Abstract: The present technology relates to a distance measuring device, a control method thereof, and a distance measuring system capable of arranging sample points of a pixel array so as to obtain more distance information. A distance measuring device includes: a pixel array in which pixels that receive reflected light obtained by reflecting irradiation light from an object are arranged in a matrix; a determination unit that determines some of the pixels of the pixel array as a sample point for detecting distance information; and a storage unit that stores a sample point state table that stores distance information of the sample point and a sample point movement rule table that stores a movement rule of the sample point, in which the determination unit updates position information of the sample point on the basis of the sample point state table and the sample point movement rule table.

Abstract: A temperature control method of controlling a temperature of a semiconductor wafer mounted on a mounting table includes a supply process of supplying, in a state that a supply of a power to a heater configured to heat the mounting table is stopped or the power is maintained to be constant, a heat transfer gas into a gap between the semiconductor wafer and the mounting table; a measurement process of measuring a temperature variation of the mounting table due to heat exchange between the semiconductor wafer and the mounting table through the heat transfer gas; a calculation process of calculating a correction value based on the temperature variation of the mounting table; and a control process of starting the supply of the power and controlling the power such that the temperature of the mounting table reaches a target temperature corrected with the correction value.

Abstract: A substrate processing system includes a stage on which a substrate is placed, a heater configured to heat the substrate by being supplied with power, a power supply part configured to supply power to the heater, a sensor configured to measure a resistance value of the heater, and a controller. The controller is configured to: store a conversion table in which a plurality of resistance values are associated with a plurality of temperatures; and acquire a reference resistance value measured by the sensor when a heater temperature is equal to a reference temperature. The controller is further configured to: acquire a temperature adjustment resistance value measured by the sensor after the substrate is heated by the heater; and control the power supply part based on the conversion table, the reference temperature, the reference resistance value, and the temperature adjustment resistance value.

Abstract: An optical connector assembly includes an optical component assembly, inner and outer optical fibers, a componentry cover, and a connector. The optical component assembly includes an optical unit. The inner and the outer optical fibers are on opposing sides of the optical unit such that the optical unit receives a first optical signal from the inner optical fiber and the outer optical fiber receives a second optical signal from the optical unit or such that the optical unit receives the second optical signal from the outer optical fiber and the inner optical fiber receives the first optical signal from the optical unit. The componentry cover encapsulates an entirety of the optical unit and portions of the inner and the outer optical fibers. The connector includes a portion of first outer optical fiber that is exposed to route the second optical signal.

Abstract: The present invention provides an optical-electrical connector and an optical-electrical module thereof, wherein the optical-electrical module comprises the optical-electrical connector and an optical adapter, and the optical-electrical connector comprises an optical connector module, and an electrical connector module slidably coupled to the optical connector module, wherein when the optical-electrical connector is taken away from the an optical adapter by a pulling force, the electrical connector module is unlocked to slide out of the optical adapter earlier than the optical connector module, and the electrical connector module is driven to unlock the optical connector module to release from the optical adapter.

Abstract: An optical wavelength band to be detected is flexibly changed. An imaging device includes a coded mask including two or more kinds of band bus filters that are arranged in a two-dimensional grating pattern and that transmit light of different wavelength bands, a light receiving unit that receives modulated light modulated by the coded mask and generates observation signal data, and an image reconstruction processing unit that reconstructs the observation signal data generated by the light receiving unit to generate image data.

Abstract: An X-ray tube is provided with: a cathode and an anode sealed inside a vacuum envelope; and an ion-collecting conductor attached to the vacuum envelop so as to be in contact with an internal space of the vacuum envelope. A first current sensor measures a value of a first current flowing between the ion-collecting conductor and a node for supplying potential for attracting positive ions in the vacuum envelope. A second current sensor measures a value of a second current flowing between the anode and the cathode. A control circuit generates diagnostic information on the degree of vacuum of the X-ray tube based on a current ratio file of the first current value (Ii) measured by the first current sensor to the second current value (Ie) measured by the second current sensor.

Abstract: The present invention provides an optical-electrical connector for inserting into an optical adapter, comprising an optical connector module, an electrical connector module, a base, and a sliding cover. The electrical connector module is slidably coupled to the optical connector module and is locked when inserting into the optical adapter. The base comprises a through hole and the electrical connector module is slidable connected to the through hole. The sliding cover is slidably coupled to the base, wherein after the electrical connector module is released from the optical adapter by sliding the sliding cover, the optical connector module is released from the optical adapter.

Abstract: There is provided an image processing apparatus and method capable of suppressing an increase in a processing time for image clustering. Sparse pixels included in an image are clustered, sparse information obtained by this clustering is interpolated by image filtering that uses an image signal as a guide, and thereby a dense clustering result is derived. For example, the sparse information is model coefficients or a clustering result obtained by the clustering. The present disclosure can be applied to, for example, an image processing apparatus, an image processing method, and the like.

Abstract: A port tracer including a housing, a light guiding tunnel, and a light guide cover. The housing has a first side and a second side opposite to each other and a third side connected to the first side and the second side. A first opening and a second opening are located on the first side and the second side respectively. The light guiding tunnel is disposed inside the housing. The light guiding tunnel has a first light entrance-exit and a second entrance-exit that face the first side and the second side respectively. The light guide cover is detachably connected to the first opening. The light guide cover covers the first light entrance-exit. The third side has a third opening. A part of the light guide cover is located inside the housing and opposite to the third opening.

