Abstract: A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.

Abstract: A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.

Abstract: A printed circuit board unit includes a printed circuit board including through holes arranged in a grid array on which an integrated circuit is mounted; and a flexible substrate provided on a back side of the printed circuit board, covering the through holes. First lands to which the integrated circuit is connected are formed on a front side of the printed circuit board. Second lands to which the flexible substrate is connected are formed on the back side of the printed circuit board. The first lands and the second lands are connected to first ends and second ends of the through holes, respectively. Third lands are formed on a front side of the flexible substrate so as to face the second lands of the printed circuit board. Fourth lands are formed on a back side of the flexible substrate. The fourth lands are electrically connected to the third lands.

Abstract: An electronic component mounting structure includes a first substrate on which a first component is mounted and a second substrate connected to the first substrate. The second substrate is bent toward the first component.

Abstract: In a circuit, as the bridge resistance of one side of a Wheatstone bridge circuit, a distortion gauge (fixed reference resistance) of which variation caused by environmental conditions is suppressed and a sample having a resistance component ?R varied by the environmental conditions are connected in series. A constant bridge input voltage Ei is applied from a constant-voltage power supply to the Wheatstone bridge circuit, a bridge output voltage Eo corresponding to resistance variation of the sample is input to a dynamic distortion amplifier, and a carrier wave signal of a predetermined frequency is output. A measured resistance computing unit samples peak levels of the carrier wave signal output from the dynamic distortion amplifier so as to detect the bridge output voltage Eo, and calculates the resistance of the sample based on the detected bridge output voltage.

Abstract: In a circuit, as the bridge resistance of one side of a Wheatstone bridge circuit, a distortion gauge (fixed reference resistance) of which variation caused by environmental conditions is suppressed and a sample having a resistance component ?R varied by the environmental conditions are connected in series. A constant bridge input voltage Ei is applied from a constant-voltage power supply to the Wheatstone bridge circuit, a bridge output voltage Eo corresponding to resistance variation of the sample is input to a dynamic distortion amplifier, and a carrier wave signal of a predetermined frequency is output. A measured resistance computing unit samples peak levels of the carrier wave signal output from the dynamic distortion amplifier so as to detect the bridge output voltage Eo, and calculates the resistance of the sample based on the detected bridge output voltage.

Abstract: An optical module which can achieve miniaturization, high performance and cost reduction is, provided. The optical module includes a photoelectric component, a high-speed signal processing part which processes a high-speed signal photoelectrically converted by the photoelectric component, and a low-speed signal processing part which processes a low-speed signal. The high-speed signal processing part and the low-speed signal processing part are overlapped with each other in a vertical direction and electrically connected to each other.

Abstract: A heater that attaches an electronic component having a ball grid array structure to and detaches the electronic component from a substrate on which the electronic component operates includes a body fixed onto the electronic component, and a heating element, provided on the body, which heats and melts soldering balls having the ball grid array structure when receiving power supply.

Abstract: An optical module which can achieve miniaturization, high performance and cost reduction is, provided. The optical module includes a photoelectric component, a high-speed signal processing part which processes a high-speed signal photoelectrically converted by the photoelectric component, and a low-speed signal processing part which processes a low-speed signal. The high-speed signal processing part and the low-speed signal processing part are overlapped with each other in a vertical direction and electrically connected to each other.

Abstract: An optical module which can achieve miniaturization, high performance and cost reduction is provided. The optical module includes a photoelectric component, a high-speed signal processing part which processes a high-speed signal photoelectrically converted by the photoelectric component, and a low-speed signal processing part which processes a low-speed signal. The high-speed signal processing part and the low-speed signal processing part are overlapped with each other in a vertical direction and electrically connected to each other.

Abstract: A laminate capacitor circuit board which permits constants of various kinds of circuit elements to be set by selectively effected connections between wiring layers, and a laminate capacitor circuit board which permits distributed circuit constants in a high-frequency wiring layer sandwiched between two shielding wiring layers to be set as desired. These circuits are formed with at least a pattern of a conductive foil on each dielectric layer, and include a plurality of wiring layers laminated one upon another, a wiring layer for connections laminated to a surface of the plurality of wiring layers laminated one upon another, a plurality of terminal patterns formed on the wiring layer for connections in a state insulated from each other, a plurality of vias for electrically connecting at least two of the plurality of terminal patterns to corresponding ones of the plurality of wiring layers, and connecting means for selectively connecting the plurality of terminal patterns to each other.