiconductor chip disposed on the circuit substrate, a plurality of first spacers disposed on the first semiconductor chip, a second semiconductor chip which includes a first adhesive agent layer on a lower face thereof and is disposed on upper portions of the plurality of spacers, a wire which connects the circuit substrate to the first semiconductor chip, and a first sealing material which seals a gap between the first semiconductor chip and the first adhesive agent layer, wherein each height of the plurality of the first spacers is greater than height of the wire relative to an upper face of the first semiconductor chip.

Abstract: The invention provides a robot including a connection member relatively displaceably connected, and configured to control the displacement of the connection member based on a reference posture that can be adjusted, the robot including: a light emitting unit to emit a laser beam in a predetermined direction; a light receiving unit to receive the laser beam when the connection member is located in a detection posture that is away, by a preset displacement amount, from a predetermined zero posture; and a zeroing unit to relatively displace the connection member so as to make the light receiving unit receive the laser beam, and then to adjust the reference posture to the zero posture based on the posture of the connection member when the laser beam is received as well as on a relationship between the zero posture and the detection posture.