Abstract: Provided are an image processing apparatus, an image processing method, and an image processing program capable of achieving high accuracy in an index representing vegetation. An image processing apparatus (1) includes a normal map generation unit (12) and a reflection characteristic model generation unit (18). The normal map generation unit (12) obtains a normal vector characteristic based on a polarized image acquired. The reflection characteristic model generation unit (18) estimates a reflection characteristic model based on the normal vector characteristic obtained by the normal map generation unit (12).

Abstract: An optical wavelength band to be detected is flexibly changed. An imaging device according to an embodiment includes a coded mask (103) including two or more kinds of band bus filters that are arranged in a two-dimensional grating pattern and that transmit light of different wavelength bands, a light receiving unit (10) that receives modulated light modulated by the coded mask and generates observation signal data, and an image reconstruction processing unit (52) that reconstructs the observation signal data generated by the light receiving unit to generate image data.

Abstract: Provided are an imaging apparatus and an imaging method that make it possible to apply light having an optimum wavelength to capture an image without a user taking heed of a type of an imaging object. A wavelength of light optimum for analysis of a target is specified as an effective wavelength from a multispectral image of the target on which white light is applied, and light of the effective wavelength is applied upon the target. The target in this state is captured as a multispectral image, and the target is analyzed on a basis of a spectral image of an effective wavelength.

Abstract: An X-ray tube is provided with: a cathode and an anode sealed inside a vacuum envelope; and an ion-collecting conductor attached to the vacuum envelop so as to be in contact with an internal space of the vacuum envelope. A first current sensor measures a value of a first current flowing between the ion-collecting conductor and a node for supplying potential for attracting positive ions in the vacuum envelope. A second current sensor measures a value of a second current flowing between the anode and the cathode. A control circuit generates diagnostic information on the degree of vacuum of the X-ray tube based on a current ratio file of the first current value measured by the first current sensor to the second current value measured by the second current sensor.

Abstract: The present technology relates to an optical apparatus and an information processing method capable of more easily obtaining an indicator value. In the optical apparatus according to the present technology, irradiation light including a predetermined irradiation wavelength band is emitted, first reflected light being a reflected light in a first wavelength band obtained by reflection of the emitted irradiation light on a predetermined object and second reflected light being reflected light in a second wavelength band obtained by reflection of the irradiation light on the object are received at a plurality of pixels; and a value of a predetermined indicator relating to a region in a predetermined range of the object is obtained on the basis of a received light amount of each of the received first reflected light and the received second reflected light. For example, the present technology can be applied to optical apparatuses, electronic apparatuses, imaging apparatuses, and information processing apparatuses.

Abstract: A substrate processing system includes a substrate processing apparatus and a control device. The substrate processing apparatus includes a chamber, and a placing table provided inside the chamber. The placing table places a substrate thereon, and includes a base and an electrostatic chuck provided on an upper surface of the base. The electrostatic chuck has a plurality of division regions each provided with a heater therein. The substrate processing system also includes a control device that includes a measuring unit that measures a resistance value of the heater for each of the division regions, an estimating unit that estimates a temperature of each of the division regions based on the resistance value of the heater measured by the measuring unit, and a power controller that controls a power supplied to the heater for each of the division regions based on the temperature estimated by the estimating unit.

Abstract: An optical connector assembly includes an optical component assembly, inner and outer optical fibers, a componentry cover, and a connector. The optical component assembly includes an optical unit. The inner and the outer optical fibers are on opposing sides of the optical unit such that the optical unit receives a first optical signal from the inner optical fiber and the outer optical fiber receives a second optical signal from the optical unit or such that the optical unit receives the second optical signal from the outer optical fiber and the inner optical fiber receives the first optical signal from the optical unit. The componentry cover encapsulates an entirety of the optical unit and portions of the inner and the outer optical fibers. The connector includes a portion of first outer optical fiber that is exposed to route the second optical signal.

Abstract: An optical cable includes an optical component assembly, inner and outer optical fibers, a componentry cover, and a connector. The optical component assembly includes an optical unit. The inner and the outer optical fibers are on opposing sides of the optical unit such that the optical unit receives a first optical signal from the inner optical fiber and the outer optical fiber receives a second optical signal from the optical unit or such that the optical unit receives the second optical signal from the outer optical fiber and the inner optical fiber receives the first optical signal from the optical unit. The componentry cover encapsulates an entirety of the optical unit and portions of the inner and the outer optical fibers. The connector includes a portion of first outer optical fiber that is exposed to route the second optical signal.

Abstract: A temperature control method of controlling a temperature of a semiconductor wafer mounted on a mounting table includes a supply process of supplying, in a state that a supply of a power to a heater configured to heat the mounting table is stopped or the power is maintained to be constant, a heat transfer gas into a gap between the semiconductor wafer and the mounting table; a measurement process of measuring a temperature variation of the mounting table due to heat exchange between the semiconductor wafer and the mounting table through the heat transfer gas; a calculation process of calculating a correction value based on the temperature variation of the mounting table; and a control process of starting the supply of the power and controlling the power such that the temperature of the mounting table reaches a target temperature corrected with the correction value.

Abstract: Provided is an image analysis device, an image analysis method, and an illumination device to efficiently acquire an image to be suitably used to analyze skin. An image acquisition unit is included, the image acquisition unit including an illumination unit including a light emitting unit in which a plurality of light emitting elements including at least a light emitting element that emits visible light and a light emitting element that emits invisible light are packaged, and an image pickup unit that captures an image of reflection light generated by causing irradiation light emitted from the illumination unit to be reflected by an analysis target. The present disclosure is applicable to, for example, a device for analyzing human skin.