Abstract: A signal transmission insulating device includes: a first coil; a second coil opposing the first coil to form a transformer together with the first coil; a first insulating film provided between the opposing first coil and second coil and made of a first dielectric material; a second insulating film surrounding the first coil and made of a second dielectric material having a lower resistivity or a higher permittivity than the first dielectric material; and a third insulating film surrounding the second coil and made of a third dielectric material having a lower resistivity or a higher permittivity than the first dielectric material.

Abstract: A noise filter (100, 200, 300) provided with: a coil (1a, 1b) having a winding pattern configured by stacking flat plate-shaped conductors (50); a magnetic core (2) around which the coil (1a, 1b) is wound; and a heat dissipation member (3) electrically insulated from and closely attached to an end of the coil (1a, 1b) in a stacking direction, wherein a thermal resistance of one of the conductors (50), disposed at the end in the stacking direction of the coil (1a, 1b), is the lowest compared with the thermal resistances of the other conductors (50).

Abstract: A signal transmission insulating device includes: a first coil; a second coil opposing the first coil to form a transformer together with the first coil; a first insulating film provided between the opposing first coil and second coil and made of a first dielectric material; a second insulating film surrounding the first coil and made of a second dielectric material having a lower resistivity or a higher permittivity than the first dielectric material; and a third insulating film surrounding the second coil and made of a third dielectric material having a lower resistivity or a higher permittivity than the first dielectric material.

Abstract: A semiconductor device with improved heat radiation and improved insulation performance. The semiconductor device includes a semiconductor element, a lead frame bonded on one surface to the semiconductor element, a first insulating layer disposed on the other surface of the lead frame, and a metal base plate connected to the lead frame with the first insulating layer interposed between them, wherein an outer peripheral portion of the first insulating layer is inside an outer peripheral portion of the metal base plate, and the outer peripheral portion of the first insulating layer is covered with a second insulating layer having higher moisture resistance and higher insulation performance than the first insulating layer, the outer peripheral portion including an electric field concentrated point in an outer peripheral portion of the lead frame.

Abstract: A semiconductor device with improved heat radiation and improved insulation performance. The semiconductor device includes a semiconductor element, a lead frame bonded on one surface to the semiconductor element, a first insulating layer disposed on the other surface of the lead frame, and a metal base plate connected to the lead frame with the first insulating layer interposed between them, wherein an outer peripheral portion of the first insulating layer is inside an outer peripheral portion of the metal base plate, and the outer peripheral portion of the first insulating layer is covered with a second insulating layer having higher moisture resistance and higher insulation performance than the first insulating layer, the outer peripheral portion including an electric field concentrated point in an outer peripheral portion of the lead frame.

Abstract: A means of controlling sugar chain-modification and sugar chain structure in the production of a glycoprotein with the use of gene recombination techniques. A process for producing a glycoprotein by culturing a gene recombinant host in a medium characterized in that the relative sugar consumption speed is employed as an indication and changed to thereby modify the sugar chain structure attached to the protein.

Abstract: A means of controlling sugar chain-modification and sugar chain structure in the production of a glycoprotein with the use of gene recombination techniques. A process for producing a glycoprotein by culturing a gene recombinant host in a medium characterized in that the relative sugar consumption speed is employed as an indication and changed to thereby modify the sugar chain structure attached to the protein.

Abstract: Clock supply circuitry comprises a phase-locked loop or PLL frequency multiplier for generating a frequency-multiplied clock signal having a frequency that is an integral multiple of the frequency of an input clock signal. The clock supply circuitry further includes a PLL output stability detecting circuit. When the clocksupply circuitry is made to return from a clock supply stopping state in which the PLL frequency multiplier is stopping the generation of the frequency-multiplied clock signal to a clock supply state in which the PLL frequency multiplier is generating and supplying the frequency-multiplied clock signal to an internal circuit, the PLL output stability detecting circuit determines whether the frequency-multiplied clock signal from the PLL frequency multiplier becomes stable.

Abstract: Clock supply circuitry comprises a phase-locked loop or PLL frequency multiplier for generating a frequency-multiplied clock signal having a frequency that is an integral multiple of the frequency of an input clock signal. The clock supply circuitry further includes a PLL output stability detecting circuit. When the clock supply circuitry is made to return from a clock supply stopping state in which the PLL frequency multiplier is stopping the generation of the frequency-multiplied clock signal to a clock supply state in which the PLL frequency multiplier is generating and supplying the frequency-multiplied clock signal to an internal circuit, the PLL output stability detecting circuit determines whether the frequency-multiplied clock signal from the PLL frequency multiplier becomes stable.